Contact for semiconductor devices
Abstract
Abstract A contact on a surface of a semiconductor device includes a post projecting from the surface of the device and a head on the post. The post has a transverse cross-sectional shape of at least three arms projecting radially from a common center point. The head has a cross-sectional area larger than the transverse cross-sectional area of the post. The post is on the surface of a body of semiconductor material and extends through a layer of an inorganic insulating material, such as an oxide or nitride, on the surface of the body. The post is of a height such that the head is spaced from the inorganic insulating material layer. A layer of an organic insulating material, such as a polyimide or silicone resin, may be provided on the inorganic insulating material layer and around the post to provide additional support for the head.
Inventors
- 👤 Edgar J. Denlinger
- 👤 Harold S. Veloric
Bibliographic Details
Claims Analysis
Total Claims: 9References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1982-11-05 | 1983-05-07 | 1983-11-06 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1986-11-05 | 1987-05-07 | 1987-11-06 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1990-11-05 | 1991-05-07 | 1991-11-06 | $7700.00 | Window Closed / Lapsed |