US4098843A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Stabilized polyoxymethylene molding compositions
Assignee: EIDP Inc
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Filing: 1976-12-20
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Granted: 1978-07-04
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Expires: 1996-12-20
Abstract
Abstract A stabilized molding composition comprising an admixture of a minor portion of a dispersion of polyamide in a carrier resin and a major portion of polyoxymethylene, wherein the melting or glass transition temperature of the polyamide is higher than the melting temperature of the polyoxymethylene, and a process for preparing these compositions.
Inventors
- 👤 Robert William Johnson
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-24 21:14
CPC Classifications
C; C08; C08L; C08L59/00; C08L59/02; C08L23/00; C08L33/00; C08L33/04; C08L33/06; C08L67/00; C08L67/02; C08L77/00
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
110 words
A stabilized molding composition consisting essentially of an admixture of (a) a major portion of oxymethylene polymer, and (b) a minor portion of a dispersion of polyamide in a carrier resin, the polyamide comprising about from 10 to 50 wt. % of the dispersion and being present in the carrier resin as particles no greater than about 5 microns; the carrier resin being inert to the oxymethylene polymer and having a melting point at or below the processing temperature of the oxymethylene polymer; and the melting temperature of the semi-crystalline polyamide or the glass transition temperature of the amorphous polyamide being higher than the melting temperature of the oxymethylene polymer.
Claim 2
Dependent Claim
110 words
A stabilized molding composition consisting essentially of an admixture of (a) a major portion of oxymethylene polymer, and (b) a minor portion of a dispersion of polyamide in a carrier resin, the polyamide comprising about from 10 to 50 wt. % of the dispersion and being present in the carrier resin as particles no greater than about 5 microns; the carrier resin being inert to the oxymethylene polymer and having a melting point at or below the processing temperature of the oxymethylene polymer; and the melting temperature of the semi-crystalline polyamide or the glass transition temperature of the amorphous polyamide being higher than the melting temperature of the oxymethylene polymer.
Claim 3
Dependent Claim
31 words
A molding composition of claim 1 wherein the polyamide is semi-crystalline and has a melting temperature of at least about 25° C. higher than the melting temperature of the oxymethylene polymer.
Claim 4
Dependent Claim
31 words
A molding composition of claim 1 wherein the polyamide is amorphous and has a glass transition temperature at least about 5° C. higher than the melting temperature of the oxymethylene polymer.
Claim 5
Dependent Claim
20 words
A stabilized molding composition of claim 1 wherein the polyamide has a particle size of less than about 2 microns.
Claim 6
Dependent Claim
22 words
A stabilized molding composition of claim 1 wherein the carrier resin is selected from the group consisting of ethylene polymers and copolymers.
Claim 7
Dependent Claim
25 words
A stabilized molding composition of claim 1 wherein the polyamide/carrier resin dispersion comprises about from 0.1 to 30 weight percent of the stabilized molding composition.
Claim 8
Dependent Claim
29 words
A stabilized molding composition of claim 1 wherein the polyamide/carrier resin dispersion further comprises about from 0.5 to 30 percent, by weight of the dispersion of a compatibilizing agent.
Claim 9
Dependent Claim
121 words
A process for the preparation of a stabilized molding composition which comprises (a) dispersing a polyamide in a carrier resin by blending, at a temperature above the melting temperature of the carrier resin and the melting temperature of semi-crystalline or the glass transition temperature of an amorphous polyamide with shear mixing to subdivide the polyamide to a particle size of less than about 5 microns, and in quantities such that the polyamide comprises about from 10 to 50 wt. % of the resulting polyamide/carrier resin dispersion; and (b) admixing a minor portion of the resulting polyamide/carrier resin dispersion with a major portion of oxymethylene polymer at a temperature above the melting temperature of both the carrier resin and the oxymethylene polymer.
Claim 10
Dependent Claim
121 words
A process for the preparation of a stabilized molding composition which comprises (a) dispersing a polyamide in a carrier resin by blending, at a temperature above the melting temperature of the carrier resin and the melting temperature of semi-crystalline or the glass transition temperature of an amorphous polyamide with shear mixing to subdivide the polyamide to a particle size of less than about 5 microns, and in quantities such that the polyamide comprises about from 10 to 50 wt. % of the resulting polyamide/carrier resin dispersion; and (b) admixing a minor portion of the resulting polyamide/carrier resin dispersion with a major portion of oxymethylene polymer at a temperature above the melting temperature of both the carrier resin and the oxymethylene polymer.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1981-07-03 | 1982-01-02 | 1982-07-04 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1985-07-03 | 1986-01-02 | 1986-07-04 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1989-07-03 | 1990-01-02 | 1990-07-04 | $7700.00 | Window Closed / Lapsed |