Thermoplastic resin-coated metallic substrate and the method of producing the same through use of a polyamide adhesive layer

Claim 2

A metallic wire substrate whereon is disposed a protective laminate comprising as a first ply a polyamide hot melt adhesive bonded to said substrate, said polyamide comprising the condensate of (1) an poly amide-forming dicarboxylic compound having the formula: R.sup.1 OOCR.sup.3 COOR.sup.2 or compounds hydrolyzable thereto, wherein each of R 1 and R 2 is hydrogen, an alkyl group or an aryl group; and R 3 is an aliphatic, cycloaliphatic or an aryl radical; or (2) a polymeric fatty acid having a dimeric fat acid content of at least 90 percent by weight; or mixtures thereof; and a diamine of the formula: ##STR5## wherein each of R 4 , R 5 , R 6 and R 7 is a hydrogen atom or an alkyl radical; and n is an integer of from 1 to 6 inclusive; the ratio of said difunctional amide-forming compound to said diamine being within the range of about 0.5 to 0.7 moles of said difunctional compound to each mole of diamine; and the molar equivalent of said polymeric fatty acid to said diamine being from 0.9 to 1.1 of carboxyl groups to each amine moiety present in said diamine; said polyamide having a melt viscosity of 10 to 100 poises at 210° C.; and a second ply of an extrudable thermoplastic resin adhering to said substrate by means of said adhesive.

Claim 3

A protectively coated metallic wire substrate as claimed in claim 1 wherein said extrudable thermoplastic resin is a plasticized vinyl resin.

Claim 4

A protectively coated metallic substrate as claimed in claim 2 wherein said plasticized vinyl resin is present is a thickness of at least 0.007 inch.

Claim 5

A chain link fence fabric comprising a protectively coated wire as claimed in claim 3.

Claim 6

A protectively coated wire as claimed in claim 2 wherein said vinyl resin is a plasticized polyvinyl chloride comprising 100 parts by weight of vinyl chloride homopolymer and from 25 parts to 40 parts of a plasticizer per hundred parts of homopolymer.

Claim 7

A protectively coated wire as claimed in claim 5 wherein said plasticizer is non-migratory with respect to said hot melt adhesive.

Claim 8

A protectively coated wire as claimed in claim 2 wherein said vinyl resin is plasticized vinyl chloride homopolymer.

Claim 9

A protectively coated wire in accordance with claim 2 wherein said vinyl resin is a copolymer of not less than seventy percent by weight of polymerized vinyl chloride and not more than thirty percent by weight of a vinyl ester of the general formula: ##STR6## wherein R is a lower alkyl radical.

Claim 10

A protectively coated wire as claimed in claim 4 wherein said wire is composed of steel.

Claim 11

A laminate as claimed in claim 1 wherein said polyamide comprises the condensate of azelaic acid and N-(N'-piperazinylacetyl)-piperazine.

Claim 12

A protectively coated steel wire as claimed in claim 10 wherein said polyamide has a Brookfield melt viscosity of 40 to 60 poises at 210° C.

Claim 13

A protectively coated metallic substrate as claimed in claim 10 wherein said metallic substrate is galvanized steel wire; said polyamide adhesive has a softening point of from about 135° C. to 138° C.; a Brookfield melt viscosity of about 0.45 at 210° C.; a tensile strength of about 500 pounds per square inch; and a percent elongation of about 550.

Claim 14

A protectively coated metallic substrate as claimed in claim 12 wherein said substrate is galvanized steel wire including an oxidized zinc surface coating.

Claim 15

A protectively coated metallic substrate as claimed in claim 10 wherein said substrate is steel wire.

Claim 16

A protectively coated metallic substrate as claimed in claim 10 wherein said substrate is galvanized steel wire.

Claim 17

A protectively coated metallic substrate as claimed in claim 10 wherein said substrate is aluminum-coated steel.

