US4152195A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of improving the adherence of metallic conductive lines on polyimide layers
Assignee: International Business Machines Corp
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Filing: 1977-08-18
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Granted: 1979-05-01
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Expires: 1997-08-18
Abstract
Abstract A method of improving the adherence of conductive metallic lines to a polyimide resin layer by incompletely curing the polyimide resin prior to deposition of the metal layer, and subsequently completely curing the polyimide resin layer after the metal layer is deposited.
Inventors
- 👤 Dieter Bahrle
- 👤 Peter Frasch
- 👤 Wilfried Konig
- 👤 Friedrich Schwerdt
- 👤 Ursula Thelen
- 👤 Theodor Vogtmann
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-25 12:58
CPC Classifications
H; H10; H10P; H10P14/00; H10P14/60; H10P14/68; H10P14/683; H10P14/40; H10P14/412; H10P14/63; H10P14/6326; H10P14/6328; H10P14/6334; H10P14/65; H10P14/6502; H10P14/6506; H10W; H10W20/00; H10W20/01; H10W20/071; H10W20/093; H10W20/097; H05; H05K; H05K1/00; H05K1/02; H05K1/03; H05K1/0313; H05K1/032; H05K1/0346; H05K3/00; H05K3/38
Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
78 words
A method of fabricating a metal layer having improved adhesion on a polyimide resin surface layer comprising: depositing a layer of polyamidocarboxylic acid on a substrate partially curing said layer of polyamidocarboxylic acid vapor depositing a blanket layer of metal on the resultant partially cured layer, fully curing said partially cured layer to form polyimide by heating to approximately 350° C. for a period of twenty minutes, and etching a conductive line pattern in said layer of metal.
Claim 2
Independent Claim
78 words
A method of fabricating a metal layer having improved adhesion on a polyimide resin surface layer comprising: depositing a layer of polyamidocarboxylic acid on a substrate partially curing said layer of polyamidocarboxylic acid vapor depositing a blanket layer of metal on the resultant partially cured layer, fully curing said partially cured layer to form polyimide by heating to approximately 350° C. for a period of twenty minutes, and etching a conductive line pattern in said layer of metal.
Claim 3
Dependent Claim
41 words
The method of claim 1 wherein the polyamicocarboxylic acid layer prior to the vapor deposition of the metal film is partially cured by heating it to approximately 200° C. and 275° C. during a period of 20 to 30 minutes, respectively.
Claim 4
Dependent Claim
23 words
The method of claim 1 wherein said polycarboxylic acid layer is formed by reacting a polymer of pyromellitic acid anhydride and 4,4'-diaminodiphenyl ether.
Claim 5
Dependent Claim
31 words
The method of claim 1 wherein said layer of metal is an aluminum or an aluminum-copper alloy vapor-deposited as a metal film on the entire surface of said polyamidocarboxylic acid layer.
Claim 6
Dependent Claim
25 words
The method of claim 1 wherein said layer of polyamidocarboxylic acid, prior to curing has a thickness in the range of 18,000 to 22,000 angstroms.
Claim 7
Dependent Claim
16 words
The method of claim 1 wherein said substrate is initially provided with a surface quartz layer.
Claim 8
Dependent Claim
50 words
The method of claim 6 wherein prior to the partial curing of the polyamidocarboxylic acid layer, openings are made in respective areas thereof, and that after said partial curing via holes are made in said quartz layer therebeneath, and that subsequently the metal layer is vapor-deposited on the entire surface.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1982-04-30 | 1982-10-30 | 1983-05-01 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1986-04-30 | 1986-10-30 | 1987-05-01 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1990-04-30 | 1990-10-30 | 1991-05-01 | $7700.00 | Window Closed / Lapsed |