US4179322A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method for making bondable finger contacts
Assignee: AT&T Inc
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Filing: 1978-03-28
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Granted: 1979-12-18
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Expires: 1998-03-28
Abstract
Abstract Apparatus and a method are disclosed for making bondable finger contacts (101) for application to printed circuit boards. The finger contacts are formed from a thin strip (102) of electrically conductive material. Following the application of a thin layer of contact metal (201) to the contact area, a strip of adhesive tape (109) is applied to the plated side of the contacts to protect the contacts, to interconnect and support them during subsequent handling, and to provide a compliant surface which aids in the application of the contacts to a circuit board. On an opposite side of the contacts there is applied a thermally curable adhesive (301) which, when brought into pressure contact with the circuit board and a moderate amount of heat is applied, will fasten the contacts to the board.
Inventors
- 👤 Vernon L. Brown
- 👤 Wade H. Greenwood
- 👤 Gary L. Griffith
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-29 20:07
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/3405; H01; H01R; H01R43/00; H01R43/16; H05K2201/00; H05K2201/10; H05K2201/10227; H05K2201/10424; H05K2203/00; H05K2203/01; H05K2203/0191; H05K3/303; H05K3/305; H05K3/40; H05K3/4007; H05K3/4015; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49204; Y10T29/49208; Y10T29/49222; Y10T29/49224
Claims Analysis
Total Claims: 14
Claim 1
Independent Claim
154 words
A method for making bondable finger contacts for application to a printed circuit board including the steps of: forming a strip of virtually continuous, flat, electrically conductive material so as to produce a plurality of spaced-apart finger contacts integral with and interconnected by at least one support carrier, each of the finger contacts having a contact region thereon; selectively applying a coating of contact metal to said contact region of said finger contacts wherein said coating of contact metal applied to the contact region is a layer of soft gold followed by a stripe of hard gold; applying a tape having an adhesive on one side thereof to one side of the contact region of said plurality of contacts to protect, interconnect and support said contacts; and applying a coat of adhesive to an opposite side of said contact region of said plurality of contacts to facilitate bonding said contacts to said circuit board.
Claim 2
Independent Claim
154 words
A method for making bondable finger contacts for application to a printed circuit board including the steps of: forming a strip of virtually continuous, flat, electrically conductive material so as to produce a plurality of spaced-apart finger contacts integral with and interconnected by at least one support carrier, each of the finger contacts having a contact region thereon; selectively applying a coating of contact metal to said contact region of said finger contacts wherein said coating of contact metal applied to the contact region is a layer of soft gold followed by a stripe of hard gold; applying a tape having an adhesive on one side thereof to one side of the contact region of said plurality of contacts to protect, interconnect and support said contacts; and applying a coat of adhesive to an opposite side of said contact region of said plurality of contacts to facilitate bonding said contacts to said circuit board.
Claim 3
Dependent Claim
19 words
The method in accordance with claim 1 wherein the layer of soft gold is between 1 and 7 microinches.
Claim 4
Dependent Claim
19 words
The method in accordance with claim 1 wherein the stripe of hard gold is between 10 and 50 microinches.
Claim 5
Dependent Claim
22 words
The method in accordance with claim 1 wherein an unplated region where the coat of adhesie is applied is allowed to oxidize.
Claim 6
Independent Claim
169 words
A method for making bondable finger contacts for application to a printed circuit board comprising the steps of: forming a strip of virtually continuous, flat, electrically conductive material so as to produce a plurality of spaced-apart finger contacts integral with and interconnected by at least one support carrier, each of said finger contacts having a contact region thereon; selectively applying a coating of contact metal to both sides of said finger contacts, said coating comprising a layer of soft gold having a thickness between 1 and 7 microinches; selectively applying a stripe of hard gold over said layer of soft gold on one side of said contact region; applying a tape having an adhesive on one side thereof to said contact region bearing said stripe of hard gold on said plurality of finger contacts to protect, interconnect and support said contacts; and applying a coat of adhesive to an opposite side of said contact region of said plurality of contacts to facilitate bonding said contacts to said circuit board.
Claim 7
Independent Claim
169 words
A method for making bondable finger contacts for application to a printed circuit board comprising the steps of: forming a strip of virtually continuous, flat, electrically conductive material so as to produce a plurality of spaced-apart finger contacts integral with and interconnected by at least one support carrier, each of said finger contacts having a contact region thereon; selectively applying a coating of contact metal to both sides of said finger contacts, said coating comprising a layer of soft gold having a thickness between 1 and 7 microinches; selectively applying a stripe of hard gold over said layer of soft gold on one side of said contact region; applying a tape having an adhesive on one side thereof to said contact region bearing said stripe of hard gold on said plurality of finger contacts to protect, interconnect and support said contacts; and applying a coat of adhesive to an opposite side of said contact region of said plurality of contacts to facilitate bonding said contacts to said circuit board.
