US4242181A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Copper plating process for printed circuit boards
Assignee: M&T HARSHAW
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Filing: 1979-11-09
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Granted: 1980-12-30
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Expires: 1999-11-09
Abstract
Abstract Printed circuit boards are plated with a high acid-low copper sulfate bath which uses a grain refining agent comprising the extract of regular coffee added in an amount of between 0.1 and 1.0 g/l of bath solution. The bath is operated at a plating current density of between 15 and 60 asf and a bath temperature in the range of 20° to 40° C.
Inventors
- 👤 Thomas P. Malak
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-30 19:34
CPC Classifications
C; C25; C25D; C25D3/00; C25D3/02; C25D3/38
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
100 words
The method of electroplating printed circuit boards and other non-metallic substrates with a layer of copper possessing desirable elongation and tensile strength properties comprising (a) Preparing a bath containing between 70 and 150 g/l of CuSO 4 .5H 2 O and 175-300 g/l free H 2 SO 4 to which is added between 0.1 and 1.0 g/l of the extract of regular coffee, and (b) Electrodepositing a layer of copper on said substrate from the bath at a current density of between 15 and 60 amps per square foot and at a bath temperature of between 20° and 40° C.
Claim 2
Independent Claim
100 words
The method of electroplating printed circuit boards and other non-metallic substrates with a layer of copper possessing desirable elongation and tensile strength properties comprising (a) Preparing a bath containing between 70 and 150 g/l of CuSO 4 .5H 2 O and 175-300 g/l free H 2 SO 4 to which is added between 0.1 and 1.0 g/l of the extract of regular coffee, and (b) Electrodepositing a layer of copper on said substrate from the bath at a current density of between 15 and 60 amps per square foot and at a bath temperature of between 20° and 40° C.
Claim 3
Dependent Claim
35 words
The method according to claim 1 wherein the plating bath also contains between 1 and 10 cc per liter of H 3 PO 4 and between 10 and 250 parts per million of chloride ion.
Claim 4
Dependent Claim
22 words
The method of claim 1 in which the coffee is added as an aqueous concentration of 15-20 g of extract per liter.
Claim 5
Independent Claim
42 words
The method of improving the grain refinement of an electroplating bath composed of 70-150 g/l of CuSO 4 .5H 2 O and 175-300 g/l H 2 SO 4 comprising adding thereto between 0.1 and 1.0 g/l of the extract of regular coffee.
Claim 6
Independent Claim
42 words
The method of improving the grain refinement of an electroplating bath composed of 70-150 g/l of CuSO 4 .5H 2 O and 175-300 g/l H 2 SO 4 comprising adding thereto between 0.1 and 1.0 g/l of the extract of regular coffee.
References Cited (Backward Citations)
US3769179A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1983-12-30 | 1984-06-30 | 1984-12-30 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1987-12-30 | 1988-06-30 | 1988-12-30 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1991-12-30 | 1992-06-30 | 1992-12-30 | $7700.00 | Window Closed / Lapsed |