Method for the preparation of relief structures

Claim 1

In a method for the preparation of relief structures consisting of highly heat resistant polymers comprising the steps of applying a soluble, photo or radiation-sensitive prepolymer in the form of a film or foil to a substrate, said prepolymer being a poly-addition or poly-condensation prepolymer having repeating units of the formula ##STR4## wherein, X and D each comprise a carbocyclic and/or heterocyclic nucleus: G is selected from the group consisting of amide, urea or urethane linkages; R* is an organic radical containing a photo- or radiation induced di- or polymerizable olefinic double bond; and is a component of group COR*, said group bound to said nucleus in ortho or peri-position to G; F is a group capable of reacting with the carbonyl group of COR* to form a cyclic structure upon heating of the prepolymer to liberate R*OH; and wherein F is arranged in ortho- or peri-position to G; x is 1 or 2; and y is 0 or 2 exposing or irradiating the photo or radiation active layer through a negative pattern, dissolving or stripping the unexposed or unirradiated portions and annealing the relief structure obtained; the improvement which comprises using as said R*, a radical represented by the formula; ##STR5## wherein R 1 is alkylene or aralkylene; R 2 is selected from the group consisting of hydrogen, methyl and chlorine, and R 3 is hydrogen.