US4224115A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Process for forming electrode on semiconductor device
Assignee: Mitsubishi Electric Corp
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Filing: 1978-06-26
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Granted: 1980-09-23
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Expires: 1998-06-26
Abstract
Abstract Semiconductor substrates electroplated with nickel-palladium alloy consisting of above 50 to 80 atomic percent nickel and below 50 to 20 atomic percent palladium exhibit excellent thermal stability.
Inventors
- 👤 Aiichiro Nara
- 👤 Hisao Kondo
- 👤 Takeji Fujiwara
- 👤 Hideaki Ikegawa
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-30 14:56
CPC Classifications
H; H10; H10P; H10P14/00; H10P14/40; H10P14/46; H10P14/47
Claims Analysis
Total Claims: 4
Claim 1
Independent Claim
79 words
A process for forming a Schottky barrier semiconductor device comprising the steps of: (a) preparing an electroplating solution containing nickel and palladium, the pH of said solution being between 7.8 and 8.5; (b) contacting said electroplating solution with a semiconductor substrate under electroplating conditions to form electrode of nickel-palladium alloy on said semiconductor, said alloy consisting of 55 to 70 atomic percent nickel and 45 to 30 atomic percent palladium, said alloy and said semiconductor forming a Schottky barrier.
Claim 2
Dependent Claim
79 words
A process for forming a Schottky barrier semiconductor device comprising the steps of: (a) preparing an electroplating solution containing nickel and palladium, the pH of said solution being between 7.8 and 8.5; (b) contacting said electroplating solution with a semiconductor substrate under electroplating conditions to form electrode of nickel-palladium alloy on said semiconductor, said alloy consisting of 55 to 70 atomic percent nickel and 45 to 30 atomic percent palladium, said alloy and said semiconductor forming a Schottky barrier.
Claim 3
Dependent Claim
20 words
The process according to claim 1 wherein said alloy consists of 57 atomic percent nickel and 43 atomic percent palladium.
Claim 4
Dependent Claim
24 words
The process according to claim 1 wherein the nickel and palladium concentration of said electroplating solution is from 5 to 30 grams per liter.
References Cited (Backward Citations)
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US3677909A
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US3636417A
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US3699408A
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US3932880A
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1983-09-23 | 1984-03-24 | 1984-09-23 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1987-09-23 | 1988-03-24 | 1988-09-23 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1991-09-23 | 1992-03-24 | 1992-09-23 | $7700.00 | Window Closed / Lapsed |