Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
198 words
A method of making a GaAs mosfet, the method comprising forming two grooves in a surface of a p-type gallium arsenide single crystal, depositing in each groove a layer of indium, depositing over the indium in each groove a layer of dopant, depositing over the dopant a layer of aluminium, anodically oxidising the surface of the work until all the aluminium is oxidised to Al 2 O 3 and the gallium arsenide is oxidised to a depth contiguous to the dopant, annealing the work to form an n + layer in the gallium arsenide under the grooves and contiguous with the anodically oxidised gallium arsenide, in any order depositing contact metal (i) covering substantially all the anodically oxidised gallium arsenide between the grooves and in contact with both of the layers of Al 2 O 3 , (ii) covering the anodically oxidised gallium arsenide on the remaining side of one groove and in contact with the Al 2 O 3 of that one groove, and (iii) covering the anodically oxidised gallium arsenide on the remaining side of the other groove, and rendering electrically conductive Al 2 O 3 between the dopant and the contact metal (ii) and (iii).
Claim 2
Independent Claim
198 words
A method of making a GaAs mosfet, the method comprising forming two grooves in a surface of a p-type gallium arsenide single crystal, depositing in each groove a layer of indium, depositing over the indium in each groove a layer of dopant, depositing over the dopant a layer of aluminium, anodically oxidising the surface of the work until all the aluminium is oxidised to Al 2 O 3 and the gallium arsenide is oxidised to a depth contiguous to the dopant, annealing the work to form an n + layer in the gallium arsenide under the grooves and contiguous with the anodically oxidised gallium arsenide, in any order depositing contact metal (i) covering substantially all the anodically oxidised gallium arsenide between the grooves and in contact with both of the layers of Al 2 O 3 , (ii) covering the anodically oxidised gallium arsenide on the remaining side of one groove and in contact with the Al 2 O 3 of that one groove, and (iii) covering the anodically oxidised gallium arsenide on the remaining side of the other groove, and rendering electrically conductive Al 2 O 3 between the dopant and the contact metal (ii) and (iii).
Claim 3
Dependent Claim
41 words
The method of claim 1, further comprising, at any stage, depositing successively, on a face of the gallium arsenide single crystal remote from the grooves, a layer each of indium and of metal(s) forming ohmic contacts with the p-type gallium arsenide.
Claim 4
Dependent Claim
26 words
The method of claim 2, further comprising connecting the metal overlying the indium and forming the ohmic contact to a contact wire and a heat sink.
Claim 5
Dependent Claim
22 words
The method of claim 2, wherein the metals forming the ohmic contact are zinc adjacent the indium, and silver overlying the zinc.
Claim 6
Dependent Claim
11 words
The method of claim 1, wherein the contact metal is silver.
Claim 7
Dependent Claim
14 words
The method of claim 1, wherein the annealing lasts from 1 to 10 minutes.
Claim 8
Dependent Claim
17 words
The method of claim 1, wherein the annealing is at a temperature of 300° to 650° C.
Claim 9
Dependent Claim
16 words
The method of claim 7, wherein the annealing is at a temperature of over 500° C.
Claim 10
Dependent Claim
15 words
The method of claim 1, wherein the annealing is performed is an atmosphere of nitrogen.
Claim 11
Dependent Claim
48 words
The method of claim 1, wherein the Al 2 O 3 between the dopant and the contact metal (ii) and (iii) is rendered conductive by applying thereto a voltage sufficient to break down the Al 2 O 3 but insufficient to break down the anodically oxidised gallium arsenide.
Claim 12
Dependent Claim
10 words
A GaAs mosfet produced by the method of claim 1.