Wafer probe apparatus with pneumatic wafer orienting mechanism

Claim 2

In apparatus for testing integrated circuits or the like fabricated within and upon semiconductor wafers each having an orientation recess formed therein, in combination: (a) a table having a wafer mounting surface on which the wafers are loaded one at a time and which is gold-plated and crinkled to diffusedly reflect light falling thereon; (b) means for holding the loaded wafer in a predetermined position on the table; (c) means for revolving the loaded wafer substantially about its own axis relative to the table by application of a gas under pressure; (d) light source means for irradiating the wafer being revolved or the wafer mounting surface of the table depending upon the angular position of the orientation recess in the wafer; (e) photodetector means responsive only to the light emitted from the light source means and reflected diffusedly from the wafer mounting surface of the table and so capable of sensing the fact that the orientation recess in the wafer is turned to a predetermined angular position on the table, the photodetector means being operatively associated with the revolving means for causing same to terminate the application of the gas under pressure to the wafer when the orientation recess therein is turned to the predetermined angular position on the table; and (f) means operatively associated with the photodetector means for adhering the wafer to the table by suction when the orientation recess in the wafer is turned to the predetermined angular position on the table.

Claim 3

The apparatus as set forth in claim 1, wherein the table has a plurality of openings formed therein, and wherein the revolving means comprises: (a) means for blowing the gas under pressure through the openings in the table so as to buoy up the wafer loaded thereon; and (b) means for applying the gas under pressure to the wafer from above, in such a direction that the wafer is revolved substantially about its own axis while being held buoyed up from the table.

Claim 4

The apparatus as set forth in claim 2, wherein the revolving means further comprises means for periodically varying the pressure of the gas applied to the wafer to revolve same.

Claim 5

The apparatus as set forth in claim 2, wherein the adhering means is adapted to exert suction on the wafer through the openings in the table.

Claim 6

The apparatus as set forth in claim 2, wherein the holding means includes an arcuate abutment adapted to make relative sliding contact with the wafer when the latter is being revolved, the abutment having formed therein a series of indentations adapted to permit escape therethrough of part of the gas under pressure blown through the openings in the table.

Claim 7

The apparatus as set forth in claim 1, wherein the table has a plurality of openings formed therein, and wherein the revolving means comprises: (a) means for blowing the gas under pressure through the openings in the table; (b) at least some of the openings in the table being so angled that the wafer loaded thereon is both buoyed up and revolved substantially about its own axis by the gas under pressure blown therethrough.

Claim 8

The apparatus as set forth in claim 6, wherein the adhering means is adapted to exert suction on the wafer through the openings in the table.

Claim 9

The apparatus as set forth in claim 6, wherein the holding means includes an abutment adapted to make relative sliding contact with the wafer when the latter is being revolved, the abutment having formed therein a series of indentations adapted to permit escape therethrough of part of the gas under pressure blown through the openings in the table.

Claim 10

In apparatus for testing integrated circuits or the like fabricated within and upon semiconductor wafers each having an orientation recess formed therein, in combination: (a) a table having a wafer mounting surface which is gold-plated and crinkled to diffusedly reflect light falling thereon; (b) conveyor means for transporting and partly loading the wafers on the wafer mounting surface of the table one at a time; (c) means for applying a gas under pressure to the partly loaded wafer so as to completely load same on the wafer mounting surface of the table; (d) means for holding the loaded wafer in a predetermined position on the table; (e) the gas-applying means being further capable of buoying up the loaded wafer from the wafer mounting surface of the table and of revolving the buoyed wafer substantially about its own axis relative to the table; (f) light source means for irradiating the wafer being revolved or the wafer mounting surface of the table depending upon the angular position of the orientation recess in the wafer; (g) photodetector means responsive only to the light emitted from the light source means and reflected diffusedly from the wafer mounting surface of the table and so capable of sensing the fact that the orientation recess in the wafer is turned to a predetermined angular position on the table, the photodetector means being operatively associated with the gas-applying means for causing same to terminate the application of the gas under pressure to the wafer when the orientation recess therein is turned to the predetermined angular position on the table; and (h) means operatively associated with the photodetector means for adhering the wafer to the table by suction when the orientation recess in the wafer is turned to the predetermined angular position on the table.

Claim 11

In apparatus for testing integrated circuits or the like fabricated within and upon semiconductor wafers each having an orientation recess formed therein, in combination: (a) a table having a wafer mounting surface which is gold-plated and crinkled to diffusedly reflect light falling thereon; (b) conveyor means for transporting and partly loading the wafers on the wafer mounting surface of the table one at a time; (c) means for applying a gas under pressure to the partly loaded wafer so as to completely load same on the wafer mounting surface of the table; (d) means for holding the loaded wafer in a predetermined position on the table; (e) the gas-applying means being further capable of buoying up the loaded wafer from the wafer mounting surface of the table and of revolving the buoyed wafer substantially about its own axis relative to the table; (f) light source means for irradiating the wafer being revolved or the wafer mounting surface of the table depending upon the angular position of the orientation recess in the wafer; (g) photodetector means responsive only to the light emitted from the light source means and reflected diffusedly from the wafer mounting surface of the table and so capable of sensing the fact that the orientation recess in the wafer is turned to a predetermined angular position on the table, the photodetector means being operatively associated with the gas-applying means for causing same to terminate the application of the gas under pressure to the wafer when the orientation recess therein is turned to the predetermined angular position on the table; and (h) means operatively associated with the photodetector means for adhering the wafer to the table by suction when the orientation recess in the wafer is turned to the predetermined angular position on the table.

Claim 12

The apparatus as set forth in claim 9, wherein the conveyor means is further adapted to transport the tested wafer away from the table, and wherein the gas-applying means is further adapted to help unload the tested wafer from the table back to the conveyor means.

Claim 13

The apparatus as set forth in claim 10, wherein the table has formed therein a plurality of openings through which the gas under pressure is applied to the loaded wafer for buoying up same, and wherein the gas-applying means further comprises: (a) a first nozzle for directing the gas under pressure to the wafer so as to completely load same from the conveyor means on to the table and further to revolve the loaded and buoyed wafer relative to the table; and (b) a second nozzle for directing the gas under pressure to the wafer, following the testing thereof, so as to help unload the wafer from the table back to the conveyor means.

Claim 14

The apparatus as set forth in claim 9, wherein the table has formed therein a plurality of openings through which the gas under pressure is blown by the gas-applying means, at least one of the openings in the table being so angled that the wafer partly loaded thereon from the conveyor means is completely loaded thereon by the gas under pressure blown through said at least one of the openings, the other openings in the table being so angled that the wafer is both buoyed up and revolved relative to the table by the gas under pressure blown therethrough.

Claim 15

The apparatus as set forth in claim 12, wherein the conveyor means is further adapted to transport the tested wafer away from the table, and wherein the table is adapted to be turned 180 degrees about is own axis when the tested wafer is to be unloaded therefrom, whereby the tested wafer is unloaded from the table back to the conveyor means at least partly by the gas under pressure blown through said at least one of the openings in the table.

Claim 16

The apparatus as set forth in claim 9, wherein the conveyor means is further adapted to transport the tested wafer away from the table, and wherein the openings in the table further include at least one other which is so angled that the tested wafer is unloaded from the table back to the conveyor means at least partly by the gas under pressure blown through said at least one other opening.