Processing aids for high temperature polymers

Claim 2

A composition of matter comprising (a) a polyimide resin containing olefinic unsaturated end groups, and (b) from about 10% to about 35% by weight based on the weight of (a) of an olefinic unsaturated imide compound of the formula ##STR32## wherein R 1 is an alkylene group containing from 2 to 12 carbon atoms; a cycloalkylene group containing from 4 to 6 carbon atoms, an arylene group selected from phenylene, xylylene, tolylene, biphenylene, naphthylene, a substituted arylene group of the formula ##STR33## wherein W is sulfur, carbonyl, --SS--, O, sulfonyl, R 5 and R 6 are independent and each is hydrogen, chloro, bromo, a (lower)alkyl group containing from 1 to 5 carbon atoms, or a (lower) alkoxy group containing from 1 to 5 carbon atoms; or a group having the formula ##STR34## where Y is a covalent bond or --NH--, and R 7 is phenyl, piperidino, H, diphenylamino or di(lower)alkyl amino; R 2 is an alkyl group of from 1 to 8 carbon atoms, an alkenyl group of from 3 to 18 carbon atoms, an aryl group, an alkaryl group, nitrophenyl and aminophenyl; D is a divalent radical containing olefinic unsaturation having the formula ##STR35## wherein R 3 is hydrogen, methyl, bromo or chloro; R 4 is hydrogen, bromo or chloro; Y 1 -y 6 inclusive is selected from the group consisting of hydrogen, bromine, chlorine, nitro, phenyl, alkyl of from 1 to 6 carbon atoms; X is carbonyl, oxygen, sulfur, chloro or bromo substituted methylene, alkylidene of from 1 to 6 carbon atoms, and benzylidene.

Claim 3

A composition according to claim 1 wherein (a) is a polyimide resin having the formula ##STR36## wherein R 8 is a tetravalent aliphatic, cycloaliphatic, aromatic or heterocyclic radical containing at least 2 carbon atoms; R 9 is an alkylene group containing from 2 to 12 carbon atoms; a cycloalkylene group containing from 4 to 6 carbon atoms; an arylene group selected from phenylene, xylylene, tolylene, biphenylene, naphthylene, substituted arylene groups of the formula ##STR37## wherein W is sulfur, carbonyl, ##STR38## --SS--, --O--, ##STR39## sulfonyl, an alkylene group of from 1 to 3 carbon atoms, a di(lower)alkyl silyl group containing from 1 to 5 carbon atoms, a diphenylsilyl group, ##STR40## said lower alkyl containing from 1 to 5 carbon atoms, --N═N--, ##STR41## R 5 and R 6 are independent and each is hydrogen, chloro, or bromo, a (lower) alkyl group containing from 1 to 5 carbon atoms, a (lower) alkoxy group containing from 1 to 5 carbon atoms or a group having the formula ##STR42## where Y is a covalent bond or --NH--, and R 7 is phenyl, piperidino, H, diphenylamino or di(lower)alkyl amino; n is an integer of from 1 to 100; D is a divalent radical containing olefinic unsaturation selected from the group having the formula ##STR43## wherein R 3 is hydrogen, methyl, bromo or chloro; R 4 is hydrogen, bromo or chloro; Y 1 -y 6 inclusive is selected from the group consisting of hydrogen, bromine, chlorine, nitro, phenyl, alkyl of from 1 to 6 carbon atoms; X is carbonyl, oxygen, sulfur, chloro or bromo substituted methylene, alkylidene of from 1 to 6 carbon atoms, and benzylidene.

Claim 4

A composition of claim 2 wherein (a) is a polyimide resin wherein D is a divalent radical containing olefinic unsaturation having the formula ##STR44## wherein R 3 is hydrogen, methyl, bromo or chloro; R 4 is hydrogen, bromo or chloro; X is carbonyl, oxygen, sulfur, chloro or bromo substituted methylene, alkylidene of from 1 to 6 carbon atoms, and benzylidene; Y 1 -y 6 inclusive is selected from the group consisting of hydrogen, bromine, chlorine, alkyl of from 1 to 6 carbon atoms; and n is an integer of from 1 to 15.

Claim 5

A composition of claim 3 wherein (a) is a polyimide resin where D is a divalent radical containing olefinic unsaturation having the formula ##STR45## wherein R 3 is hydrogen or methyl; Y 3 is hydrogen or methyl; and X is methylene or oxygen.

Claim 6

A composition according to claim 4 wherein (a) is a polyimide resin where D has the formula ##STR46## R 9 has the formula ##STR47## wherein V is methylene, O or S; R 8 has the formula ##STR48## (b) is an unsaturated imide compound of the formula ##STR49## wherein D has the formula ##STR50## wherein R 3 is hydrogen or methyl; Y 3 is hydrogen or methyl; X is methylene or oxygen; and R 1 is ortho or meta phenylene or a group having the formula ##STR51## wherein W is O, or S--S or S.

Claim 7

A composition according to claim 1 wherein (a) is a polyimide resin of (1) a dianhydride (2) 4,4'-diaminodiphenylsulfide, and (3) a different diamine, the mole percent ratio of (2):(3) being between about 1:5 to 5:1 respectively.

Claim 8

A composition according to claim 6 wherein said diamine is 4,4'-diaminodiphenylmethane.

Claim 9

A solution of a composition according to claim 1 in a volatile solvent for said composition.

Claim 10

A molding powder comprising the composition according to claim 1.

Claim 11

A composition according to claim 1 wherein the resin (a) is ##STR52## where n is 2, and the imide compound (b) is ##STR53##