Inductance fabricated on a metal base printed circuit board

Claim 2

A high-Q inductance for a metallic base printed circuit board, comprising: a printed circuit board metallic support base; a ferromagnetic core placed through a first aperture in said metallic support base for providing a preferred path in said ferromagnetic core for time-varying magnetic flux; an overlayer of insulating material deposited on said metallic support base for providing electrical insulation from said metallic support base; an electrically conductive printed coil structure deposited on said overlayer and located about said ferromagnetic core for generating said time varying magnetic flux, said metallic support base including a gap extending outwardly from the vicinity of said first aperture in a manner that will intersect closed paths within said metallic support base that are linked by said time-varying magnetic flux for forming a high-Q inductance by substantially impeding across said gap the flow of dissipative eddy currents in said closed paths.

Claim 3

An inductance according to claim 1 wherein an insulating material is deposited within said gap, at least a portion of said printed coil structure being deposited over the insulating material within said gap.

Claim 4

An inductance according to claim 2 including a second aperture in said metallic support base through which second aperture said ferromagnetic core is placed.

Claim 5

An inductance according to claim 3 wherein said gap extends from the vicinity of said first aperture to the vicinity of said second aperture.

Claim 6

An inductance according to claim 4 wherein the insulating material of said overlayer comprises a porcelain enamel.

Claim 7

An inductance according to claim 1 including a second layer of insulating material deposited on a surface of said metallic support base opposite said overlayer.

Claim 8

An inductance according to claim 6 wherein said printed coil structure comprises first and second spiral coils.

Claim 9

A high-Q inductance for a metallic base printed circuit board, comprising: a printed circuit board metallic support base; a ferromagnetic core placed through a first aperture in said metallic support base for providing a preferred path in said ferromagnetic core for time-varying magnetic flux; an electrically conductive printed coil structure located about said ferromagnetic core for generating said time-varying magnetic flux; an overlayer of insulating material interposed between a first spiral coil of said printed coil structure and said metallic support base for providing electrical insulation from said metallic support base; and a second layer of insulating material deposited on a surface of said metallic support base opposite said overlayer, said second layer being interposed between a second spiral coil of said printed coil structure and said metallic support base, said metallic support base including a gap extending outwardly from the vicinity of said first aperture in a manner that will intersect closed paths within said metallic support base that are linked by said time-varying magnetic flux for forming a high-Q inductance by substantially impeding across said gap the flow of dissipative eddy currents in said closed paths.

Claim 10

A high-Q inductance for a metallic base printed circuit board, comprising: a printed circuit board metallic support base; a ferromagnetic core placed through a first aperture in said metallic support base for providing a preferred path in said ferromagnetic core for time-varying magnetic flux; an electrically conductive printed coil structure located about said ferromagnetic core for generating said time-varying magnetic flux; an overlayer of insulating material interposed between a first spiral coil of said printed coil structure and said metallic support base for providing electrical insulation from said metallic support base; and a second layer of insulating material deposited on a surface of said metallic support base opposite said overlayer, said second layer being interposed between a second spiral coil of said printed coil structure and said metallic support base, said metallic support base including a gap extending outwardly from the vicinity of said first aperture in a manner that will intersect closed paths within said metallic support base that are linked by said time-varying magnetic flux for forming a high-Q inductance by substantially impeding across said gap the flow of dissipative eddy currents in said closed paths.

Claim 11

An inductance according to claim 8 including a first through hole connecting conductor connecting a spiral line of each of said first and second spiral coils through said first aperture.

Claim 12

An inductance according to claim 9 including third and fourth spiral coils located about a portion of said ferromagnetic core placed through a second aperture in said metallic support base, said overlayer of insulating material interposed between said third spiral coil and said metallic support base, said second layer of insulating material interposed between said fourth spiral coil and said metallic support base, and including a second through hole connecting conductor connecting a spiral line of each of said third and fourth spiral coils through said second aperture.

Claim 13

An inductance according to claim 10 including a diagonal connecting conductor connecting outer spiral lines of said first and third spiral coils, said first through hole connecting conductor connecting inner spiral lines of said first and second spiral coils, said second through hole conductor connecting inner spiral lines of said second and fourth spiral conductors for forming a coil structure with series aiding spiral coils.

Claim 14

An inductance according to claim 7 wherein a diagonal connecting conductor connects the outer spiral arms of said first and second spiral coils in a series aiding manner.

Claim 15

An inductance according to claim 7 wherein said first spiral coil comprises a first winding of a transformer and said second spiral coil comprises a second winding of said transformer.

Claim 16

A printed circuit board inductance, comprising: a printed circuit board base portion formed of an electrically conductive material; a layer of insulating material deposited on said base portion; a ferromagnetic core piece placed through an aperture in said printed circuit board base portion and said layer for providing a preferred magnetic flux path; an electrically conductive printed coil structure located about said ferromagnetic core piece and deposited on said layer of insulating material; and a source of alternating current coupled to said printed coil structure for developing a time-varying magnetic flux in said ferromagnetic core piece, said printed circuit board base portion being provided with a gap in said electrically conductive material extending from said aperture outwardly in a manner that will intersect closed paths within said electrically conductive material that are linked by said time-varying flux, said gap of sufficient width to provide a relatively large impedance to eddy currents generated in said closed paths by said time-varying magnetic flux for substantially reducing eddy current dissipation, said insulating material being deposited in said gap, at least a portion of said printed coil structure being deposited over said gap.

Claim 17

A printed circuit board inductance, comprising: a printed circuit board base portion formed of an electrically conductive material; a layer of insulating material deposited on said base portion; a ferromagnetic core piece placed through an aperture in said printed circuit board base portion and said layer for providing a preferred magnetic flux path; an electrically conductive printed coil structure located about said ferromagnetic core piece and deposited on said layer of insulating material; and a source of alternating current coupled to said printed coil structure for developing a time-varying magnetic flux in said ferromagnetic core piece, said printed circuit board base portion being provided with a gap in said electrically conductive material extending from said aperture outwardly in a manner that will intersect closed paths within said electrically conductive material that are linked by said time-varying flux, said gap of sufficient width to provide a relatively large impedance to eddy currents generated in said closed paths by said time-varying magnetic flux for substantially reducing eddy current dissipation, said insulating material being deposited in said gap, at least a portion of said printed coil structure being deposited over said gap.