Method of manufacturing electrically conductive metal layers on substrates

Claim 2

In a method of photochemically metal-plating desired portions of a synthetic resin substrate containing, at least in a surface layer, homogeneously finely dispersed particles of a photo-sensitive semiconductive metal oxide, the light reaction product of which is capable of depositing metals at least as high as copper in the E.M.F. series of metals from a solution of the respective metal salt, by exposing desired portions of said substrate to light and contacting said substrate with said solution of the metal salt thereby causing a metal nuclei image to be formed at the exposed areas of the substrate and then intensifying said metal nuclei image by treatment of the substrate with an electroless plating bath, the improvement wherein as a pretreatment the metal oxide containing substrate before exposure is first contacted with a dipolar aprotic solvent capable of slightly swelling said substrate for a time such that a slight swelling of the substrate is caused and a swollen layer is formed and then with a chemical roughening agent comprising a solution of an inorganic oxidizing acid for a time sufficient to oxidize about half the depth of the swollen layer.

Claim 3

In a method of photochemically metal-plating desired portions of a synthetic resin substrate containing, at least in a surface layer, homogeneously finely dispersed particles of a photo-sensitive semiconductive metal oxide, the light reaction product of which is capable of depositing metals at least as high as copper in the E.M.F. series of metals from a solution of the respective metal salt, by exposing desired portions of said substrate to light and contacting said substrate with said solution of the metal salt thereby causing a metal nuclei image to be formed at the exposed areas of the substrate and then intensifying said metal nuclei image by physical development of the substrate with a stabilized physically developing solution the improvement wherein as a pretreatment the metal oxide containing substrate before exposure is first contacted with a dipolar aprotic solvent capable of slightly swelling said substrate for a time such that a slight swelling of the substrate is caused and a swollen layer is formed and then with a chemical roughening agent comprising a solution of an inorganic oxidizing acid for a time sufficient to oxidize about half the depth of the swollen layer.

Claim 4

In a method of photochemically metal-plating desired portions of a synthetic resin substrate containing, at least in a surface layer, homogeneously finely dispersed particles of a photo-sensitive semiconductive metal oxide, the light reaction product of which is capable of depositing metals at least as high as copper in the E.M.F. series of metals from a solution of the respective metal salt, by exposing desired portions of said substrate to light and contacting said substrate with said solution of the metal salt thereby causing a metal nuclei image to be formed at the exposed areas of the substrate and then intensifying said metal nuclei image by physical development of the substrate with a stabilized physically developing solution the improvement wherein as a pretreatment the metal oxide containing substrate before exposure is first contacted with a dipolar aprotic solvent capable of slightly swelling said substrate for a time such that a slight swelling of the substrate is caused and a swollen layer is formed and then with a chemical roughening agent comprising a solution of an inorganic oxidizing acid for a time sufficient to oxidize about half the depth of the swollen layer.

Claim 5

The method of claim 1 wherein the chemical roughening agent is selected from the group consisting of a mixture of sulfuric acid, phosphoric acid and water, a solution of chromic trioxide in sulfuric acid, a saturated chromic acid solution, a solution of sodium dichromate in fluoboric acid, a solution of potassium permanganate in sulfuric acid and a solution of nitric acid.

Claim 6

The method of claim 2 wherein the chemical roughening agent is selected from the group consisting of a mixture of sulfuric acid, phosphoric acid and water, a solution of chromic trioxide in sulfuric acid, a saturated chromic acid solution, a solution of sodium dichromate in fluoboric acid, a solution of potassium permanganate in sulfuric acid and a solution of nitric acid.