Method for manufacturing a heat transfer assembly

Claim 1

In the method for manufacturing a heat transfer assembly comprising the steps of: (a) forming a plurality of fin strips, each of said fin strips being made from a unitary strip of metal folded back and forth to form a plurality of fin elements each having an essentially planar member between the fold edges; (b) forming a plurality of substantially flat-sided metal tubes, said tubes being seamless or having seams that are welded or otherwise sealed; (c) cleaning said fin strips and said tubes with flux to remove surface oxidation and contaminants therefrom; (d) forming a heat transfer assembly by the assembly of a plurality of said fin strip and tubes, at least one flat side of each of said tubes being in conductive heat transfer contact with a plurality of the fold edges of at least one of said fin strips through solder joints made at the locations of said conductive heat transfer contact, said solder joints being made by the application of solder to selected components in said heat transfer assembly and by the application thereafter to said heat transfer assembly of heat and temperature sufficient to cause said solder to flow, thereby, to join said selected components to other components in said heat transfer assembly; wherein the improvement comprises: (e) prior to the assembly of said fin strips and tubes, applying solder as a bead extending along a majority of the length of said fold edges of said fin strips, the solder bead on the fold edges being applied to said fold edges by causing said fin strips to pass through liquid solder which thereafter solidifies on said fold edges as beads, the liquid solder being in a vessel, the surface of the liquid solder having a standing wave generated therein whereby a solder peak is formed, the metal from which said fin strips are formed, after being folded back and forth to form said fold edges, having said fold edges pass through the solder peak in said vessel; and (f) said heat and temperature thereafter applied to said heat transfer assembly causing solder to flow from said fold edges to said tubes, thereby, to form said solder joints made at locations of said conductive heat transfer contact.