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US4176751A Expired / Lapsed US ⏱️ 0.0 years remaining

Container apparatus for handling semiconductor wafers

Assignee: Nortel Networks Ltd
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Filing: 1977-01-27
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Granted: 1979-12-04
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Expires: 1997-01-27
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Abstract

Abstract A modified etch boat acts as a transfer device for transferring wafers, in bulk. An etch boat has a longitudinal hole through one wall near the top edge, the hole periphery extending into Vee grooves in the etch boat. With wafers in the grooves, a rod inserted through the hole prevents wafers from falling out. With wafers in a storage box, the modified etch boat is positioned on the storage box, the hole inverted, and then the rod inserted after the wafers have transferred. The etch boat can then be inverted over a furnace boat, for example. After positioning on the furnace boat, with the wafers lifted slightly, the rod is removed and then the etch boat lifted off. The reverse operation is used to transfer from a furnace boat.

Inventors

  • 👤 Michael J. E. Gillissie

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-28 19:57
CPC Classifications
H; H10; H10P; H10P72/00; H10P72/50; H10P72/10; H10P72/15; Y; Y10; Y10S; Y10S206/00; Y10S206/832

Claims Analysis

Total Claims: 2
Claim 1
Independent Claim 305 words
Apparatus for transferring semiconductor wafers, comprising: a holder of trough shaped cross-section including two opposed parallel sides having top and bottom surfaces; said top surfaces being flat and including locating means for cooperation with locating means on a further member; said sides joined at one end by an end wall extending between said sides at said one end and joined at the other end by a bar extending between said sides at said other end, the holder open at top and bottom between said end wall and said bar; a plurality of parallel Vee shaped grooves formed in an inner surface on each side, the grooves extending from said top surfaces and having inwardly inclined lower ends extending in to the inner surface of the side at a position intermediate the top and bottom surfaces, for reception and retention of a semiconductor wafer in each opposed pair of grooves when said holder is in an upright position, at least a major portion of each wafer below said top surfaces; a hole extending longitudinally through one side of the holder adjacent to the top surface thereof, the periphery of the hole extending into the Vee grooves at a position above that occupied by a portion of the wafer; and a rod slidable axially into and out of said hole; the arrangement such that the rod, when inserted into said hole, extends over the periphery of the wafers at a position remote from the centres thereof to retain the wafers in the holder when said holder is in an inverted position, with the edges of the wafers unobstructed for alignment and prepositioning with respect to grooves of said further member; said further member including a plurality of Vee-shaped grooves aligned with said Vee-shaped grooves in said holder for reception of wafers therein, a wafer in each groove.
Claim 2
Dependent Claim 305 words
Apparatus for transferring semiconductor wafers, comprising: a holder of trough shaped cross-section including two opposed parallel sides having top and bottom surfaces; said top surfaces being flat and including locating means for cooperation with locating means on a further member; said sides joined at one end by an end wall extending between said sides at said one end and joined at the other end by a bar extending between said sides at said other end, the holder open at top and bottom between said end wall and said bar; a plurality of parallel Vee shaped grooves formed in an inner surface on each side, the grooves extending from said top surfaces and having inwardly inclined lower ends extending in to the inner surface of the side at a position intermediate the top and bottom surfaces, for reception and retention of a semiconductor wafer in each opposed pair of grooves when said holder is in an upright position, at least a major portion of each wafer below said top surfaces; a hole extending longitudinally through one side of the holder adjacent to the top surface thereof, the periphery of the hole extending into the Vee grooves at a position above that occupied by a portion of the wafer; and a rod slidable axially into and out of said hole; the arrangement such that the rod, when inserted into said hole, extends over the periphery of the wafers at a position remote from the centres thereof to retain the wafers in the holder when said holder is in an inverted position, with the edges of the wafers unobstructed for alignment and prepositioning with respect to grooves of said further member; said further member including a plurality of Vee-shaped grooves aligned with said Vee-shaped grooves in said holder for reception of wafers therein, a wafer in each groove.

References Cited (Backward Citations)

US3497058A Cited
US3926305A Cited
US3877134A Cited
US3949891A Cited
US3934733A Cited
US4023691A Cited
US4043451A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1982-12-03 1983-06-04 1983-12-04 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1986-12-03 1987-06-04 1987-12-04 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1990-12-03 1991-06-04 1991-12-04 $7700.00 Window Closed / Lapsed

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