US4167174A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method and apparatus for aligning the streets of a semiconductor wafer
Assignee: SPX Technologies Inc
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Filing: 1977-12-08
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Granted: 1979-09-11
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Expires: 1997-12-08
Abstract
Abstract A method and apparatus for aligning the streets of a semiconductor wafer for sawing or scribing with a single motion control switch. One end of a street is first aligned with a reticle in the Y-direction with this motion control switch. The wafer is then moved in the X-direction while the operator with the same control switch, controls the rotation of the wafer so as to align the street with the reticle. Automatic Y-direction alignment is provided during this rotation by determining the Y-direction misalignment which occurs from the rotation, and by automatically moving the wafer saw blade assembly in the Y-direction to provide the necessary compensation.
Inventors
- 👤 Gordon P. Hampton
- 👤 Matheus D. Pennings
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-24 03:29
CPC Classifications
H; H10; H10P; H10P72/00; H10P72/50; B; B23; B23Q; B23Q15/00; B23Q15/20; B23Q15/22; B28; B28D; B28D5/00; B28D5/0058; B28D5/02; B28D5/022
Claims Analysis
Total Claims: 14
Claim 1
Independent Claim
81 words
A method for aligning a street of a wafer comprising the steps of: aligning a first street with a fixed reference by relative movement in a first linear direction; aligning said first street with said reference as said street is moved relative to said fixed reference in a second linear direction by manually controlling the rotation of said wafer; automatically controlling the relative movement in said first direction in response to said rotation of said wafer; whereby said street is aligned.
Claim 2
Independent Claim
81 words
A method for aligning a street of a wafer comprising the steps of: aligning a first street with a fixed reference by relative movement in a first linear direction; aligning said first street with said reference as said street is moved relative to said fixed reference in a second linear direction by manually controlling the rotation of said wafer; automatically controlling the relative movement in said first direction in response to said rotation of said wafer; whereby said street is aligned.
Claim 3
Dependent Claim
30 words
The method defined by claim 1 wherein said wafer is moved a predetermined distance in said first direction each time said rotation is at least equal to a predetermined angle.
Claim 4
Dependent Claim
38 words
The method defined by claim 1 including the additional steps of: rotating said wafer 90°; aligning a second street which is transverse to said first street with said fixed reference by relative movement in said first linear direction.
Claim 5
Dependent Claim
139 words
In a wafer saw which includes a chuck to which a wafer is secured, said chuck movable in the X-direction, said X-direction being in alignment with the cutting direction of the saw blade, a blade assembly movable in the Y-direction which is perpendicular to said X-direction and said chuck rotatable in the θ-direction, and said saw including a microscope with an aligning reticle which moves with said blade assembly; a method for aligning a street of a wafer secured to said chuck with said blade comprising the steps of: (a) manually aligning a point on said street with said reticle; and (b) providing coordinated movement of said chuck in said θ-direction and said Y-direction while moving said chuck in said X-direction so as to effectively rotate said wafer about said point; whereby said street is aligned with said blade.
Claim 6
Dependent Claim
139 words
In a wafer saw which includes a chuck to which a wafer is secured, said chuck movable in the X-direction, said X-direction being in alignment with the cutting direction of the saw blade, a blade assembly movable in the Y-direction which is perpendicular to said X-direction and said chuck rotatable in the θ-direction, and said saw including a microscope with an aligning reticle which moves with said blade assembly; a method for aligning a street of a wafer secured to said chuck with said blade comprising the steps of: (a) manually aligning a point on said street with said reticle; and (b) providing coordinated movement of said chuck in said θ-direction and said Y-direction while moving said chuck in said X-direction so as to effectively rotate said wafer about said point; whereby said street is aligned with said blade.
Claim 7
Dependent Claim
36 words
The method defined by claim 4 wherein said movement in said Y-direction set forth in step (b) occurs each time said rotation set forth in step (b) is equal to or greater than a predetermined angle.
Claim 8
Dependent Claim
23 words
The method defined by claim 5 wherein said movement in said X-direction set forth in step (b) is limited to a predetermined distance.
Claim 9
Dependent Claim
35 words
The method defined by claim 4 including the steps of: (c) rotating said chuck 90° in said θ-direction; (d) aligning a second street with said reticle by manually moving said blade assembly in said Y-direction.
Claim 10
Independent Claim
93 words
A method for aligning a street of a wafer on a wafer saw comprising the steps of: aligning a first point on said street with the cutting path; moving said wafer a predetermined distance in a direction parallel to the cutting path; manually aligning a second point spaced apart from said first point on said street with said cutting path; automatically rotating and translating said wafer through a predetermined angle and translation, as a function of the distance moved to align said second point; whereby said street is aligned with said cutting path.
Claim 11
Independent Claim
93 words
A method for aligning a street of a wafer on a wafer saw comprising the steps of: aligning a first point on said street with the cutting path; moving said wafer a predetermined distance in a direction parallel to the cutting path; manually aligning a second point spaced apart from said first point on said street with said cutting path; automatically rotating and translating said wafer through a predetermined angle and translation, as a function of the distance moved to align said second point; whereby said street is aligned with said cutting path.
Claim 12
Dependent Claim
100 words
A wafer saw including: a Y-direction stepping motor for moving a blade relative to said wafer in a direction transverse to the cutting path of said blade; a θ-direction stepping motor for rotation of said wafer; a counter means for counting the steps through which said θ-direction stepping motor turns, said counter means coupled to said θ-direction stepping motor, said counter means for initiating movement for said Y-direction stepping motor each time the count in said counter means reaches a predetermined count; whereby during the alignment of the streets of said wafer on said saw automatic Y-direction compensation is provided.
Claim 13
Dependent Claim
100 words
A wafer saw including: a Y-direction stepping motor for moving a blade relative to said wafer in a direction transverse to the cutting path of said blade; a θ-direction stepping motor for rotation of said wafer; a counter means for counting the steps through which said θ-direction stepping motor turns, said counter means coupled to said θ-direction stepping motor, said counter means for initiating movement for said Y-direction stepping motor each time the count in said counter means reaches a predetermined count; whereby during the alignment of the streets of said wafer on said saw automatic Y-direction compensation is provided.
Claim 14
Dependent Claim
33 words
The apparatus defined by claim 9 including a switch for controlling movement in said Y-direction during alignment in said Y-direction and for controlling rotational movement in said θ-direction during alignment in said θ-direction.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1982-09-10 | 1983-03-12 | 1983-09-11 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1986-09-10 | 1987-03-12 | 1987-09-11 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1990-09-10 | 1991-03-12 | 1991-09-11 | $7700.00 | Window Closed / Lapsed |