Low temperature heat-sealable bi-axially oriented polypropylene composite film and process for production thereof

Claim 2

A low temperature heat-sealable bi-axially oriented polypropylene composite film which comprises: (a) a substrate layer comprising a bi-axially oriented polypropylene film; (b) a uni-axially or bi-axially oriented lamination layer or layers comprising ethylene-butene copolymer or a resin mixture comprising ethylene-butene copolymer laminated on at least one surface of said substrate layer; and (c) a uni-axially or bi-axially oriented extremely thin continuous layer of a primary higher fatty acid amide or an N-substituted higher fatty acid amide formed through the sequential coating and orientating on at least one of the outer surfaces of the composite film.

Claim 3

The composite film of claim 1 characterized in that said composite film is a two-ply laminated film having a lamination layer on only one surface of a substrate polypropylene layer, said two-ply laminated layer being in a total thickness between about 10 and 100 microns, said one laminated layer being between about 0.5 and 10 microns, the polypropylene substrate layer occupying at least 50% of the total thickness of the composite film, the thickness of said extremely thin continuous layer of amide being between about 0.1 and 0.01 micron or less.

Claim 4

The composite film of claim 2 characterized in that the total thickness of the composite film is between about 15 and 60 microns and the thickness of the lamination layer is between about 1.0 and 6.0 microns.

Claim 5

The composite film of claim 1 characterized in that said composite film is a three-ply laminated film having lamination layers on both surfaces of a substrate polypropylene layer, the total thickness of said three-ply laminated layer being between about 10 and 100 microns, each of said two lamination layers being between about 0.5 and 10 microns, the polypropylene substrate layer occupying at least 50% of the total thickness of the composite film, the thickness of said extremely thin continuous layer of amide being between about 0.1 and 0.01 micron or less.

Claim 6

The composite film of claim 4 characterized in that the total thickness of the composite film is between about 15 and 60 microns and the thickness of each of said lamination layers is between about 0.8 and 4 microns.

Claim 7

The composite film of claim 1 wherein the heat sealing strength obtained by sealing at 95° C. is between 600 and 800 g/25 mm or higher, the coefficients of both static and kinetic frictions are between 0.05 and 0.20, the blocking strength is 0.10 Kg/15 cm2, no blocking occurs even after 1 month storage either in the state of roll or stacked sheets of film, and the scratch resistance in terms of the change of haze is between 3.0% and 10%.

Claim 8

The composite film of claim 1 wherein the amide coated on the surface of the film is a fatty acid amide having the generic formula: RCONH 2 , wherein R represents C n H 2n+1 wherein n is an integer of 13-21, said fatty acid amide having an iodine value of 90 or less, a melting point of 50°-120° C., and the number of carbon atoms is from 14-22, and the molecular weight is from 200-340.

Claim 9

The composite film of claim 1 wherein the amide coated on the surface of the film is an N,N'-methylene-bis-amide or an N,N'-ethylene-bis-amide having the generic formula of (R'CONH) 2 CH 2 or (R'CONH) 2 C 2 H 4 , wherein R' represents C n H 2n+1 , wherein n is an integer of 9-21, said amides having a melting point of 118°-160° C., and the number of carbon atoms is from 21-46, and the molecular weight is from 350-690.

Claim 10

A process for the production of low temperature heat-sealable bi-axially oriented polypropylene composite film comprising the steps of laminating ethylene-butene copolymer or a resin mixture comprising ethylene-butene copolymer on at least one surface of a substrate sheet of non-oriented or uni-axially oriented polypropylene to form a corresponding non-oriented or uni-axially oriented composite film, coating on at least one of the outer surfaces of said composite film a solution of a primary higher fatty acid amide or an N-substituted higher fatty acid amide, and then when said coated composite film is non-oriented, bi-axially stretching, heating at a temperature between 130° C. and 180° C. and orienting said non-oriented composite films, and when said coated composite film is uni-axially oriented, stretching, heating at a temperature between 130° C. and 180° C. and orienting said composite film containing the uni-axially oriented polypropylene substrate film in the direction perpendicular to the direction in which said substrate polypropylene film has been oriented, whereby said bi-axially oriented polypropylene composite film having a very thin adherent layer of said amide on at least one surface is produced.

Claim 11

A process for the production of low temperature heat-sealable bi-axially oriented polypropylene composite film comprising the steps of laminating ethylene-butene copolymer or a resin mixture comprising ethylene-butene copolymer on at least one surface of a substrate sheet of non-oriented or uni-axially oriented polypropylene to form a corresponding non-oriented or uni-axially oriented composite film, coating on at least one of the outer surfaces of said composite film a solution of a primary higher fatty acid amide or an N-substituted higher fatty acid amide, and then when said coated composite film is non-oriented, bi-axially stretching, heating at a temperature between 130° C. and 180° C. and orienting said non-oriented composite films, and when said coated composite film is uni-axially oriented, stretching, heating at a temperature between 130° C. and 180° C. and orienting said composite film containing the uni-axially oriented polypropylene substrate film in the direction perpendicular to the direction in which said substrate polypropylene film has been oriented, whereby said bi-axially oriented polypropylene composite film having a very thin adherent layer of said amide on at least one surface is produced.

Claim 12

The composite film prepared by the process of claim 9.

Claim 13

The process of claim 9 wherein the amount of the primary higher fatty acid amide or the N-substituted higher fatty acid amide coated on coated surface of the composite film before the final orientating of the laminated film is within the range of 0.1-7.0 g/m 2 on a bone dry weight basis.

Claim 14

The composite film prepared by the process of claim 11.

Claim 15

The process of claim 11 wherein as an amide for coating on the surface of the film at least one member is selected from the group consisting of erucic amide, stearic amide and N,N'-ethylene-bis-stearic amide.

Claim 16

The composite film prepared by the process of claim 13.

Claim 17

The process of claim 9 wherein the amount of the primary higher fatty acid amide or the N-substituted higher fatty acid amide coated on coated surface after coating and before orientating is within the range of 0.3-5.0 g/m 2 on a bone dry basis.

Claim 18

The composite film prepared by the process of claim 15.

Claim 19

The process of claim 15 wherein as an amide for coating on the surface of the film at least one member is selected from the group consisting of erucic amide, stearic amide and N,N'-ethylene-bis-stearic amide.

Claim 20

The composite film prepared by the process of claim 17.

Claim 21

The process of claim 9 wherein the amide coated on the surface of the film is a fatty acid amide having the generic formula: RCONH 2 , wherein R represents C n H 2n+1 wherein n is an integer of 13-21, said fatty acid amide having an iodine value of 90 or less, a melting point of 50°-120° C., and the number of carbon atoms is from 14-22, and the molecular weight is from 200-340.

Claim 22

The composite film prepared by the process of claim 19.

Claim 23

The process of claim 9 wherein the amide coated on the surface of the film is an N,N'-methylene-bis-amide or an N,N'-ethylene-bis-amide having the generic formual of (R'CONH) 2 CH 2 or (R'CONH) 2 C 2 H 4 wherein R' represents C n H 2n+1 wherein n is an integer of 9-21, said amides having a melting point of 118°-160° C., and the number of carbon atoms is from 21-46, and the molecular weight is from 350-690.

Claim 24

The composite film prepared by the process of claim 21.

Claim 25

The process of claim 9 wherein as an amide for coating on the surface of the film at least one member is selected from the group consisting of erucic amide, stearic amide and N,N'-ethylene-bis-stearic amide.

Claim 26

The composite film prepared by the process of claim 23.