Wafer packaging system

Claim 1

In a wafer packaging system for clean packaging and damage-free transporting of semiconductor wafers, said system including a tubular outer container and a tubular inner container adapted to be contained by the outer container in sealed relationship, the longitudinal axes of the inner and outer containers extending in the same axial direction, the improvement comprising handling means for inserting and removing the inner container, the outer container being in the form of a cylindrical can having hermetically sealed ends, at least one of said ends being removable, the inner container fitting generally concentrically within the outer container, the inner container having side walls resiliently spaced from the interior of corresponding side walls of the outer container through fin shock-absorbing means and end walls resiliently spaced from the corresponding ends of the outer container through fin shock-absorbing means, said fin shock-absorbing means aligned with the longitudinal axes providing slide means for loading and unloading the inner container, the outer container and inner container both being filled by a fluid environment sealed within the outer container, said fluid environment being noncontaminating and chemically nonreactive to said wafers, whereby, said wafers are maintained in a clean environment preventing long-term change in the characteristics of said wafers, and shocks applied to the outer container are prevented from damaging said wafers.