Patent US1933377A successfully refreshed from Google Patents.
← Back to Patent Explorer
US4251384A Expired / Lapsed US ⏱️ 0.0 years remaining

Aluminum polishing compositions

Assignee: Solvay Solutions UK Ltd
•
Filing: 1977-10-19
•
Granted: 1981-02-17
•
Expires: 1997-10-19
📄 Original PDF 🌐 Google Patents 🔄 Sync Now

Abstract

Abstract Aluminium polishing solutions containing phosphoric, nitric and sulphuric acids provide etched finishes if the proportion of sulphuric acid is increased. The invention inhibits such etching by addition to the bath of an aromatic ring compound in which at least 2 hetero atoms are conjugated with the ring such as benztriazole.

Inventors

  • 👤 Terence R. Rooney

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-30 19:12
CPC Classifications
C; C23; C23F; C23F3/00; C23F3/02; C23F3/03

Claims Analysis

Total Claims: 10
Claim 1
Independent Claim 161 words
An aluminium polishing solution consisting essentially of (a) phosphoric and sulphuric acid in a relative proportion of from 1:2 to 3:1, phosphoric acid having a specific gravity of 1.75 to 98 percent sulphuric acid and together constituting at least 90 percent of the total composition; (b) nitric acid in a proportion by weight of from 1.2 to 4.2 percent as 100 percent nitric acid; (c) dissolved copper in a concentration of from 0.01 to 0.2 percent by weight; (d) dissolved aluminium in a concentration of between zero and saturation; (e) from 0.05 percent to 0.7 percent by weight of an organic etch inhibitor which is an aromatic organic compound soluble in said solution and having an aromatic 6-member ring selected from the group consisting of benzene, pyridine, pyrazine, benzoquinone, and melamine rings and at least 2 hetero atoms selected from the group consisting of nitrogen, oxygen and sulphur atoms conjugated with said aromatic ring; and (f) the balance substantially of water.
Claim 2
Dependent Claim 161 words
An aluminium polishing solution consisting essentially of (a) phosphoric and sulphuric acid in a relative proportion of from 1:2 to 3:1, phosphoric acid having a specific gravity of 1.75 to 98 percent sulphuric acid and together constituting at least 90 percent of the total composition; (b) nitric acid in a proportion by weight of from 1.2 to 4.2 percent as 100 percent nitric acid; (c) dissolved copper in a concentration of from 0.01 to 0.2 percent by weight; (d) dissolved aluminium in a concentration of between zero and saturation; (e) from 0.05 percent to 0.7 percent by weight of an organic etch inhibitor which is an aromatic organic compound soluble in said solution and having an aromatic 6-member ring selected from the group consisting of benzene, pyridine, pyrazine, benzoquinone, and melamine rings and at least 2 hetero atoms selected from the group consisting of nitrogen, oxygen and sulphur atoms conjugated with said aromatic ring; and (f) the balance substantially of water.
Claim 3
Dependent Claim 43 words
An aluminium polishing solution as claimed in claim 1 wherein the etch inhibitor is selected from the group consisting of hydroxy-, amino-, imino, carboxy, mercapto, nitro-, and alkyl-, substituted benztriazoles wherein said alkyl and alkoxy substituents have from 1 to 20 carbon atoms.
Claim 4
Dependent Claim 51 words
An aluminium polishing solution as claimed in claim 1 wherein the etch inhibitor is selected from unsubstituted and nitro-, hydroxy-, amino-, imino, carboxy, mercapto-, alkyl- and halo, substituted members of the group consisting of benzofuroxan, benzthiadiazole, benzthiazole, benzoxazole, and benzimidazole, wherein said alkyl groups have from 1 to 20 carbon atoms.
Claim 5
Dependent Claim 34 words
An aluminium polishing solution as claimed in claim 1 wherein the etch inhibitor is a substituted benzene having at least 2 substituent groups selected from the group consisting of amino-, nitro-, and hydroxy- groups.
Claim 6
Dependent Claim 28 words
An aluminium polishing solution as claimed in claim 1 wherein the etch inhibitor is selected from the group consisting of ortho and para benzoquinone, and the imines thereof.
Claim 7
Dependent Claim 16 words
An aluminium polishing solution as claimed in claim 1 containing from 0.05 to 0.75 molar ammonia.
Claim 8
Dependent Claim 23 words
An aluminium polishing solution as claimed in claim 1 wherein said proportion of phosphoric acid to sulphuric acid is from 1.2:1 to 1:1.2.
Claim 9
Dependent Claim 44 words
An aluminium polishing solution as claimed in claim 1 wherein the etch inhibitor is an aromatic organic compound soluble in said solution and having an aromatic 6-carbon ring and at least 2 hetero atoms selected from nitrogen oxygen and sulphur conjugated with said ring.
Claim 10
Dependent Claim 33 words
An aluminium polishing solution as claimed in claim 8 wherein the hetero atoms are present in any member of the group selected from amino-, imino-, hydroxy-, and quinone groups and a heterocyclic ring.

References Cited (Backward Citations)

US2694001A Cited
US3425881A Cited
US3876371A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1984-02-17 1984-08-18 1985-02-17 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1988-02-17 1988-08-18 1989-02-17 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1992-02-17 1992-08-18 1993-02-17 $7700.00 Window Closed / Lapsed

Assigned Categories & Tags

No categories assigned to this patent yet.

Assign Category Tag