US4161692A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Probe device for integrated circuit wafers
Assignee: Cerprobe Corp
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Filing: 1977-07-18
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Granted: 1979-07-17
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Expires: 1997-07-18
Abstract
Abstract A probe device for testing integrated circuit wafers is disclosed. The probe device comprises a support means, which has metallized portions, and an aperture. A plurality of "L" shaped holding means, each having a thin metallized surface, are coupled to metallized portions of the support means so that a portion of the holding means extends into the aperture. Coupled to the metallized surface of each of the holding means is a corresponding needle-like probe member which has a curved portion. These probe members are coupled to the holding means in such a manner that their curved portions extend into the support means aperture so as to electrically contact a circuit wafer placed therein, and thereby electrically couple the circuit wafer to the support means, and ultimately to circuit testing apparatus.
Inventors
- 👤 John W. Tarzwell
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 01:09
CPC Classifications
G; G01; G01R; G01R1/00; G01R1/02; G01R1/06; G01R1/067; G01R1/073; G01R1/07307; G01R1/07342
Claims Analysis
Total Claims: 14
Claim 1
Independent Claim
140 words
A probe device for testing integrated circuit wafers, said device comprising: (a) a support member having an aperture; (b) a plurality of ceramic holding members, each said holding member having relatively broad, generally parallel surfaces and relatively narrow edges, at least a portion of one said edge having an electrically conductive path disposed thereon, said holding members coupled to said support member, via one said narrow edge, such that said relatively broad surfaces are generally perpendicular to said support member and such that said holding members extend into said aperture; and (c) a plurality of probe members, each said probe member coupled to said electrically conductive path on said narrow edge of each said holding member and extending into said aperture, one or more of said probe members being configured to electrically contact a circuit wafer placed within said aperture.
Claim 2
Dependent Claim
140 words
A probe device for testing integrated circuit wafers, said device comprising: (a) a support member having an aperture; (b) a plurality of ceramic holding members, each said holding member having relatively broad, generally parallel surfaces and relatively narrow edges, at least a portion of one said edge having an electrically conductive path disposed thereon, said holding members coupled to said support member, via one said narrow edge, such that said relatively broad surfaces are generally perpendicular to said support member and such that said holding members extend into said aperture; and (c) a plurality of probe members, each said probe member coupled to said electrically conductive path on said narrow edge of each said holding member and extending into said aperture, one or more of said probe members being configured to electrically contact a circuit wafer placed within said aperture.
Claim 3
Dependent Claim
26 words
The device according to claim 1 wherein said electrically conductive path is a thin metalized surface disposed on the narrow edge of each said holding member.
Claim 4
Dependent Claim
16 words
The device according to claim 2 wherein said support member is made of a ceramic material.
Claim 5
Dependent Claim
32 words
The device according to claim 3 wherein said probe member is a needle-like member having a curved portion, said member coupled to said holding member such that said curved portion protrudes therefrom.
Claim 6
Dependent Claim
16 words
The device according to claim 1 wherein said support member is made of a ceramic material.
Claim 7
Dependent Claim
26 words
The device according to claim 5 wherein said electrically conductive path is a thin metalized surface disposed on the narrow edge of each said holding member.
Claim 8
Dependent Claim
47 words
The device according to claim 6 wherein said support member has electrically conductive paths disposed thereon and each said holding member is coupled to said support member by means of affixing said metalized surface of said holding member to said electrically conductive paths on said support member.
Claim 9
Dependent Claim
32 words
The device according to claim 7 wherein said probe member is a needle-like member having a curved portion, said member coupled to said holding member such that said curved portion protrudes therefrom.
Claim 10
Dependent Claim
32 words
The device according to claim 1 wherein said probe member is a needle-like member having a curved portion, said member coupled to said holding member such that said curved portion protrudes therefrom.
Claim 11
Dependent Claim
26 words
The device according to claim 9 wherein said electrically conductive path is a thin metalized surface disposed on the narrow edge of each said holding member.
Claim 12
Dependent Claim
16 words
The device according to claim 10 wherein said support member is made of a ceramic material.
Claim 13
Independent Claim
171 words
A system for testing integrated circuits at very high frequencies comprising: (a) a support member having an aperture; (b) a plurality of ceramic holding members, each said holding member having relatively broad, generally parallel surfaces and relatively narrow edges, at least a portion of one said edge having an electrically conductive path disposed thereon, said holding members coupled to said support member, via one said narrow edge, such that said relatively broad surfaces are generally perpendicular to said support member and such that said holding members extend into said aperture, (c) a plurality of probe members, each said probe member coupled to said electrically conductive path on said narrow edge of each said holding member and extending into said aperture, one or more of said probe members being configured to electrically contact a circuit wafer placed within said aperture; and (d) a circuit electrically connected to said circuit wafer, via said support member, said holding members and said probe members, for operating and testing said circuit wafer at very high frequencies.
Claim 14
Independent Claim
171 words
A system for testing integrated circuits at very high frequencies comprising: (a) a support member having an aperture; (b) a plurality of ceramic holding members, each said holding member having relatively broad, generally parallel surfaces and relatively narrow edges, at least a portion of one said edge having an electrically conductive path disposed thereon, said holding members coupled to said support member, via one said narrow edge, such that said relatively broad surfaces are generally perpendicular to said support member and such that said holding members extend into said aperture, (c) a plurality of probe members, each said probe member coupled to said electrically conductive path on said narrow edge of each said holding member and extending into said aperture, one or more of said probe members being configured to electrically contact a circuit wafer placed within said aperture; and (d) a circuit electrically connected to said circuit wafer, via said support member, said holding members and said probe members, for operating and testing said circuit wafer at very high frequencies.
References Cited (Backward Citations)
US2641672A
Cited
US3849728A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1982-07-16 | 1983-01-15 | 1983-07-17 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1986-07-16 | 1987-01-15 | 1987-07-17 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1990-07-16 | 1991-01-15 | 1991-07-17 | $7700.00 | Window Closed / Lapsed |