Electronic apparatus cabinet assembly

Claim 1

A cabinet assembly for housing electronic apparatus comprising: a generally U-shaped structure having a pair of opposed side walls and an end wall extending transversely therebetween, said walls coooprating for defining top and bottom ends of predetermined configuration and dimensions; a deck member secured between said side and end walls near the bottom end of said structure for supporting an item of electronic apparatus thereon; a lid member having a configuration substantially conforming to said predetermined configuration and having dimensions slightly less than said predetermined dimensions; a mounting rail extending interiorly about said side and end walls near the top end of said structure and adapted for supporting said lid member; means forcing said lid member into compression against said mounting rail; and a strip of RFI sealing material disposed between said mounting rail and said lid member and extending upwards from the interstice formed between said walls and lid member onto the top surface of said lid and the exterior surfaces of said walls for forming an RFI seal of high integrity.

Claim 6

A method of forming a joint having high integrity RFI sealing characteristics comprising the steps of: providing first and second conductive plates each having an interior and an exterior surface, said interior surface of said first plate having a flange extending transversely therefrom and near a free end thereof; disposing a flexible RFI sealing material overlying said flange; disposing said interior surface of said second plate overlying said sealing material and flange and slightly offset from said interior side of said first plate; and compressing said second plate against said sealing material and flange, whereby at least some of said sealing material is forced upward from the interstice between said first and second plates onto the exterior surfaces of said first and second plates forming a joint having a high integrity RFI seal.

Claim 7

A method of forming a joint having high integrity RFI sealing characteristics comprising the steps of: providing first and second conductive plates each having an interior and an exterior surface, said interior surface of said first plate having a flange extending transversely therefrom and near a free end thereof; disposing a flexible RFI sealing material overlying said flange; disposing said interior surface of said second plate overlying said sealing material and flange and slightly offset from said interior side of said first plate; and compressing said second plate against said sealing material and flange, whereby at least some of said sealing material is forced upward from the interstice between said first and second plates onto the exterior surfaces of said first and second plates forming a joint having a high integrity RFI seal.