← Back to Patent Explorer
US4248921A Expired / Lapsed US ⏱️ 0.0 years remaining

Method for the production of electrically conductive and solderable structures and resulting articles

Assignee: Individual
•
Filing: 1978-06-23
•
Granted: 1981-02-03
•
Expires: 1998-06-23
📄 Original PDF 🌐 Google Patents 🔄 Sync Now

Abstract

Abstract Method for producing an electrically conductive and solderable structure along with the resulting article are disclosed. The method comprises admixing metal particles, metal salts and an organic polymer binder as a paste which is applied to a non-conductive substrate by printing or the like. The paste is heated to permit metal salts to migrate to the surface of the binder where they become concentrated. During metallizing the salts are removed by the bath and metal is deposited in pores formed in the binder by the dissolved salts. The metal layer is adherent to the binder and provides good solderable points.

Inventors

  • 👤 Wolf-Erhard Steigerwald
  • 👤 Peter Ambros
  • 👤 Erich Gatzke

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-05 09:32
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/22; H05K3/24; H05K3/245; H05K3/246; B; B23; B23K; B23K35/00; B23K35/001; H05K1/00; H05K1/02; H05K1/09; H05K1/092; H05K1/095; H05K2201/00; H05K2201/03; H05K2201/0332; H05K2201/0335; H05K2201/0347; Y; Y10; Y10T; Y10T428/00; Y10T428/12; Y10T428/12014; Y10T428/12028; Y10T428/12049; Y10T428/12063; Y10T428/12069; Y10T428/12076; Y10T428/12104; Y10T428/12111; Y10T428/24; Y10T428/24355; Y10T428/24372; Y10T428/24413; Y10T428/25; Y10T428/256

Claims Analysis

Total Claims: 23
Claim 1
Independent Claim 146 words
Method for the production of electrically conductive and solderable structures located in selected surface patterns on a non-conductive substrate, comprising the steps of applying at least one side of said non-conductive substrate a paste, comprising an organic polymer binder admixed with metal particles for providing electrical conductivity to the structure, metal salt particles, and a wetting agent in an amount which is effective for floating the metal salt particles to the surface of the structure, heating said paste and concentrating the metal salt particles at the exposed surface of the binder before it is cured, forming cavern-like pores on the surfaces of the cured binder by dissolving the metal salt particles thereon in a metallizing bath to obtain the cavern-like pores, and depositing a metal layer by galvanic or autocatalytic separation onto the porous surface to firmly connect the deposited layer with the underlying conductive structure.
Claim 2
Dependent Claim 146 words
Method for the production of electrically conductive and solderable structures located in selected surface patterns on a non-conductive substrate, comprising the steps of applying at least one side of said non-conductive substrate a paste, comprising an organic polymer binder admixed with metal particles for providing electrical conductivity to the structure, metal salt particles, and a wetting agent in an amount which is effective for floating the metal salt particles to the surface of the structure, heating said paste and concentrating the metal salt particles at the exposed surface of the binder before it is cured, forming cavern-like pores on the surfaces of the cured binder by dissolving the metal salt particles thereon in a metallizing bath to obtain the cavern-like pores, and depositing a metal layer by galvanic or autocatalytic separation onto the porous surface to firmly connect the deposited layer with the underlying conductive structure.
Claim 3
Dependent Claim 22 words
The method according to claim 1, wherein the electrically-conductive structures are located on the inner surfaces of openings arranged in the substrate.
Claim 4
Dependent Claim 51 words
The method according to claim 1, in that the electrically-conductive structures are located on both sides of a non-conductive substrate and are in electrical communication with each other by means of openings arranged in the substrate, which are completely or partially filled with the material which forms the electrically conductive structures.
Claim 5
Dependent Claim 37 words
The method according to claim 1, wherein the electrically conductive structures are arranged in sandwich-like fashion in several planes separated by insulating layers, and are electrically connected with each other via open regions of the insulating layer.
Claim 6
Dependent Claim 28 words
The method according to claim 1 wherein the organic polymer binder is a system based on a caprolactam-blocked adduct of isophorondiisocyanate and an oxyester of the hydroxyl group.
Claim 7
Dependent Claim 25 words
The method according to claim 1 wherein the organic polymer is a mixture of caprolactam-blocked polyurethane with silicone resins and/or acetal resins and/or vinyl chloride-vinylacetate-copolymerisates.
Claim 8
Dependent Claim 38 words
The method according to claim 1 wherein the particles effecting the electrical conductivity of the structure are metal particles of silver, gold, nickel, particles from the platinum group metals, silver or gold coated copper particles or mixtures thereof.
Claim 9
Dependent Claim 20 words
The method according to claim 7 wherein the metal particles are formed as platelets or microscopic crystals and mixtures thereof.
Claim 10
Dependent Claim 25 words
The method according to claim 7, wherein the weight ratio of the metal particles to the organic polymer is at least about 1:1 to 6:1.
Claim 11
Dependent Claim 52 words
The method according to claim 1, wherein the metal salts admixed with the organic polymer binder is selected from the group consisting of copper (II) sulfate, copper (I) chloride, copper (II) formiate, copper (II) acetate, sodium chloride, sodium sulfite, lithium chloride, sodium carbonate, silver chloride, silver sulfate, silver nitrate and mixtures thereof.
Claim 12
Dependent Claim 24 words
The method according to claim 1 wherein the metal salts comprise up to about 30% by weight of the particles effecting the electrical conductivity.
Claim 13
Dependent Claim 27 words
The method according to claim 1, wherein the wetting agent which effects the floating effect of the metal salts is a non-ionic or anionic active wetting agent.
Claim 14
Dependent Claim 24 words
The method according to claim 12, wherein the wetting agent is added to the organic polymer in an amount up to 3% by weight.
Claim 15
Dependent Claim 18 words
The method according to claim 1, wherein the paste is applied to the non-conductive substrate by screen printing.
Claim 16
Dependent Claim 25 words
The method according to claim 1, wherein the galvanic or autocatalytically deposited metal layer is taken from the group consisting of silver, copper or tin.
Claim 17
Dependent Claim 21 words
The method according to claim 1 wherein the deposited metal layer is copper which is covered with a second metal layer.
Claim 18
Dependent Claim 26 words
The method according to claim 1, wherein the non-conductive substrate is hard paper, temperature resistant plastic, ceramic material or a metallic material having non-conductive outer coating.
Claim 19
Dependent Claim 12 words
The method according to claim 1, wherein the non-conductive substrate is flexible.
Claim 20
Dependent Claim 24 words
The method according to claim 10 wherein the metal salts comprise up to about 30% by weight of the particles effecting the electrical conductivity.
Claim 21
Dependent Claim 21 words
The method according to claim 15 wherein said metal layer is covered with a second metal layer of a noble metal.
Claim 22
Dependent Claim 20 words
The method according to claim 16 wherein said metal layer is covered with a second metal layer of noble metal.
Claim 23
Dependent Claim 11 words
A printed circuit board structure made in accordance with claim 1.

References Cited (Backward Citations)

US2748701A Cited
US3031344A Cited
US3014818A Cited
US3245833A Cited
US3488166A Cited
US3546011A Cited
US3847649A Cited
US4059710A Cited
US4150177A Cited
US4113899A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1984-02-03 1984-08-04 1985-02-03 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1988-02-03 1988-08-04 1989-02-03 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1992-02-03 1992-08-04 1993-02-03 $7700.00 Window Closed / Lapsed

Assigned Categories & Tags

No categories assigned to this patent yet.

Assign Category Tag