Claim 18

A protectively coated metallic substrate as claimed in claim 10 wherein said substrate is chromium, silica, copper, nickel phosphorus alloy steel.

Claim 19

A protectively coated metallic substrate as claimed in claim 10 wherein said substrate is manganese, chromium, vanadium alloy.

Claim 20

A protectively coated metallic substrate as claimed in claim 10 wherein said substrate is an aluminum containing metallic material.

Claim 21

A protectively coated metallic substrate as claimed in claim 10 wherein said substrate is galvanized steel wire having a cross-sectional diameter of from about 0.076 to about 0.192 inch.

Claim 22

A metallic wire substrate as claimed in claim 1 wherein said polyamide comprises a condensate of said polyamide-forming dicarboxylic acid and said diamine.

Claim 23

A protectively coated metallic substrate whereon is disposed a protective laminate as claimed in claim 21 where, in said polyamide-forming dicarboxylic compound, R 3 is an alkylene moiety of from 5 to 7 carbon atoms.

Claim 24

A protectively coated metallic substrate whereon is disposed a protective laminate as claimed in claim 22 wherein said amide-forming dicarboxylic compound is azelaic acid or the methyl ester thereof.

Claim 25

A protectively coated metallic substrate, whereon is disposed a protective laminate, as claimed in claim 21, wherein said amide-forming dicarboxylic compound is azelaic acid or the methyl ester thereof; said diamine is N(N'-piperazinylacetyl) piperazine; and said extrudable thermoplastic plasticized vinyl resin in vinyl chloride homopolymer.

Claim 26

A protectively coated metallic substrate as claimed in claim 24 wherein said metallic substrate is galvanized steel.

Claim 27

A continuous process for applying and bonding a protective coating to a metallic wire substrate that comprises applying to a rapidly advancing length of said substrate a first ply of a molten polyamide resin hot melt adhesive at a temperature of from 300° F. to 450° F.; said polyamide comprising the condensate of (1) a polyamide-forming dicarboxylic compound of the formula: R.sup.1 OOCR.sup.3 COOR.sup.2 or compounds hydrolyazable thereto, wherein each of R 1 and R 2 is hydrogen, an alkyl group or an aryl group; and R 3 is an aliphatic, cycloaliphatic or an aryl radical; or (2) a polymeric fatty acid having a dimeric fat acid content of at least 90 percent by weight or mixtures thereof: and a diamine of the formula: ##STR7## wherein each of R 4 , R 5 , R 6 and R 7 is a hydrogen atom or an alkyl radical; and n is an integer of from 1 to 6 inclusive; the ratio of said difunctional amide-forming compound to said diamine being within the range of about 0.5 to 0.7 moles of said difunctional compound to each mole of diamine; and the molar equivalent of said polymeric fatty acid to said diamine being from 0.9 to 1.1 of carboxyl groups to each amine moiety present in said diamine; said polyamide having a melt viscosity of 10 to 100 poises at 210° C.; cooling the said adhesive composition to a flow resistant state; extruding a molten extrudable thermoplastic resin composition onto said adhesive composition whereby said adhesive composition is softened and cooling, whereby said thermoplastic resin composition is bonded to said substrate by means of said adhesive composition.

