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US4147435A Expired / Lapsed US ⏱️ 0.0 years remaining

Interferometric process and apparatus for the measurement of the etch rate of opaque surfaces

Assignee: International Business Machines Corp
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Filing: 1977-06-30
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Granted: 1979-04-03
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Expires: 1997-06-30
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Abstract

Abstract An interferometer system and process for detecting etch rates in opaque materials, such as silicon or metal, has means for producing a pair of parallel light beams, one of which is directed to the surface of the opaque material and the other of which is directed to the surface of an adjacent transparent masking material. The rate of etch of the opaque material is determined by detecting and recording the changes of light intensity due to interference between the beam reflected from the opaque layer and the beam reflected from the opaque layer beneath the transparent masking material.

Inventors

  • 👤 Millard A. Habegger

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-24 11:31
CPC Classifications
G; G01; G01B; G01B11/00; G01B11/02; G01B11/06; G01B11/0616; G01B11/0675; G01N; G01N17/00

Claims Analysis

Total Claims: 7
Claim 1
Independent Claim 239 words
An interferometer system for determining the etch rates of an opaque material and an overlying transparent layer which partially masks the opaque material comprising: a light source having a wavelength λ, means for dividing the light into two parallel beams one of which is directed onto the free surface of the opaque material and the other of which is directed onto the transparent layer in a direction perpendicular to the surfaces of the layers, a first detector means located in the path of the interfering reflected beams returning from the surface of the transparent layer and from the underlying surface of the opaque material to measure and record the change in light intensity of the interfering reflected beams as a function of time with one period of oscillation of the light intensity corresponding to a thickness change in the transparent layer of λ/2n where n is the refractive index of the transparent layer, a second detector means located in the path of the interfering reflected beams returning from the free surface of the opaque material and from the underlying surface of the opaque material to measure and record the change in light intensity of the interfering reflected beams as a function of time with one period of oscillation of the light intensity corresponding to the removal of an opaque layer thickness of λ/2-ΔX(n-1), where ΔX is the thickness change of the transparent layer during the same period of time.
Claim 2
Dependent Claim 239 words
An interferometer system for determining the etch rates of an opaque material and an overlying transparent layer which partially masks the opaque material comprising: a light source having a wavelength λ, means for dividing the light into two parallel beams one of which is directed onto the free surface of the opaque material and the other of which is directed onto the transparent layer in a direction perpendicular to the surfaces of the layers, a first detector means located in the path of the interfering reflected beams returning from the surface of the transparent layer and from the underlying surface of the opaque material to measure and record the change in light intensity of the interfering reflected beams as a function of time with one period of oscillation of the light intensity corresponding to a thickness change in the transparent layer of λ/2n where n is the refractive index of the transparent layer, a second detector means located in the path of the interfering reflected beams returning from the free surface of the opaque material and from the underlying surface of the opaque material to measure and record the change in light intensity of the interfering reflected beams as a function of time with one period of oscillation of the light intensity corresponding to the removal of an opaque layer thickness of λ/2-ΔX(n-1), where ΔX is the thickness change of the transparent layer during the same period of time.
Claim 3
Dependent Claim 24 words
The system of claim 1 wherein the means for dividing the light into two parallel beams is a window having a back reflective surface.
Claim 4
Dependent Claim 15 words
The system of claim 1 including means to equalize the pathlength of said parallel beams.
Claim 5
Dependent Claim 12 words
The system of claim 1 wherein said light source is a laser.
Claim 6
Dependent Claim 227 words
A process for determining the etch rates of an opaque material and an overlying transparent layer which partially masks the opaque material comprising: providing a light source having a wavelength λ, dividing the light into two parallel beams one of which is directed onto the free surface of the opaque material and the other of which is directed onto the transparent layer in a direction perpendicular to the surfaces of the layers, detecting the light from the interfering reflected beams returning from the surface of the transparent layer and from the underlying surface of the opaque material and measuring and recording the change in light intensity of the interfering reflected beams as a function of time with one period of oscillation of the light intensity corresponding to a thickness change in the transparent layer of λ/2n where n is the refractive index of the transparent layer, detecting the light from the interfering reflected beams returning from the free surface of the opaque material and from the underlying surface of the opaque material and measuring and recording the change in light intensity of the interfering reflected beams as a function of time with one period of oscillation of the light intensity corresponding to the removal of an opaque layer thickness of λ/2-ΔX(n-1), where ΔX is the thickness change of the transparent layer during the same period of time.
Claim 7
Dependent Claim 227 words
A process for determining the etch rates of an opaque material and an overlying transparent layer which partially masks the opaque material comprising: providing a light source having a wavelength λ, dividing the light into two parallel beams one of which is directed onto the free surface of the opaque material and the other of which is directed onto the transparent layer in a direction perpendicular to the surfaces of the layers, detecting the light from the interfering reflected beams returning from the surface of the transparent layer and from the underlying surface of the opaque material and measuring and recording the change in light intensity of the interfering reflected beams as a function of time with one period of oscillation of the light intensity corresponding to a thickness change in the transparent layer of λ/2n where n is the refractive index of the transparent layer, detecting the light from the interfering reflected beams returning from the free surface of the opaque material and from the underlying surface of the opaque material and measuring and recording the change in light intensity of the interfering reflected beams as a function of time with one period of oscillation of the light intensity corresponding to the removal of an opaque layer thickness of λ/2-ΔX(n-1), where ΔX is the thickness change of the transparent layer during the same period of time.

References Cited (Backward Citations)

US3612692A Cited
US3930730A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1982-04-02 1982-10-02 1983-04-03 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1986-04-02 1986-10-02 1987-04-03 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1990-04-02 1990-10-02 1991-04-03 $7700.00 Window Closed / Lapsed

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