Claim 8
Dependent Claim
19 words
The method in accordance with claim 5 wherein the stripe of hard gold is between 10 and 50 microinches.
Claim 9
Dependent Claim
30 words
The method in accordance with claim 5 wherein an unplated region where the coat of adhesive is applied is allowed to oxidize prior to application of said coat of adhesive.
Claim 10
Dependent Claim
33 words
The method in accordance with claim 5 further comprising the additional step of applying a spot of solder and flux on tails of said finger contacts where reflow solder attachment is to occur.
Claim 11
Dependent Claim
38 words
The method in accordance with claim 5 further comprising the additional steps of: heating said adhesive to drive off any volatile material associated therewith; and cooling said heated adhesive to enable subsequent handling of said adhesive-coated finger contacts.
Claim 12
Dependent Claim
65 words
The method in accordance with claim 9 further including the additional steps of: feeding said adhesive-coated finger contacts and a virtually continuous strip of paper to a take-up reel; and winding said finger contacts and said strip of paper on said take-up reel so that layers of said finger contacts carrying said coat of adhesive are separated from one another by said strip of paper.
Claim 13
Independent Claim
289 words
A method for making bondable finger contacts for application to a printed circuit board comprising the steps of: forming a strip of virtually continuous, flat, electrically conductive material so as to produce a plurality of spaced-apart finger contacts integral with and interconnected by at least one support carrier, each of said finger contacts having a contact region thereon; selectively applying a coating of contact metal to both sides of said finger contacts, said coating comprising a layer of soft gold having a thickness between 1 and 7 microinches; selectively applying a stripe of hard gold over said layer of soft gold on one side of said contact region, said stripe of hard gold having a thickness between 10 and 50 microinches; applying a tape having an adhesive on one side thereof to said contact region bearing said stripe of hard gold on said plurality of finger contacts to protect, interconnect and support said contacts; allowing an unplated region on an opposite side of said finger contacts to oxidize; applying a coat of adhesive to said side of said finger contacts allowed to oxidize to facilitate bonding of said contacts to said circuit board; applying a spot of solder and flux on tails of said finger contacts where reflow solder attachment is to occur; heating said adhesive to drive off any volatile material associated therewith; cooling said heated adhesive to enable subsequent handling of said adhesive-coated finger contacts; feeding said adhesive-coated finger contacts and a virtually continuous strip of paper to a take-up reel; and winding said finger contacts and said strip of paper on said take-up reel so that layers of said finger contacts carrying said coat of adhesive are separated from one another by said strip of paper.
Claim 14
Independent Claim
289 words
A method for making bondable finger contacts for application to a printed circuit board comprising the steps of: forming a strip of virtually continuous, flat, electrically conductive material so as to produce a plurality of spaced-apart finger contacts integral with and interconnected by at least one support carrier, each of said finger contacts having a contact region thereon; selectively applying a coating of contact metal to both sides of said finger contacts, said coating comprising a layer of soft gold having a thickness between 1 and 7 microinches; selectively applying a stripe of hard gold over said layer of soft gold on one side of said contact region, said stripe of hard gold having a thickness between 10 and 50 microinches; applying a tape having an adhesive on one side thereof to said contact region bearing said stripe of hard gold on said plurality of finger contacts to protect, interconnect and support said contacts; allowing an unplated region on an opposite side of said finger contacts to oxidize; applying a coat of adhesive to said side of said finger contacts allowed to oxidize to facilitate bonding of said contacts to said circuit board; applying a spot of solder and flux on tails of said finger contacts where reflow solder attachment is to occur; heating said adhesive to drive off any volatile material associated therewith; cooling said heated adhesive to enable subsequent handling of said adhesive-coated finger contacts; feeding said adhesive-coated finger contacts and a virtually continuous strip of paper to a take-up reel; and winding said finger contacts and said strip of paper on said take-up reel so that layers of said finger contacts carrying said coat of adhesive are separated from one another by said strip of paper.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1982-12-17 | 1983-06-18 | 1983-12-18 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1986-12-17 | 1987-06-18 | 1987-12-18 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1990-12-17 | 1991-06-18 | 1991-12-18 | $7700.00 | Window Closed / Lapsed |