Curing of epoxy resin systems using halfester compounds containing aliphatic tertiary amino groups

Claim 2

In the curing of epoxy resin systems which are normally catalyzed by tertiary amines, the improvement that comprises employing a latent curing catalyst comprising a half-ester compound which contains at least one ester group terminated by an aliphatic tertiary amino group and which contains at least one carboxyl group, with said at least one carboxyl group forming at least one intramolecular salt with said tertiary amino group, said at least one ester group and said at leat one carboxyl group being directly connected to an aliphatic or aromatic polyvalent group, the amount of said half-ester compound being about 0.05 to 15% by weight based on the epoxy resin.

Claim 3

In the curing of epoxy resin systems as defined in claim 1, wherein the half-ester compound contains ester groups terminated by aliphatic tertiary amino groups and contains carboxyl groups which form intramolecular salts with said tertiary amino groups, said ester group and said carboxyl groups being directly connected to an aliphatic or aromatic polyvalent group.

Claim 4

In the curing of epoxy resin systems as defined in claim 1, wherein the polyvalent group is a residue of a polycarboxylic acid anhydride which remains after removal of the carboxylic acid anhydride groups.

Claim 5

In the curing of epoxy resin systems as defined in claim 1, wherein the aliphatic tertiary amino group is a residue of tertiary amino alcohol which remains after removal of the hydroxy group.

Claim 6

In the curing of epoxy resin systems as defined in claim 2, wherein the polyvalent group is a residue of a polycarboxylic acid, which remains after removal of the carboxylic acid groups, of three or four valences.

Claim 7

In the curing of epoxy resin systems as defined in claim 2, wherein the polyvalent group is a residue of an aromatic or aliphatic polycarboxylic acid, which remains after removing the carboxylic acid groups, of three or four valences.

Claim 8

In the curing of epoxy resin systems as defined in claim 1, wherein the half-ester compound is a reaction product obtained by reacting a polycarboxylic acid anhydride with an aliphatic tertiary amino alcohol, which half-ester compound contains an ester group terminated by an aliphatic tertiary amino group of said alcohol and a carboxyl group of said acid anhydride, an intramolecular salt being formed by said amino group with said carboxyl group, said ester group and said carboxyl group being directly connected to a residue of said acid anhydride which remains after the removal of the carboxylic acid anhydride groups.

Claim 9

In the curing of epoxy resin systems as defined in claim 1, wherein the half-ester compound is a mixture whose main component is represented by the following general formula: ##STR27## wherein R is an aliphatic or aromatic group of two to six valences, A is an aliphatic monovalent group containing an aliphatic tertiary amino group, and m is an integer of 1 to 3.

Claim 10

In the curing of epoxy resin systems as defined in claim 7, wherein the polycarboxylic acid anhydride is an aromatic acid anhydride and has a molecular weight of from 148 to about 400.

Claim 11

In the curing of epoxy resin systems as defined in claim 7, wherein the polycarboxylic acid anhydride is an aliphatic acid anhydride and has a molecular weight of from 61 to about 250.

Claim 12

In the curing of epoxy resin systems as defined in claim 7, wherein the aliphatic tertiary amino alcohol is an alkyl amino alcohol and has a molecular weight of from 75 to about 400.

Claim 13

In the curing of epoxy resin systems as defined in claim 7, wherein the aliphatic tertiary amino alcohol is an alkenyl amino alcohol and has a molecular weight of from 80 to about 400.

Claim 14

In the curing of epoxy resin systems as defined in claim 3, wherein the polycarboxylic acid anhydride is a member selected from the group consisting of pyromellitic acid dianhydride, trimellitic acid anhydride, benzophenone tetracarboxylic acid dianhydride, maleic acid anhydride, phthalic acid anhydride, cyclopentane tetracarboxylic acid dianhydride, hexahydrophthalic acid anhydride, succinic acid anhydride, and mellitic acid trianhydride.

Claim 15

In the curing of epoxy resin systems as defined in claim 4, wherein the amino alcohol is a member selected from the group consisting of N-hydroxyethyl morpholine, dimethylaminoethanol, diethylaminoethanol, N-methyldiethanolamine, dimethylaminopropanol, dimethylamino-1-phenylethanol, N-heptadecylethanolamine, N-hydroxypiperidine, 1-hydroxypropylpyridine, and N-hydroxyisopropylmorpholine.

Claim 16

In the curing of epoxy resin systems which are normally catalyzed by tertiary amines, the improvement that comprises employing a latent curing catalyst comprising a half-ester compound which contains at least one ester group terminated by an aliphatic tertiary amino group and which contains at least one carboxyl group, with said at least one carboxyl group forming at least one intramolecular salt with said tertiary amino group, and contains another carboxyl group which forms a salt with an aliphatic tertiary amine, said at least one ester group and said at least one carboxyl group forming said intramolecular salt being directly connected to an aliphatic or aromatic polyvalent group, the amount of said half-ester compound being about 0.05 to 15% by weight based on the epoxy resin.

Claim 17

In the curing of epoxy resin systems which are normally catalyzed by tertiary amines, the improvement that comprises employing a latent curing catalyst comprising a half-ester compound which contains at least one ester group terminated by an aliphatic tertiary amino group and which contains at least one carboxyl group, with said at least one carboxyl group forming at least one intramolecular salt with said tertiary amino group, and contains another carboxyl group which forms a salt with an aliphatic tertiary amine, said at least one ester group and said at least one carboxyl group forming said intramolecular salt being directly connected to an aliphatic or aromatic polyvalent group, the amount of said half-ester compound being about 0.05 to 15% by weight based on the epoxy resin.

