Method for skin packaging using platen forming of the film, and packages produced thereby

Claim 2

In a method for encasing articles between a substrate and a deformable plastic film, the steps comprising: a. supporting on a bed platen a substrate having a plurality of articles spaced about the upper surface thereof: b. heating a length of theremoplastic film to a temperature at which it will deform under pressure; c. supporting said heated thermoplastic film is a substantially linear configuration above said bed platen, substrate and articles; d. providing a pressure platen having above said supported heated film a generally planar lower surface with a plurality of recesses therein dimensioned to receive therewithin the full height of said articles; and e. moving said pressure platen and bed platen relative to each other and said supported heated film while said film is of substantially linear configuration to bring said lower surface of said pressure platen about said apertures therein adjacent the surface of said substrate about each of said plurality of aritcles and to deform said heated thermoplastic film from said substantially linear configuration into sheaths about each of said articles and to press said film against said substrate outwardly of the periphery of each of said articles and thereby effect bonding thereof to said substrate about each of said articles.

Claim 3

The method in accordance with claim 1 wherein said heating of said thermoplastic film renders at least the lower surface portion thereof sufficiently fluid so as to effect bonding of said film to said substrate by the substance thereof.

Claim 4

The method in accordance with claim 1 wherein said substrate has a heat activatable adhesive coating on the upper suface thereof about said articles and wherein said heated theremoplastic film actuates said adhesive coating upon contact therewith so as to effect bonding of said film to said substrate.

Claim 5

The method in accordance with claim 1 wherein said substrate and said bed platen are pervious to air and a vacuum is drawn therethrough cooperating with said pressure platen to effect bonding of said film to said substrate.

Claim 6

The method in accordance with claim 4 wherein said substrate is of porous paperboard and wherein said heating of said theremoplastic film renders at least the lower surface portion thereof sufficiently fluid so as to effect bonding of said film to said substrate by the substance thereof penetrating into the pores of said substrate.

Claim 7

In a method for encasing articles between a substrate and a deformable plastic film, the steps comprising: a. supporting on a bed platen a substrate having a plurality of articles spaced about the upper surface thereof; b. heating a length of thermoplastic film to a temperature at which it will deform under pressure; c. supporting said heated thermoplastic film in a substantially linear configuration above said bed platen, substrate and articles; d. providing a pressure platen having above said supported heated film a generally planar lower surface with a plurality of recesses therein dimensioned to receive therewithin the full height of said articles; e. moving said pressure platen and bed platen relative to each other and said supported heated film while said film is of substantially linear configuration to bring said lower surface of said pressure platen about said apertures therein adjacent the surface of said substrate about each of said plurality of articles and to deform said heated thermoplastic film from said substantially linear configuration into sheaths about each of said articles and to press said film against said substrate outwardly of the periphery of each of said articles and thereby effect bonding thereof to said substrate about each of said articles; f. placing the assembly of deformed film, substrate and article upon a bed platen while said thermoformed film is still hot; g. providing a cutting platen having depending cutting blade means with a cutting edge at the lower end thereof and enclosing an area substantially greater than said article, said cutting platen also including deformable material within the area defined by said cutting blade means and extending downwardly to at least the plane defined by the cutting edge of said cutting blade means; and h. moving said cutting platen and said bed platen relative to each other to cause said cuttin edge of said cutting blade means to sever said film and substrate and to concurrently cause said resiliently deformable material to press upon the upper surface of said heated film and thereby apply bonding pressure to the film and underlying substrate.

Claim 8

In a method for encasing articles between a substrate and a deformable plastic film, the steps comprising: a. supporting on a bed platen a substrate having a plurality of articles spaced about the upper surface thereof; b. heating a length of thermoplastic film to a temperature at which it will deform under pressure; c. supporting said heated thermoplastic film in a substantially linear configuration above said bed platen, substrate and articles; d. providing a pressure platen having above said supported heated film a generally planar lower surface with a plurality of recesses therein dimensioned to receive therewithin the full height of said articles; e. moving said pressure platen and bed platen relative to each other and said supported heated film while said film is of substantially linear configuration to bring said lower surface of said pressure platen about said apertures therein adjacent the surface of said substrate about each of said plurality of articles and to deform said heated thermoplastic film from said substantially linear configuration into sheaths about each of said articles and to press said film against said substrate outwardly of the periphery of each of said articles and thereby effect bonding thereof to said substrate about each of said articles; f. placing the assembly of deformed film, substrate and article upon a bed platen while said thermoformed film is still hot; g. providing a cutting platen having depending cutting blade means with a cutting edge at the lower end thereof and enclosing an area substantially greater than said article, said cutting platen also including deformable material within the area defined by said cutting blade means and extending downwardly to at least the plane defined by the cutting edge of said cutting blade means; and h. moving said cutting platen and said bed platen relative to each other to cause said cuttin edge of said cutting blade means to sever said film and substrate and to concurrently cause said resiliently deformable material to press upon the upper surface of said heated film and thereby apply bonding pressure to the film and underlying substrate.