US4198449A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method for the preparation of thin films of high-temperature-resistant metals such as tungsten, molybdenum, rhenium or osmium
Assignee: Siemens AG
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Filing: 1978-04-20
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Granted: 1980-04-15
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Expires: 1998-04-20
Abstract
Abstract Disclosed herein is the preparation of thin films of tungsten, molybdenum, rhenium or osmium on a high-temperature resistant substrate by thermal evaporation in a high vacuum, wherein the oxides of these high-temperature-resistant metals are evaporated simultaneously with a reduction metal in a manner such that the oxide molecules and the metal atoms or molecules impinge together on the surface of the substrate heated to a predetermined temperature and react with each other there chemically, so that the high-temperature-resistant metal oxides are reduced and the reduction metals are oxidized. In this process, the high-temperature-resistant metal is deposited on the surface of the substrate, and the oxides of the reduction metals evaporate, either completely or partially, and are pumped off.
Inventors
- 👤 Helmut Freller
- 👤 Gunther Titze
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-26 20:51
CPC Classifications
C; C23; C23C; C23C16/00; C23C16/06
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
123 words
In a method for the preparation of thin films of high-temperature-resistant metals on a heated high-temperature-resistant substrate by thermal evaporation of the oxides of said high-temperature-resistant metals in a high vacuum, the improvement comprising simultaneously evaporating the oxide of said high-temperature-resistant metal with a reduction metal such that the molecules of said oxide and the atoms of said reduction metal impinge together and chemically react on the surface of said heated substrate to cause reduction of the metal oxide and oxidation of the reduction metal, in the process of which the high-temperature-resistant metal is precipitated on the surface of said substrate, and the resultant oxides of said reduction metal are at least partially evaporated and removed or are incorporated into said thin film.
Claim 2
Dependent Claim
123 words
In a method for the preparation of thin films of high-temperature-resistant metals on a heated high-temperature-resistant substrate by thermal evaporation of the oxides of said high-temperature-resistant metals in a high vacuum, the improvement comprising simultaneously evaporating the oxide of said high-temperature-resistant metal with a reduction metal such that the molecules of said oxide and the atoms of said reduction metal impinge together and chemically react on the surface of said heated substrate to cause reduction of the metal oxide and oxidation of the reduction metal, in the process of which the high-temperature-resistant metal is precipitated on the surface of said substrate, and the resultant oxides of said reduction metal are at least partially evaporated and removed or are incorporated into said thin film.
Claim 3
Dependent Claim
21 words
The method according to claim 1 wherein said substrate is selected from the group consisting of graphite, vitreous coal and pyrographite.
Claim 4
Dependent Claim
20 words
The method according to claim 1 wherein said substrate comprises a ceramic having an operating temperature above about 1000° C.
Claim 5
Dependent Claim
23 words
The method according to claim 1 wherein said substrate is selected from the group consisting of tungsten, molybdenum, rhenium, osmium and alloys thereof.
Claim 6
Dependent Claim
27 words
The method according to claim 1 wherein the substrate is a composite of aluminum oxide with a material selected from the group consisting of tungsten and carbon.
Claim 7
Dependent Claim
22 words
The method according to claim 1 wherein said high-temperature-resistant metal is selected from the group consisting of tungsten, molybdenum, rhenium and osmium.
Claim 8
Dependent Claim
125 words
In a method for the preparation of thin films of high-temperature-resistant metals on a heated high-temperature-resistant substrate by thermal evaporation of the oxides of said high-temperature-resistant metals in a high vacuum, the improvement comprising simultaneously evaporating the oxide of said high-temperature-resistant metal with a reduction metal comprising tin such that the molecules of said oxide and the atoms of said reduction metal impinge together and chemically react on the surface of said heated substrate to cause reduction of the metal oxide and oxidation of the reduction metal, in the process of which the high-temperature-resistant metal is precipitated on the surface of said substrate, and the resultant oxides of said reduction metal are at least partially evaporated and removed or are incorporated into said thin film.
Claim 9
Dependent Claim
125 words
In a method for the preparation of thin films of high-temperature-resistant metals on a heated high-temperature-resistant substrate by thermal evaporation of the oxides of said high-temperature-resistant metals in a high vacuum, the improvement comprising simultaneously evaporating the oxide of said high-temperature-resistant metal with a reduction metal comprising tin such that the molecules of said oxide and the atoms of said reduction metal impinge together and chemically react on the surface of said heated substrate to cause reduction of the metal oxide and oxidation of the reduction metal, in the process of which the high-temperature-resistant metal is precipitated on the surface of said substrate, and the resultant oxides of said reduction metal are at least partially evaporated and removed or are incorporated into said thin film.
Claim 10
Dependent Claim
125 words
In a method for the preparation of thin films of high-temperature-resistant metals on a heated high-temperature-resistant substrate by thermal evaporation of the oxides of said high-temperature-resistant metals in a high vacuum, the improvement comprising simultaneously evaporating the oxide of said high-temperature-resistant metal with a reduction metal comprising aluminum such that the molecules of said oxide and the atoms of said reduction metal impinge together and chemically react on the surface of said heated substrate to cause reduction of the metal oxide and oxidation of the reduction metal, in the process of which the high-temperature-resistant metal is precipitated on the surface of said substrate, and the resultant oxides of said reduction metal are at least partially evaporated and removed or are incorporated into said thin film.
Claim 11
Dependent Claim
125 words
In a method for the preparation of thin films of high-temperature-resistant metals on a heated high-temperature-resistant substrate by thermal evaporation of the oxides of said high-temperature-resistant metals in a high vacuum, the improvement comprising simultaneously evaporating the oxide of said high-temperature-resistant metal with a reduction metal comprising aluminum such that the molecules of said oxide and the atoms of said reduction metal impinge together and chemically react on the surface of said heated substrate to cause reduction of the metal oxide and oxidation of the reduction metal, in the process of which the high-temperature-resistant metal is precipitated on the surface of said substrate, and the resultant oxides of said reduction metal are at least partially evaporated and removed or are incorporated into said thin film.
References Cited (Backward Citations)
GB1328451A
Cited
US3963839A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1983-04-15 | 1983-10-15 | 1984-04-15 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1987-04-15 | 1987-10-15 | 1988-04-15 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1991-04-15 | 1991-10-15 | 1992-04-15 | $7700.00 | Window Closed / Lapsed |