US4203809A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Copper foil hypochlorite treatment method and product produced
Assignee: Individual
•
Filing: 1975-03-04
•
Granted: 1980-05-20
•
Expires: 1995-03-04
Abstract
Abstract A process for improving the surface characteristics of copper foil involving the treatment of such foil with an aqueous alkali metal hypochlorite solution. Copper foil produced thereby.
Inventors
- 👤 Walter A. McKean
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-30 01:46
CPC Classifications
C; C25; C25D; C25D5/00; C25D5/34; C23; C23C; C23C22/00; C23C22/05; C23C22/68; H; H05; H05K; H05K3/00; H05K3/38; H05K3/382; H05K3/385; H05K2201/00; H05K2201/03; H05K2201/0332; H05K2201/0335; H05K2201/0355; H05K2203/00; H05K2203/03; H05K2203/0315; H05K2203/0392
Claims Analysis
Total Claims: 20
Claim 1
Independent Claim
51 words
A process for improving the surface characteristics of copper foil comprising subjecting said foil to an aqueous sodium hypochlorite solution for a period of from about 5 to 30 seconds, said solution containing from about 21/2 to 15% sodium hypochlorite and being maintained at a temperature of from about 110°-160° F.
Claim 2
Dependent Claim
51 words
A process for improving the surface characteristics of copper foil comprising subjecting said foil to an aqueous sodium hypochlorite solution for a period of from about 5 to 30 seconds, said solution containing from about 21/2 to 15% sodium hypochlorite and being maintained at a temperature of from about 110°-160° F.
Claim 3
Dependent Claim
42 words
A process as defined in claim 1 wherein, after said foil is subjected to said solution, said solution is removed from said foil by subjecting the foil to washing treatment for a sufficient period of time to avoid staining of the foil.
Claim 4
Dependent Claim
46 words
A process as defined in claim 2 wherein said washing treatment involves the use of a water wash, said washing treatment being carried out for a period of time in the order of twice the length of time that said foil is subjected to said solution.
Claim 5
Dependent Claim
43 words
A process as defined in claim 1 wherein, after subjecting said foil to said solution, said foil is subjected to an electrochemical treatment to coat at least one of its faces with a microcrystalline, powdery electrodeposit so as to improve its bond strength.
Claim 6
Dependent Claim
45 words
A process as defined in claim 1 wherein, after subjecting said foil to said solution, said foil is treated with an etching solution to etch away at least a portion of the surface of said foil, wherein said etching solution is not a hypochlorite solution.
Claim 7
Dependent Claim
37 words
A process as defined in claim 1 wherein said solution contains about 3-7% by weight of sodium hypochlorite, is at a temperature of about 130°-140° F., said foil being subjected to said solution for about 8-10 seconds.
Claim 8
Dependent Claim
37 words
A process as defined in claim 6 wherein said solution contains about 5% by weight of sodium hypochlorite, is at a temperature of about 130°-135° F., said foil being subjected to said solution for about 8-10 seconds.
Claim 9
Dependent Claim
12 words
Printed circuit grade copper foil produced by the process of claim 1.
Claim 10
Dependent Claim
28 words
A process for improving the etchability of copper foil which has been subjected to a chromate treatment comprising subjecting said foil to an aqueous alkali metal hypochlorite solution.
Claim 11
Dependent Claim
28 words
A process for improving the etchability of copper foil which has been subjected to a chromate treatment comprising subjecting said foil to an aqueous alkali metal hypochlorite solution.
Claim 12
Dependent Claim
44 words
A process as defined in claim 9 wherein said solution is an aqueous sodium hypochlorite solution containing about 21/2-15% by weight of sodium hypochlorite, said solution having a temperature of about 110°-160° F. and being in contact with said foil for about 5-30 seconds.
Claim 13
Dependent Claim
36 words
A process as defined in claim 10 wherein, after subjecting said foil to said solution, said foil is treated with an etching solution to etch away at least a portion of the surface of said foil.
Claim 14
Dependent Claim
12 words
Printed circuit grade copper foil produced by the process of claim 10.
Claim 15
Dependent Claim
36 words
A process as defined in claim 9 wherein, after subjecting said foil to said solution, said foil is treated with an etching solution to etch away at least a portion of the surface of said foil.
Claim 16
Dependent Claim
38 words
Copper foil produced by the process of claim 9, wherein the foil has been subjected to said hypochlorite solution for a period of time sufficient to remove only a portion of the coating formed by said chromate treatment.
Claim 17
Dependent Claim
49 words
A process for improving the surface characteristics of copper foil comprising subjecting said foil to an aqueous sodium hypochlorite solution and then subjecting said foil to an electrochemical treatment to coat at least one of its faces with a microcrystalline, powdery electrodeposit so as to improve its bond strength.
Claim 18
Dependent Claim
49 words
A process for improving the surface characteristics of copper foil comprising subjecting said foil to an aqueous sodium hypochlorite solution and then subjecting said foil to an electrochemical treatment to coat at least one of its faces with a microcrystalline, powdery electrodeposit so as to improve its bond strength.
Claim 19
Dependent Claim
49 words
A process for improving the surface characteristics of copper foil comprising subjecting said foil to an aqueous sodium hypochlorite solution then treating said foil with an etching solution to etch away at least a portion of the surface of said foil, wherein said solution is not a hypochlorite solution.
Claim 20
Dependent Claim
49 words
A process for improving the surface characteristics of copper foil comprising subjecting said foil to an aqueous sodium hypochlorite solution then treating said foil with an etching solution to etch away at least a portion of the surface of said foil, wherein said solution is not a hypochlorite solution.
References Cited (Backward Citations)
US1709327A
Cited
FR1155398A
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FR1163663A
Cited
US3150016A
Cited
US3328275A
Cited
US3231503A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1983-05-20 | 1983-11-19 | 1984-05-20 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1987-05-20 | 1987-11-19 | 1988-05-20 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1991-05-20 | 1991-11-19 | 1992-05-20 | $7700.00 | Window Closed / Lapsed |