Minimum pressure drop liquid cooled structure for a semiconductor device

Claim 1

A semiconductor device of the type comprising a semiconductor wafer, at least one substantially circular cooling chamber for cooling one side of the semiconductor wafer by a liquid coolant, said cooling chamber including a relatively thin thermally conductive base wall in thermal contact with said semiconductor wafer, means to supply said liquid coolant to said base wall including a tube having an inner diameter, d 1 , said tube terminating in a substantially circular flange portion having a frustro-conical surface for directing the coolant substantially radially outwardly across the entire base wall surface, said frustro-conical surface having a smaller diameter coincident with the inner diameter, d 1 , of said tube and a larger diameter, d 2 , substantially coincident with the periphery of said flange portion, said flange portion being disposed within said chamber in relatively close proximity to said base wall so that the spacing, s 1 , between the base wall and the frustro-conical surface of said flange at the tube inner diameter, d 1 , and the spacing, s 2 , between the base wall and the frustro-conical surface of said flange at the diameter, d 2 , conform substantially with the expression d.sub.2 /d.sub.1 =s.sub.1 /s.sub.2 thereby providing the minimum pressure drop in said liquid coolant.