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US4131632A Expired / Lapsed US ⏱️ 0.0 years remaining

Heat-resistant resin compositions

Assignee: Toshiba Corp
•
Filing: 1977-09-27
•
Granted: 1978-12-26
•
Expires: 1997-09-27
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Abstract

Abstract Resin compositions comprising maleimide compounds obtained by reacting maleic anhydride with mixed polyamines produced by reaction between aniline and formaldehyde; diallylbisphenol compounds; and epoxy resins. The compositions display prominent heat resistance when hardened.

Inventors

  • 👤 Shuichi Suzuki
  • 👤 Moriyasu Wada

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-27 17:05
CPC Classifications
C; C08; C08G; C08G73/00; C08G73/06; C08G73/10; C08G73/12; C08G73/121

Claims Analysis

Total Claims: 18
Claim 1
Independent Claim 156 words
A heat-resistant resin composition which comprises (A) at least one maleimide polymer obtained by reacting maleic anhydride with polyphenyl polyamines containing the repeating units represented by the formula ##STR9## wherein said polyphenyl polyamines have 1 to 5 aniline units and have an amine content of 15 to 16.5% by weight and wherein said polyphenyl polyamines are produced by reaction between aniline and formaldehyde; and wherein in said reaction between maleic anhydride and polyphenyl polyamine, the ratio of amine equivalent to acid equivalent is 1:1 to 1:2; (B) at least one allylbisphenol compound represented by the formula: ##STR10## where R is -CH 2 -radical or ##STR11## m and n are each independently zero, or an integer of 1, 2 or 3; each of the allyl groups is positioned ortho to each of the hydroxy groups, and in the case where R is ##STR12## group, m and n respectively denote zero; and (C) at least one epoxy resin.
Claim 2
Dependent Claim 156 words
A heat-resistant resin composition which comprises (A) at least one maleimide polymer obtained by reacting maleic anhydride with polyphenyl polyamines containing the repeating units represented by the formula ##STR9## wherein said polyphenyl polyamines have 1 to 5 aniline units and have an amine content of 15 to 16.5% by weight and wherein said polyphenyl polyamines are produced by reaction between aniline and formaldehyde; and wherein in said reaction between maleic anhydride and polyphenyl polyamine, the ratio of amine equivalent to acid equivalent is 1:1 to 1:2; (B) at least one allylbisphenol compound represented by the formula: ##STR10## where R is -CH 2 -radical or ##STR11## m and n are each independently zero, or an integer of 1, 2 or 3; each of the allyl groups is positioned ortho to each of the hydroxy groups, and in the case where R is ##STR12## group, m and n respectively denote zero; and (C) at least one epoxy resin.
Claim 3
Dependent Claim 21 words
The heat-resistant resin composition according to claim 1, wherein said polyphenylpolyamines have a viscosity ranging between out 2,000 and 5,000 centipoises.
Claim 4
Dependent Claim 20 words
The heat-resistant resin composition according to claim 1, wherein said polyphenylpolyamines have a viscosity ranging between 8,000 and 30,000 centiposes.
Claim 5
Dependent Claim 25 words
The heat-resistant resin composition according to claim 2, wherein the amine radical content of the polyphenylpolyamines ranges between 15.5% by weight and 16.2% by weight.
Claim 6
Dependent Claim 24 words
The heat-resistant resin composition according to claim 3, where the polyphenylpolyamines is reacted with maleic anhydride in the equivalent ratio of 1:1 or more.
Claim 7
Dependent Claim 25 words
The heat-resistant resin composition according to claim 3, wherein the polyphenylpolyamine is reacted with maleic anhydride in the equivalent ratio ranging between 1:1.1 and 1:2.
Claim 8
Dependent Claim 25 words
The heat-resistant resin composition according to claim 1, wherein said maleimide polymer has a melting point ranging between about 80° C and about 130° C.
Claim 9
Dependent Claim 12 words
The heat-resistant resin composition according to claim 2, wherein R is ##STR13##
Claim 10
Dependent Claim 15 words
The heat-resistant resin composition according to claim 2, wherein R is --CH 2 -- group.
Claim 11
Dependent Claim 19 words
The heat-resistant resin composition according to claim 9, wherein m and n have a total of zero to four.
Claim 12
Dependent Claim 22 words
The heat-resistant resin composition according to claim 1, wherein the epoxy resin is produced by reaction between the component B and epihalohydrin.
Claim 13
Dependent Claim 32 words
The heat-resistant resin composition according to claim 1, wherein the epoxy resin is bisphenol A type epoxy resin, epoxy novolak type epoxy resin, cyclic epoxy resin or tetraglycidyl ether type epoxy resin.
Claim 14
Dependent Claim 55 words
The heat-resistant resin composition according to claim 1, wherein the component A has a proportion ranging between about 10 and about 85% by weight; the component B has a proportion ranging between about 5 and about 70% by weight; and the component C has a proportion ranging between about 5 and about 80% by weight.
Claim 15
Dependent Claim 36 words
The heat-resistant resin composition according to claim 12, wherein 60% by weight at maximum of the component A is substituted by at least one member selected from the group consisting of N,N'-substituted bismaleimides and N-substituted monomaleimides.
Claim 16
Dependent Claim 55 words
The heat-resistant resin composition according to claim 1, wherein the component A has a proportion ranging between about 30 and about 60% by weight; the component B has a proportion ranging between about 10 and about 40% by weight; and the component C has a proportion ranging between about 10 and about 40% by weight.
Claim 17
Dependent Claim 25 words
The heat-resistant resin composition according to claim 12, which contains at least one member selected from the group consisting of hardening agents and hardening promoters.
Claim 18
Dependent Claim 19 words
The heat-resistant resin composition according to claim 2, which is diluted with inert organic solvent of low boiling point.

References Cited (Backward Citations)

US2511913A Cited
US3026285A Cited
US3310602A Cited
US3336250A Cited
US3336257A Cited
US3784515A Cited
JPS4816061B1 Cited
US3697462A Cited
US3840495A Cited
US3839493A Cited
JPS4955926A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1981-12-25 1982-06-26 1982-12-26 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1985-12-25 1986-06-26 1986-12-26 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1989-12-25 1990-06-26 1990-12-26 $7700.00 Window Closed / Lapsed

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