Abstract The specification describes a process wherein short wavelength or "hard" x-rays (less than about 4 Angstroms) are used to align a semiconductor processing mask with a semiconductor wafer without the requirement for thinning the wafer to permit the x-rays to pass through. These short wavelength x-rays may be obtained from either the continuum x-rays which accompany the "soft" (longer wavelength) characteristic x-rays used for resist exposure, or from a specialized source of hard x-rays. Alternatively, alignment marks may be provided on the surface of the wafer to project alignment-indicative fluorescent x-rays onto an x-ray detector without passing through the underlying semiconductor wafer. A null condition in the intensity of the "hard" x-rays, or the fluorescent x-rays in the alternative embodiment of the invention, which are received at an x-ray detector is indicative of an alignment between a reference mark on the mask and either a reference mark or an opening on the wafer.
A process for aligning a reference area on a mask with a reference area on a substrate which includes: (a) bringing the substrate and mask toward alignment of said reference areas on their respective surfaces, (b) illuminating said reference area on said substrate to cause it to fluoresce, and (c) sensing the quantity of fluorescent x-rays from said reference area on said substrate as indicative of the extent to which said reference areas are aligned.
Claim 2
Dependent Claim
75 words
A process for aligning a reference area on a mask with a reference area on a substrate which includes: (a) bringing the substrate and mask toward alignment of said reference areas on their respective surfaces, (b) illuminating said reference area on said substrate to cause it to fluoresce, and (c) sensing the quantity of fluorescent x-rays from said reference area on said substrate as indicative of the extent to which said reference areas are aligned.
Claim 3
Dependent Claim
21 words
The process defined in claim 1 wherein said reference area is illuminated with x-rays with wavelengths less than about 50 Angstroms.
Claim 4
Dependent Claim
137 words
A process for aligning a reference area on a mask with a corresponding reference area on a substrate including the steps of: (a) bringing the substrate and mask toward alignment of said reference areas on their respective surfaces, (b) bombarding a primary target with an electron beam of energy sufficient to produce x-rays thereat which irradiate two or more secondary fluorescent targets and excite characteristic fluorescent x-rays at said secondary fluorescent targets, (c) projecting said characteristic fluorescent x-rays from said secondary targets to said reference areas on said mask and substrate respectively, and (d) sensing the quantity of x-rays received from both said reference areas as indicitive of the extent to which said reference areas are aligned, whereby the distance between said secondary targets and said primary targets may be adjusted for a particular mask alignment operation.
Claim 5
Dependent Claim
137 words
A process for aligning a reference area on a mask with a corresponding reference area on a substrate including the steps of: (a) bringing the substrate and mask toward alignment of said reference areas on their respective surfaces, (b) bombarding a primary target with an electron beam of energy sufficient to produce x-rays thereat which irradiate two or more secondary fluorescent targets and excite characteristic fluorescent x-rays at said secondary fluorescent targets, (c) projecting said characteristic fluorescent x-rays from said secondary targets to said reference areas on said mask and substrate respectively, and (d) sensing the quantity of x-rays received from both said reference areas as indicitive of the extent to which said reference areas are aligned, whereby the distance between said secondary targets and said primary targets may be adjusted for a particular mask alignment operation.