Abstract Method of heat treating semiconductor wafers in a continuous operation wherein the wafers are initially introduced into a tube where they are subjected to a heat treatment and then removed from the tube. The wafers are transported through the tube by a pair of horizontally disposed rods on which they are carried and by an additional guide rod which is located above the horizontal plane of the first rods. All three rods have a groove in the form of a screw thread into which the wafers may be seated. All three rods are caused to rotate in the same direction and the frictional contact of the wafers with the walls of each groove causes the wafers to rotate in the opposite direction from the rods while at the same time causing them to advance through the tube while being heated. If it is desired to have the entry speed and the exit speed to be faster or slower than that through the main body of the tube, the pitch of the screw thread may be increased or decreased, respectively, at the entrance and exit of the tube. The rods are preferably made of the same semiconductor material as the wafers.
A heating apparatus for heat treating semiconductor wafers comprising a tubular heating chamber, a pair of rods having similar grooves formed as a screw thread in the respective surfaces rotating at the same speed and in the same direction, said rods being disposed so as to support the total weight of said wafer, the groove of each rod being a trapezoidal cross-sectional shape and size to receive a wafer in a standing up position to frictionally grip the same, said wafers being thereby rotated in a direction opposite to the direction of rotation of the rods, said rods each extending out of the heating chamber at both ends, at least one additional rod which provides guidance to said wafers and having a screw thread type groove therein similar to the grooves in said pair of rods and located to engage said wafers on a side thereof above the plane of support of said wafers by said pair of rods, said additional rod rotating at the same speed and in the same direction as said pair of rods, in which the pitch of said screw thread type groove gradually increases in each rod near the ends of said tubular heating chamber and the upper portions of said wafers not being engaged by said pair of rods and said additional rod.
Claim 2
Dependent Claim
219 words
A heating apparatus for heat treating semiconductor wafers comprising a tubular heating chamber, a pair of rods having similar grooves formed as a screw thread in the respective surfaces rotating at the same speed and in the same direction, said rods being disposed so as to support the total weight of said wafer, the groove of each rod being a trapezoidal cross-sectional shape and size to receive a wafer in a standing up position to frictionally grip the same, said wafers being thereby rotated in a direction opposite to the direction of rotation of the rods, said rods each extending out of the heating chamber at both ends, at least one additional rod which provides guidance to said wafers and having a screw thread type groove therein similar to the grooves in said pair of rods and located to engage said wafers on a side thereof above the plane of support of said wafers by said pair of rods, said additional rod rotating at the same speed and in the same direction as said pair of rods, in which the pitch of said screw thread type groove gradually increases in each rod near the ends of said tubular heating chamber and the upper portions of said wafers not being engaged by said pair of rods and said additional rod.