Illumination system for specimen

Claim 2

An illumination system for illuminating a specimen the surface of which is substantially flat and has a substantially mirror portion and coarse portions and which is to be observed by means of a microscope with an optical axis inclined to the surface of the specimen, the system comprising: light projecting means for projecting a bundle of light rays; a light diffusion plate disposed close to the specimen for converting the bundle of light rays from the light projecting means into diffused light and projecting the diffused light onto the specimen; and specimen holding means for holding the specimen at such a position that most light rays reflected from the mirror portion of the specimen are directed outside an objective lens of the microscope and outside the illumination system and light rays scattered from the coarse portions of the specimen are projected onto the objective lens of the microscope.

Claim 3

An illumination system for specimen according to claim 1, in which said light diffusion plate is a light reflecting diffusion plate for reflecting in scattered fashion the bundle of light rays given from said light projecting means, and said light emitting means is disposed directed toward said light reflecting diffusion plate with the bundle of light rays incident upon said light reflecting diffusion plate.

Claim 4

An illumination system for specimen according to claim 2, further including a shield means disposed between the specimen and said light projecting means to prevent direct projection of the light rays from said light projecting means to the specimen.

Claim 5

An illumination system for specimen according to claim 1, in which said light projecting means is disposed directed toward said specimen with the bundle of light rays incident upon the specimen, and said light diffusion plate is a light reflecting plate for diffusing a bundle of light rays from said light projecting means, and the light reflecting plate is disposed at the regular reflecting position of said light projecting means with respect to the specimen for converting the light rays regularly reflected by the specimen into scattered light in turn to be directed to the specimen.

Claim 6

An illumination system for specimen according to claim 1, in which said light diffusion plate is a transmitting diffusion plate permitting a bundle of light rays emitted from said light emitting means to pass therethrough in scattered fashion.

Claim 7

An illumination system for specimen according to claim 5, further including optical fiber disposed between said light projecting means and said light transmitting diffusion plate, for guiding a bundle of light rays from said light emitting means into said light transmitting diffusion plate.

Claim 8

An illumination system for specimen according to claim 1, in which said light projecting means further includes a condenser lens for converting said bundle of light rays from said light projecting means into a convergent bundle of rays.

Claim 9

An illumination system for specimen according to claim 1, in which said light projecting means further includes a condenser lens for converting said bundle of light from said light emitting means into a parallel bundle of rays.

Claim 10

An illumination system according to claim 1, wherein said specimen is an IC chip.

Claim 11

A bonding machine for connecting pattern pads of an IC chip having a substantially mirror surface portion and coarse surface portions to external lead wires of an IC chip mounting frame, using bonding wires, the machine comprising: a capillary under which the IC chip is placed and the tip of which is movable between the pattern pads of the IC chip and the external lead wires of an IC chip mounting frame and provided with a welding metal ball to be bonded to the pattern pads and the external lead wires; means for supplying said capillary with a metal wire; a heater for heating the metal wire supplied to the tip of said capillary to provide a welding metal ball; a microscope so positioned as to have its optical axis inclined to the surface of the IC chip; an illumination apparatus for illuminating the IC chip, including light projecting means for projecting a bundle of light rays and a light diffusion plate disposed close to the IC chip for converting the bundle of light rays from the light projecting means into diffused light and projecting the diffused light onto the IC chip; and means for guiding the IC chip mounting frame with a number of IC chips mounted and placing one of IC chips at such a predetermined position under said capillary that most light rays reflected from the mirror portion of the IC chip are directed outside an objective lens of said microscope and light rays scattered from the coarse surface portions of the IC chip are projected onto the objective lens of the microscope.

Claim 12

A bonding machine for connecting pattern pads of an IC chip having a substantially mirror surface portion and coarse surface portions to external lead wires of an IC chip mounting frame, using bonding wires, the machine comprising: a capillary under which the IC chip is placed and the tip of which is movable between the pattern pads of the IC chip and the external lead wires of an IC chip mounting frame and provided with a welding metal ball to be bonded to the pattern pads and the external lead wires; means for supplying said capillary with a metal wire; a heater for heating the metal wire supplied to the tip of said capillary to provide a welding metal ball; a microscope so positioned as to have its optical axis inclined to the surface of the IC chip; an illumination apparatus for illuminating the IC chip, including light projecting means for projecting a bundle of light rays and a light diffusion plate disposed close to the IC chip for converting the bundle of light rays from the light projecting means into diffused light and projecting the diffused light onto the IC chip; and means for guiding the IC chip mounting frame with a number of IC chips mounted and placing one of IC chips at such a predetermined position under said capillary that most light rays reflected from the mirror portion of the IC chip are directed outside an objective lens of said microscope and light rays scattered from the coarse surface portions of the IC chip are projected onto the objective lens of the microscope.

Claim 13

A bonding machine according to claim 10, further including a TV camera for converting the image of the IC chip formed by said microscope into an electric video signal.