Method and apparatus for reducing residual stresses in crystals

Claim 2

In an apparatus for growing a substantially monocrystalline body of a selected material from a melt of the same comprising means for establishing a melt/solid growth interface and drawing means for drawing a growing substantially monocrystalline body progressively from said interface along a predetermined axis, the improvement comprising a temperature profile controller for controlling the temperature distribution along the length of said body so as to reduce thermal stresses, said temperature profile controller including a heat flow means which is located between said means for establishing a melt/solid growth interface and said drawing means, said heat flow means comprising at least one block of heat conductive material elongated lengthwise of said axis and defining a passageway bounded at least in part by said heat conductive material through which said body may be drawn, said heat flow means having first and second opposite ends spaced along said axis with said second end being located farthest from said means for establishing a melt/solid growth interface, solid heat insulating means disposed on the outside of said heat flow means and arranged so as to substantially prevent radiative loss of heat laterally from said heat flow means, heating means for providing heat to said heat flow means at said first end thereof adjacent to said means for establishing a melt/solid growth interface, and solid heat sink means for removing heat from the second end of said heat flow means, whereby said heat insulating means and said heat sink means coact so as to cause conduction to be the predominant heat flow process at all points along the length of said heat flow means.

Claim 3

Apparatus according to claim 1 wherein said at least one block of heat conductive material is dimensioned so as to establish a substantially linear temperature gradient along said axis with the temperature decreasing with increasing distance from said means for establishing a melt/growth interface.

Claim 4

Apparatus according to claim 2 wherein at least a portion of said at least one block of heat conductive material has a thickness which decreases with increasing distance from said means for establishing a melt/growth interface.

Claim 5

Apparatus according to claim 1 wherein said means for establishing a melt/solid interface is arranged to permit growth of a substantially monocrystalline body having a predetermined cross-sectional configuration, and further wherein said passageway is sized so that on at least one of two opposite sides thereof said heat-conductive material extends parallel and immediately adjacent to the growing body.

Claim 6

Apparatus according to claim 4 wherein said passageway is sized so that the gap between the growing body and said heat-conductive material is sufficiently small to provide for heat conduction from the grown body to said heat-conductive material.

Claim 7

Apparatus according to claim 1 further including at least one additional means for supplying heat to said heat flow means at a point located downstream of said first mentioned means for supplying heat.

Claim 8

Apparatus according to claim 1 wherein said heat sink means comprises a plate attached to said at least one block of heat-conductive material at the end thereof which is most remote from said means for establishing a melt/growth interface.

Claim 9

Apparatus according to claim 1 wherein said heat flow means comprises a pair of plates disposed in opposition to one another, with said passageway comprising the space between said plates.

Claim 10

Apparatus according to claim 8 wherein said plates are made of graphite.

Claim 11

Apparatus according to claim 9 wherein said means for establishing a melt/growth interface comprises a capillary die aligned with said heat flow means and having one end disposed in a crucible.

Claim 12

In an apparatus for growing a substantially monocrystalline body of a selected material from a melt of the same comprising a capillary die for establishing a melt/solid growth interface and drawing means for drawing a growing substantially monocrystalline body progressively from said interface along a predetermined axis, the improvement comprising a temperature profile controller for controlling the temperature distribution along the length of said body so as to reduce thermal stresses, said temperature profile controller including a heat flow means which is located between said capillary die for establishing a melt/solid growth interface and said drawing means, said heat flow means comprising at least one block of heat conductive material elongated lengthwise of said axis and defining a passageway bounded at least in part by said heat conductive material through which said body may be drawn, said heat flow means having first and second opposite ends spaced along said axis with said second end being located farthest from said capillary die for establishing a melt/solid growth interface, solid heat insulating means disposed on the outside of said heat flow means and arranged so as to substantially prevent radiative loss of heat laterally from said heat flow means, first heater means located at the first end of said heat flow means for providing heat to said first end of said heat flow means, and second heater means located adjacent to said capillary die for providing heat to the upper end of said die, and solid heat sink means for removing heat from the second end of said heat flow means, whereby said heat insulating means and said heat sink means coact so as to cause conduction to be the predominant heat flow process at all points along the length of said heat flow means.

Claim 13

In an apparatus for growing a substantially monocrystalline body of a selected material from a melt of the same comprising a capillary die for establishing a melt/solid growth interface and drawing means for drawing a growing substantially monocrystalline body progressively from said interface along a predetermined axis, the improvement comprising a temperature profile controller for controlling the temperature distribution along the length of said body so as to reduce thermal stresses, said temperature profile controller including a heat flow means which is located between said capillary die for establishing a melt/solid growth interface and said drawing means, said heat flow means comprising at least one block of heat conductive material elongated lengthwise of said axis and defining a passageway bounded at least in part by said heat conductive material through which said body may be drawn, said heat flow means having first and second opposite ends spaced along said axis with said second end being located farthest from said capillary die for establishing a melt/solid growth interface, solid heat insulating means disposed on the outside of said heat flow means and arranged so as to substantially prevent radiative loss of heat laterally from said heat flow means, first heater means located at the first end of said heat flow means for providing heat to said first end of said heat flow means, and second heater means located adjacent to said capillary die for providing heat to the upper end of said die, and solid heat sink means for removing heat from the second end of said heat flow means, whereby said heat insulating means and said heat sink means coact so as to cause conduction to be the predominant heat flow process at all points along the length of said heat flow means.

Claim 14

Apparatus according to claim 11 wherein said first heater means is disposed in a recess in said block of heat conductive material.

Claim 15

Apparatus according to claim 11 further including a crucible for containing a melt, said capillary die disposed so as to communicate with the interior space of said crucible, and heater means for heating the contents of said crucible, said temperature profile controller being spaced from said crucible along said axis.