Multi-layer printed circuit

Claim 1

A multi-layer printed circuit comprising a first layer having an insulating substrate with a plurality of conductors selectively attached to said substrate, said conductors running substantially in a first direction on the substrate, said plurality of conductors being classified into groups, and at least two of the conductors in each group being connected together at one end, the other end of each conductor in each group extending in a second direction perpendicular to the first direction to provide a bonding portion for the connection with a second layer, the length of said bonding portion in the second direction being longer than the distance between each conductor, the bonding portions of said conductors in each group being aligned with respect to one another such that the other ends of the conductors in each group are arranged on a line oblique to the first and second directions on the first layer, the second layer having a parallelogram-shaped substrate with acute angles formed at diagonally opposite corners thereof, said second layer including a plurality of parallel conductors on the surface of said substrate, one pair of parallel sides of said parallelogram being parallel to the oblique lines of the other ends of the conductors, wherein each conductor on the second layer connects each of the conductors in each group on the first layer to the corresponding conductors in the related group, said conductors of said second layer being connected to said bonding portion of said conductors of said first layer.