Claim 18

In the curing of epoxy resin systems as defined in claim 15, wherein the half-ester compound is a mixture whose main component is represented by the following general formula: ##STR28## wherein R is an aliphatic or aromatic group of two to six valences, A is an aliphatic monovalent group containing an aliphatic tertiary amino group, B is an aliphatic tertiary amine, m is an integer of 1 to 3, and n and q are integers of zero to 4.

Claim 19

In the curing of epoxy resin systems as defined in claim 15, wherein the half-ester compound is a mixture whose main component is represented by the following general formula: ##STR29## wherein R is an aliphatic or aromatic group of two to six valences, A is an aliphatic bivalent group containing an aliphatic tertiary amino group, B is an aliphatic tertiary amine, and q is an integer of zero to 4.

Claim 20

In the curing of epoxy resin systems as defined in claim 15, wherein the aliphatic or aromatic polyvalent group is a residue of a polycarboxylic acid anhydride, which residue remains after removal of the carboxylic acid anhydride groups, which anhydride is selected from the group consisting of pyromellitic acid dianhydride, trimellitic acid anhydride, benzophenone tetracarboxylic acid dianhydride, maleic acid anhydride, phthalic acid anhydride, cyclopentane tetracarboxylic acid dianhydride, hexahydrophthalic acid anhydride, succinic acid anhydride, and mellitic acid trianhydride.

Claim 21

In the curing of epoxy resin systems as defined in claim 15, wherein the aliphatic tertiary amino group is a residue of a tertiary amino alcohol selected from the group consisting of N-hydroxyethyl morpholine, dimethylaminoethanol, diethylaminoethanol, N-methyldiethanolamine, dimethylaminopropanol, N-hydroxypiperidine, 1-hydroxypropylpyridine, and N-hydroxyisopropylmorpholine.

Claim 22

In the curing of epoxy resin systems as defined in claim 2, wherein the half-ester compound is a reaction product of trimellitic acid anhydride with dimethylamino ethanol.

Claim 23

In the curing of epoxy resin systems as defined in claim 2, wherein the half-ester compound is a reaction product of benzophenone tetracarboxylic acid dianhydride with dimethyl aminoethanol.

Claim 24

In the curing of epoxy resin systems as defined in claim 2, wherein the half-ester compound is a reaction product of pyromellitic acid dianhydride with dimethyl aminoethanol.

Claim 25

In the curing of epoxy resin systems as defined in claim 15, wherein the tertiary amine is a member selected from the group consisting of trihexylamine and tributylamine.

Claim 26

In the curing of epoxy resin systems as defined in claim 16, wherein the tertiary amine is a member selected from the group consisting of trihexylamine and tributylamine.

Claim 27

In the curing of epoxy resin systems as defined in claim 1, wherein the half-ester compound contains at least one ester group terminated by an aliphatic tertiary amino group having 3 to 60 carbon atoms and contains at least one carboxyl group forming at least one intramolecular salt with said amino group, said at least one ester group and said at least one carboxyl group being directly connected to a polyvalent group having 2 to 20 carbon atoms, said polyvalent group having one or two free carboxyl groups being directly connected thereto.

Claim 28

The product by the process of claim 1.

Claim 29

The product produced by the process of claim 2.

Claim 30

The product produced by the process of claim 15.

Claim 31

In the curing of epoxy resin systems as defined in claim 1, wherein said at least one intramolecular salt, formed by said at least one carboxylic acid group with said tertiary amino group, is separable upon heating at a temperature higher than 100° C., whereby the half-ester acts as a latent curing catalyst.

Claim 32

In the curing of epoxy resin systems as defined in claim 15, wherein said at least one intramolecular salt, formed by said at least one carboxylic acid group with said tertiary amino group, is separable upon heating at a temperature higher than 100° C., whereby the half-ester acts as a latent curing catalyst.

Claim 33

A thermosettable resin system comprising an epoxy resin and the latent curing catalyst, said latent curing catalyst comprising a half-ester compound which contains at least one ester group-containing radical terminated by an aliphatic tertiary amino group and which contains at least one carboxyl group, with said at least one carboxyl group forming at least one intramolecular salt with said tertiary amino group, said at least one ester group-containing radical and said at least one carboxyl group being directly connected to an aliphatic or aromatic polyvalent group, the amount of said half-ester compound being about 0.05 to 15% by weight based on the epoxy resin in the system.

Claim 34

A thermosettable resin system comprising an epoxy resin and the latent curing catalyst, said latent curing catalyst comprising a half-ester compound which contains at least one ester group-containing radical terminated by an aliphatic tertiary amino group and which contains at least one carboxyl group, with said at least one carboxyl group forming at least one intramolecular salt with said tertiary amino group, said at least one ester group-containing radical and said at least one carboxyl group being directly connected to an aliphatic or aromatic polyvalent group, the amount of said half-ester compound being about 0.05 to 15% by weight based on the epoxy resin in the system.

Claim 35

A thermosettable epoxy resin system as defined in claim 31, wherein the epoxy resin is a polyepoxide having in the molecule more than one vicinal epoxy group.

Claim 36

A thermosettable epoxy resin system as defined in claim 31, in the form of a stable liquid at room temperature, which is rapidly curved to a hard solid at a temperature over 100° C.

Claim 37

A thermosettable epoxy resin system as defined in claim 31, in the form of a powdered solid at room temperature, which fuses and cures to a hard continuous solid at a temperature over 100° C.