Drain extensions for closed COS/MOS logic devices

Claim 2

An improved intergrated circuit comprising at least one closed geometry IGFET of the type comprising: (a) a semiconductor substrate region of a first conductivity type; (b) a pair of spaced regions having a conductivity type opposite that of said substrate region and extending into said substrate region wherein one of said spaced regions completely surrounds the other one of said spaced regions, the surrounding region being the source of said IGFET and the surrounded region being the drain of said IGFET; (c) a gate insulating layer on the surface of said substrate region extending over said substrate region between said pair of spaced regions; and (d) a conductive gate region overlying said gate insulating layer, wherein the improvement comprises a highly doped ohmic contact region of the same conductivity type as said spaced regions which highly doped ohmic contact region is more highly doped than the surrounded one of said spaced regions and which is formed within the surrounded one of said spaced regions and which is surrounded by a lightly doped portion of said surrounded one of said spaced regions, which portion is more lightly doped than the balance of said surrounded one of said spaced regions.

Claim 3

The integrated circuit of claim 1 wherein said lightly doped portion has a sheet resistivity of at least 1000 ohms per square.

Claim 4

The integrated circuit of claim 2 wherein said highly doped ohmic contact region has a sheet resistivity of less than 50 ohms per square.

Claim 5

The integrated circuit of claim 3 further comprising at least one additional highly doped ohmic contact region surrounded by a lightly doped portion, both ohmic contact regions being formed within the same spaced region whereby an electrical path will be formed between said ohmic contact regions.

Claim 6

An improved integrated circuit comprising at least a pair of concentrically formed, closed, geometry IGFETs of the type comprising: (a) a semiconductor substrate region of a first conductivity type; (b) first, second and third spaced regions having a conductivity type opposite that of said substrate region and extending into said substrate region, wherein the first of said spaced regions completely surrounds the second and third ones of said spaced regions, and said second one of said spaced regions completely surrounds said third one of said spaced regions; (c) a first insulating layer on the surface of said substrate region extending over said substrate region between said first and second of said spaced regions; (d) a second insulating layer on the surface of said substrate region extending over said substrate region between the second and third of said spaced regions; and (e) a conductive region overlying each of said insulating regions, wherein the improvement comprises a highly doped ohmic contact region of the same conductivity type as said spaced regions which highly doped ohmic contact region is more highly doped than said second and said third ones of said spaced regions and which is formed within the second spaced region and which ohmic contact is surrounded by a lightly doped portion of said second spaced region, which portion is more lightly doped than the balance of said second spaced region.

Claim 7

An improved integrated circuit comprising at least a pair of concentrically formed, closed, geometry IGFETs of the type comprising: (a) a semiconductor substrate region of a first conductivity type; (b) first, second and third spaced regions having a conductivity type opposite that of said substrate region and extending into said substrate region, wherein the first of said spaced regions completely surrounds the second and third ones of said spaced regions, and said second one of said spaced regions completely surrounds said third one of said spaced regions; (c) a first insulating layer on the surface of said substrate region extending over said substrate region between said first and second of said spaced regions; (d) a second insulating layer on the surface of said substrate region extending over said substrate region between the second and third of said spaced regions; and (e) a conductive region overlying each of said insulating regions, wherein the improvement comprises a highly doped ohmic contact region of the same conductivity type as said spaced regions which highly doped ohmic contact region is more highly doped than said second and said third ones of said spaced regions and which is formed within the second spaced region and which ohmic contact is surrounded by a lightly doped portion of said second spaced region, which portion is more lightly doped than the balance of said second spaced region.

Claim 8

The integrated circuit of claim 5 further comprising a highly doped region of the same conductivity type as said spaced regions which highly doped region is formed in said second spaced region and extends along the surface of said second spaced region between said first insulating layer and said second insulating layer.

Claim 9

The integrated circuit of claim 5 wherein said lightly doped region has a sheet resistivity of at least 1000 ohms per square.

Claim 10

The integrated circuit of claim 7 wherein said highly doped ohmic contact has a sheet resistivity of less than 50 ohms per square.

Claim 11

The integrated circuit of claim 8 further comprising at least one additional highly doped ohmic contact region surrounded by an additional lightly doped portion formed in said second spaced region whereby an electrical path is formed between said ohmic contact regions.