Claim 28

A continuous process for applying and bonding a protective coating to a metallic wire substrate that comprises applying to a rapidly advancing length of said substrate a first ply of a molten polyamide resin hot melt adhesive at a temperature of from 300° F. to 450° F.; said polyamide comprising the condensate of (1) a polyamide-forming dicarboxylic compound of the formula: R.sup.1 OOCR.sup.3 COOR.sup.2 or compounds hydrolyazable thereto, wherein each of R 1 and R 2 is hydrogen, an alkyl group or an aryl group; and R 3 is an aliphatic, cycloaliphatic or an aryl radical; or (2) a polymeric fatty acid having a dimeric fat acid content of at least 90 percent by weight or mixtures thereof: and a diamine of the formula: ##STR7## wherein each of R 4 , R 5 , R 6 and R 7 is a hydrogen atom or an alkyl radical; and n is an integer of from 1 to 6 inclusive; the ratio of said difunctional amide-forming compound to said diamine being within the range of about 0.5 to 0.7 moles of said difunctional compound to each mole of diamine; and the molar equivalent of said polymeric fatty acid to said diamine being from 0.9 to 1.1 of carboxyl groups to each amine moiety present in said diamine; said polyamide having a melt viscosity of 10 to 100 poises at 210° C.; cooling the said adhesive composition to a flow resistant state; extruding a molten extrudable thermoplastic resin composition onto said adhesive composition whereby said adhesive composition is softened and cooling, whereby said thermoplastic resin composition is bonded to said substrate by means of said adhesive composition.

Claim 29

A continuous process as claimed in claim 26 wherein said wire is advanced at a rate of from about 200 feet per minute to about 1200 feet per minute.

Claim 30

A continuous process as claimed in claim 27 wherein said polyamide resin hot melt adhesive comprises the condensate of azelaic acid and N-(N'-piperazinylacetyl)-piperazine.

Claim 31

A continuous process as claimed in claim 28 wherein said polyamide adhesive has a Brookfield melt viscosity of about 45 poises at 210°; a tensile strength of about 500 pounds per square inch; and a percent elongation of about 550.

Claim 32

The process of claim 29 wherein said extrudable thermoplastic resin is a plasticized vinyl chloride homopolymer.

Claim 33

The process of claim 28 wherein said extrudable thermoplastic plasticized resin employed is a copolymer of vinyl chloride and a vinyl ester having the structure: ##STR8## wherein R is a lower alkyl radical.

Claim 34

The process of claim 31 wherein said vinyl ester is vinyl acetate.

Claim 35

The process of claim 30 wherein said temperature at which vinyl chloride homopolymer compound is extruded onto said adhesive coated substrate is about 300° F. to about 450° F.

Claim 36

The process as claimed in claim 33 wherein said wire is advanced at about 200 feet per minute to about 1200 feet per minute.

Claim 37

The process of claim 34 where said adhesive composition is deposited upon said wire in a thickness of about 1 to about 5 mils and said vinyl chloride homopolymer compound is extruded onto said adhesive coating in a thickness of about 0.015 to 0.025 inch.

Claim 38

The process as claimed in claim 28 wherein said wire is substantially nodule-free galvanized steel wire.

Claim 39

The process as claimed in claim 28 wherein the melt viscosity of said polyamide is about 40 to 60 at 210° C.

Claim 40

The process as claimed in claim 37 wherein said wire is galvanized steel wire having a oxidized zinc surface coating.

Claim 41

The process as claimed in claim 38 wherein said wire has a cross-section diameter of from about 0.076 inch to about 0.192 inch.

Claim 42

A process for applying a protective coating to a metallic wire and simultaneously bonding said coating thereto that comprises applying, in a first treatment zone, to a rapidly advancing length of said wire a first ply of molten hot melt polyamide adhesive as claimed in claim 26, at a temperature of from 300° F. to 425° F. to effect a bonding of said adhesive to said metallic wire; advancing said adhesive coated substrate to a second treatment zone wherein said adhesive is cooled to a solid, soft, flow-resistant state and thereafter extruding onto said cooled adhesive in a third treatment zone, a molten extrudable thermoplastic plasticized vinyl resin composition, at a temperature sufficient to melt said adhesive and effect a bond between said adhesive and said vinyl resin composition; and thereafter in a fourth treatment zone reducing the temperature of said advancing coated wire to solidify the bonded coating of adhesive and vinyl resin composition; said wire being advanced through said treatment zones at a rate of about 200 feet per minute to about 1200 feet per minute.

Claim 43

The process of claim 40 wherein the treatment zones wherein cooling occurs are maintained at about room temperature.

