US4231916A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Potting and encapsulating material for electronic circuits
Assignee: Motorola Solutions Inc
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Filing: 1979-10-16
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Granted: 1980-11-04
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Expires: 1999-10-16
Abstract
Abstract A homogeneous mixture of uncured thermosetting resin and curing agent in a flowable powder form with a particle size in the range of approximately 60 mesh to 200 mesh and curable in a range of approximately 125° F. to 212° F., and hollow microspheres having a diameter in the range of approximately 5 microns to 300 microns, with the resin-curing agent and microspheres being intermixed in a ratio in the range of approximately 35 percent to 45 percent resin-curing agent to microspheres by weight.
Inventors
- 👤 Thomas A. Knappenberger
- 👤 James F. Landers, Jr.
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 15:23
CPC Classifications
C; C08; C08J; C08J9/00; C08J9/32; H; H05; H05K; H05K3/00; H05K3/22; H05K3/28; H05K3/284; H10; H10W; H10W74/00; H10W74/01
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
106 words
Potting and encapsulating material for electronic circuits utilized in high acceleration and high thermal cycling environments consisting essentially of an intermixed compound of uncured thermosetting resin and curing agent in a flowable powder form with a particle size in the range of approximately 60 mesh to 200 mesh and curable in a range of approximately 125° F. to 212° F. at approximately ambient pressure, and hollow microspheres having a diameter in the range of approximately 5 microns to 300 microns said resin-curing agent and microspheres being intermixed in a ratio in the range of approximately 35 percent to 45 percent resin-curing agent to microspheres by weight.
Claim 2
Dependent Claim
106 words
Potting and encapsulating material for electronic circuits utilized in high acceleration and high thermal cycling environments consisting essentially of an intermixed compound of uncured thermosetting resin and curing agent in a flowable powder form with a particle size in the range of approximately 60 mesh to 200 mesh and curable in a range of approximately 125° F. to 212° F. at approximately ambient pressure, and hollow microspheres having a diameter in the range of approximately 5 microns to 300 microns said resin-curing agent and microspheres being intermixed in a ratio in the range of approximately 35 percent to 45 percent resin-curing agent to microspheres by weight.
Claim 3
Dependent Claim
26 words
Potting and encapsulating material as claimed in claim 1 wherein the microspheres have a wall thickness in the range of approximately 1 micron to 6 microns.
Claim 4
Dependent Claim
20 words
Potting and encapsulating material as claimed in claim 1 wherein the resin utilized includes diglycidyl ether of bis phenol A.
Claim 5
Dependent Claim
17 words
Potting and encapsulating material as claimed in claim 3 wherein the curing agent utilized includes 2-phenyl imidazole.
Claim 6
Dependent Claim
16 words
Potting and encapsulating material as claimed in claim 1 wherein the microspheres are made of glass.
Claim 7
Dependent Claim
44 words
Potting and encapsulating material as claimed in claim 1 wherein the resin and curing agent used produces, in a vacuum of less than 10 -5 Torr, outgassing of a maximum of 0.1 percent volatile condensible materials and a maximum of 1.0 percent weight loss.
Claim 8
Dependent Claim
118 words
Potting and encapsulating material for electronic circuits utilized in high acceleration and high thermal cycling environments consisting essentially of an intermixed compound of uncured thermosetting resin and curing agent in a flowable powder form with a particle size in the range of approximately 60 mesh to 200 mesh and curable in a range of approximately 125° F. to 212° F. at approximately ambient pressure, and hollow microspheres having a diameter in the range of approximately 5 microns to 300 microns, said resin-curing agent and microspheres being intermixed in a ratio such that the embedment stress of the cured material is under approximately 400 PSI at minus 30° F. and is under approximately 10 PSI at the cure temperature.
Claim 9
Dependent Claim
118 words
Potting and encapsulating material for electronic circuits utilized in high acceleration and high thermal cycling environments consisting essentially of an intermixed compound of uncured thermosetting resin and curing agent in a flowable powder form with a particle size in the range of approximately 60 mesh to 200 mesh and curable in a range of approximately 125° F. to 212° F. at approximately ambient pressure, and hollow microspheres having a diameter in the range of approximately 5 microns to 300 microns, said resin-curing agent and microspheres being intermixed in a ratio such that the embedment stress of the cured material is under approximately 400 PSI at minus 30° F. and is under approximately 10 PSI at the cure temperature.
Claim 10
Dependent Claim
122 words
Potting and encapsulating material for electronic circuits utilized in high acceleration and high thermal cycling environments consisting essentially of an intermixed compound of uncured thermosetting resin and curing agent in a flowable powder form with a particle size in the range of approximately 60 mesh to 200 mesh and curable in a range of approximately 125° F. to 212° F. at approximately ambient pressure, and hollow microspheres having a diameter in the range of approximately 5 microns to 300 microns, said resin-curing agent and microspheres being intermixed in a ratio such that the modulus of elasticity in compression is less than approximately 5000 PSI (5 PSI of stress for deflections in the range of 0 to 0.001 inches per inch of material).
Claim 11
Dependent Claim
122 words
Potting and encapsulating material for electronic circuits utilized in high acceleration and high thermal cycling environments consisting essentially of an intermixed compound of uncured thermosetting resin and curing agent in a flowable powder form with a particle size in the range of approximately 60 mesh to 200 mesh and curable in a range of approximately 125° F. to 212° F. at approximately ambient pressure, and hollow microspheres having a diameter in the range of approximately 5 microns to 300 microns, said resin-curing agent and microspheres being intermixed in a ratio such that the modulus of elasticity in compression is less than approximately 5000 PSI (5 PSI of stress for deflections in the range of 0 to 0.001 inches per inch of material).
Claim 12
Independent Claim
124 words
A method of producing potting and encapsulating material having predetermined physical characteristics comprising the steps of: (a) selecting an uncured compound of theremosetting resin and curing agent in a flowable powder form with a particle size in the range of approximately 60 mesh to 200 mesh and curable in a temperature range of approximately 125° F. to 212° F. at approximately ambient pressure. (b) selecting a quantity of hollow microspheres having a diameter in the range of approximately 5 microns to 300 microns; and (c) mixing said compound and said microspheres into a substantially homogeneous mixture consisting essentially of said compound and said microspheres in a predetermined ratio in the range of approximately 35 percent to 45 percent resin-curing agent to microspheres by weight.
Claim 13
Independent Claim
124 words
A method of producing potting and encapsulating material having predetermined physical characteristics comprising the steps of: (a) selecting an uncured compound of theremosetting resin and curing agent in a flowable powder form with a particle size in the range of approximately 60 mesh to 200 mesh and curable in a temperature range of approximately 125° F. to 212° F. at approximately ambient pressure. (b) selecting a quantity of hollow microspheres having a diameter in the range of approximately 5 microns to 300 microns; and (c) mixing said compound and said microspheres into a substantially homogeneous mixture consisting essentially of said compound and said microspheres in a predetermined ratio in the range of approximately 35 percent to 45 percent resin-curing agent to microspheres by weight.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1983-11-04 | 1984-05-05 | 1984-11-04 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1987-11-04 | 1988-05-05 | 1988-11-04 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1991-11-04 | 1992-05-05 | 1992-11-04 | $7700.00 | Window Closed / Lapsed |