US4133910A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Thick film deposition of microelectronic circuit
Assignee: United States Department of the Army
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Filing: 1977-12-01
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Granted: 1979-01-09
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Expires: 1997-12-01
Abstract
Abstract A process for depositing thick film electronic material which forms elect circuits on the inside wall of right circular substrates. The process includes the determination of a circuit pattern wherein a light sensor is used to actuate electronics which in turn controls the flow of the thick film paste for deposition on the substrate inside wall. The substrate is rotated and translated in conjunction with the movement of a light sensor in the x-y plane.
Inventors
- 👤 Victor W. Ruwe
- 👤 Thomas D. Graben
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-30 22:57
CPC Classifications
B; B05; B05B; B05B13/00; B05B13/06; B05B13/0645; B05B13/0654; H; H10; H10D; H10D84/00; H10D84/01; H10D86/00; H10D86/01; H05; H05K; H05K1/00; H05K1/02; H05K1/0284; H05K3/00; H05K3/10; H05K3/12
Claims Analysis
Total Claims: 3
Claim 1
Independent Claim
116 words
A process for depositing a thick film electronic material to form an electronic circuit on the inside wall of a right circular substrate, said process comprising: projecting a light sensor onto a circuit pattern; moving said light sensor both in an x and y direction; rotating a right circular substrate in response to the movement of said light sensor; positioning a depositing nozzle inside of said right circular substrate in close proximity to the inner wall of said substrate; translating said nozzle in said substrate in response to movement of said light sensor; and actuating control means to cause film material to flow through said nozzle and be deposited on the inside wall of said substrate.
Claim 2
Dependent Claim
116 words
A process for depositing a thick film electronic material to form an electronic circuit on the inside wall of a right circular substrate, said process comprising: projecting a light sensor onto a circuit pattern; moving said light sensor both in an x and y direction; rotating a right circular substrate in response to the movement of said light sensor; positioning a depositing nozzle inside of said right circular substrate in close proximity to the inner wall of said substrate; translating said nozzle in said substrate in response to movement of said light sensor; and actuating control means to cause film material to flow through said nozzle and be deposited on the inside wall of said substrate.
Claim 3
Dependent Claim
22 words
A process as set forth in claim 1 further including pressurizing said film material with nitrogen to cause the material to flow.
References Cited (Backward Citations)
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1982-01-08 | 1982-07-10 | 1983-01-09 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1986-01-08 | 1986-07-10 | 1987-01-09 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1990-01-08 | 1990-07-10 | 1991-01-09 | $7700.00 | Window Closed / Lapsed |