Claim 44

The process of claim 40 wherein said fourth treatment zone comprises the ambient atmosphere through which the coated wire is advanced after leaving the extruder, and a trough containing a cooling liquid medium through which said coated wire is advanced from said ambient atmosphere.

Claim 45

The process of claim 40 wherein the residence time of said wire in said fourth treatment zone is from about 0.08 seconds to 6 seconds and said zone is maintained at a temperature of from about 50° to 70° F.

Claim 46

In the process of manufacturing protectively coated chain link fence fabric, the steps that comprise forming a protectively coated wire substrate as claimed in claim 26.

Claim 47

A continuous process for applying and bonding a protective coating to a metallic wire substrate that comprises applying to a rapidly advancing length of said substrate a first ply of polyamide hot melt adhesive at a temperature of from 300° F. to 450° F., said polyamide comprising the condensate of a polyamide-forming dicarboxylic compound having the formula: R.sup.1 OOCR.sup.3 COOR.sup.2 or compounds hydrolyzable thereto, wherein each of R 1 and R 2 is hydrogen, an alkyl group or an aryl group; and R 3 is an aliphatic, cycloaliphatic or an aryl radical; and a diamine of the formula: ##STR9## wherein each of R 4 , R 5 , R 6 and R 7 is a hydrogen atom or an alkyl radical; and n is an integer of from 1 to 6 inclusive; the ratio of said difunctional amide-forming compound to said diamine being within the range of about 0.5 to 0.7 moles of said amide-forming dicarboxylic compound to each mole of diamine; said polyamide having a melt viscosity of 10 to 100 poises at 210° C.; cooling said adhesive composition to a flow resistant state; extruding a molten extrudable thermoplastic-plasticized vinyl resin onto said adhesive composition whereby said adhesive composition is softened, and cooling, whereby said thermoplastic resin composition is bonded to said substrate by means of said adhesive composition.

Claim 48

A continuous process for applying and bonding a protective coating to a metallic wire substrate that comprises applying to a rapidly advancing length of said substrate a first ply of polyamide hot melt adhesive at a temperature of from 300° F. to 450° F., said polyamide comprising the condensate of a polyamide-forming dicarboxylic compound having the formula: R.sup.1 OOCR.sup.3 COOR.sup.2 or compounds hydrolyzable thereto, wherein each of R 1 and R 2 is hydrogen, an alkyl group or an aryl group; and R 3 is an aliphatic, cycloaliphatic or an aryl radical; and a diamine of the formula: ##STR9## wherein each of R 4 , R 5 , R 6 and R 7 is a hydrogen atom or an alkyl radical; and n is an integer of from 1 to 6 inclusive; the ratio of said difunctional amide-forming compound to said diamine being within the range of about 0.5 to 0.7 moles of said amide-forming dicarboxylic compound to each mole of diamine; said polyamide having a melt viscosity of 10 to 100 poises at 210° C.; cooling said adhesive composition to a flow resistant state; extruding a molten extrudable thermoplastic-plasticized vinyl resin onto said adhesive composition whereby said adhesive composition is softened, and cooling, whereby said thermoplastic resin composition is bonded to said substrate by means of said adhesive composition.

Claim 49

A process as claimed in claim 45 wherein said vinyl resin is a plasticized vinyl halide-containing resin.

Claim 50

A process as claimed in claim 45 where, in said amide-forming dicarboxylic compound, R 3 is an alkylene moiety of from 5 to 7 carbon atoms.

Claim 51

A process as claimed in claim 47 wherein said amide-forming dicarboxylic compound is azelaic acid or the methyl ester thereof.

Claim 52

A process as claimed in claim 45 wherein said amide-forming dicarboxylic compound is azelaic acid or the methyl ester thereof; said diamine is N(N!-piperazinylacetyl) piperazine; and said extrudable thermoplastic plasticized vinyl resin is vinyl chloride homopolymer.

Claim 53

A process as claimed in claim 49 wherein said metallic substrate is galvanized steel.