US4083029A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Thin film resistors and contacts for circuitry
Assignee: International Business Machines Corp
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Filing: 1975-07-28
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Granted: 1978-04-04
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Expires: 1995-07-28
Abstract
Abstract Contacts and resistors are provided for circuitry which are very resistant to interdiffusion and which have good stability. In particular, contacts to superconductive circuitry and resistors for superconductive circuitry are provided. In general, a contact or resistor material is in thermodynamic equilibrium with the materials which are to be contacted. Additionally, the contact or resistor is comprised of an intermediate phase or solid solution which is present in stable form in the materials to be contacted. These intermediate phases or solid solutions are multicomponent systems, such as intermetallic compounds. The contacts or resistors can be formed by layering of suitable materials and the invention can be used to provide good chip-module connections for many types of circuitry.
Inventors
- 👤 Syamal K. Lahiri
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-30 12:32
CPC Classifications
H; H10; H10D; H10D86/00; H10D86/80; H10D86/85; H10N; H10N69/00; H10P; H10P95/00; H10N60/00; H10N60/10; H10N60/12; Y; Y10; Y10S; Y10S505/00; Y10S505/825; Y10S505/873; Y10S505/874; Y10S505/881
Claims Analysis
Total Claims: 33
Claim 1
Independent Claim
40 words
A circuit having a first conductor which contacts a second conductor of different composition, said first and second conductors being comprised of the same multi-component solid solution or compound, which exists as a stable phase in each of said conductors.
Claim 2
Dependent Claim
40 words
A circuit having a first conductor which contacts a second conductor of different composition, said first and second conductors being comprised of the same multi-component solid solution or compound, which exists as a stable phase in each of said conductors.
Claim 3
Dependent Claim
12 words
The circuit of claim 1, where said first conductor is a superconductor.
Claim 4
Dependent Claim
16 words
The circuit of claim 1, where said solid solution and said compound are comprised of metals.
Claim 5
Dependent Claim
23 words
The circuit of claim 1, where said first and second conductor include both said solid solution and said compound as stable phases thereof.
Claim 6
Dependent Claim
14 words
The circuit of claim 1, where said first conductor is an alloy of lead.
Claim 7
Dependent Claim
12 words
The circuit of claim 1, where said compound is an intermetallic compound.
Claim 8
Dependent Claim
39 words
A thin film resistor comprising: a substrate on which said resistor is formed, a resistor comprised of an intermetallic compound, a conductor electrically connected to said resistor, said conductor having said intermetallic compound present as a stable phase therein.
Claim 9
Dependent Claim
39 words
A thin film resistor comprising: a substrate on which said resistor is formed, a resistor comprised of an intermetallic compound, a conductor electrically connected to said resistor, said conductor having said intermetallic compound present as a stable phase therein.
Claim 10
Dependent Claim
11 words
The resistor of claim 7, where said conductor is an alloy.
Claim 11
Dependent Claim
11 words
The resistor of claim 7, where said conductor is a superconductor.
Claim 12
Dependent Claim
13 words
The resistor of claim 7, where said resistor includes more than one compound.
Claim 13
Dependent Claim
41 words
A thin film circuit, comprising: a substrate, a resistor comprising a multi-component solid solution, said resistor being formed on said substrate, a conductor electrically connected to said resistor, said conductor having said multi-component solid solution present as a stable phase therein.
Claim 14
Dependent Claim
41 words
A thin film circuit, comprising: a substrate, a resistor comprising a multi-component solid solution, said resistor being formed on said substrate, a conductor electrically connected to said resistor, said conductor having said multi-component solid solution present as a stable phase therein.
Claim 15
Dependent Claim
11 words
The circuit of claim 11, wherein said conductor is an alloy.
Claim 16
Dependent Claim
11 words
The circuit of claim 11, where said conductor is a superconductor.
Claim 17
Dependent Claim
31 words
An interconnective metallurgy for electrical circuits, comprising: first and second conductors having a connective material therebetween, said first and second conductors including said connective material as a multicomponent stable phase thereof.
Claim 18
Dependent Claim
31 words
An interconnective metallurgy for electrical circuits, comprising: first and second conductors having a connective material therebetween, said first and second conductors including said connective material as a multicomponent stable phase thereof.
Claim 19
Dependent Claim
10 words
The metallurgy of claim 14 where said conductors are superconductors.
Claim 20
Dependent Claim
12 words
The metallurgy of claim 14 where said connective material is a superconductor.
Claim 21
Dependent Claim
13 words
The metallurgy of claim 14, where said connective material is a normal material.
Claim 22
Dependent Claim
16 words
The metallurgy of claim 14 where said conductors are located on circuit chips including electrical circuitry.
Claim 23
Dependent Claim
31 words
The metallurgy of claim 14 where said first conductor is located on a chip having circuitry thereon and said second conductor is located on a module having current carrying conductors thereon.
Claim 24
Dependent Claim
16 words
The metallurgy of claim 14, where said first and second conductors are comprised of lead alloys.
Claim 25
Dependent Claim
46 words
A contact arrangement comprising a pair of conductors of different composition which are in contact with one another wherein the material of one of said conductors is comprised of a multi-component phase which is in thermodynamic equilibrium with the material of the other of said conductors.
Claim 26
Dependent Claim
46 words
A contact arrangement comprising a pair of conductors of different composition which are in contact with one another wherein the material of one of said conductors is comprised of a multi-component phase which is in thermodynamic equilibrium with the material of the other of said conductors.
Claim 27
Dependent Claim
15 words
A contact arrangement according to claim 21 wherein said multi-component phase is AuIn 2 .
Claim 28
Dependent Claim
21 words
A contact arrangement according to claim 21 wherein said multi-component phase is a solid solution of lead (Pb) and indium (In).
Claim 29
Dependent Claim
19 words
A circuit arrangement according to claim 21 wherein at least one of said pair of conductors is a superconductor.
Claim 30
Dependent Claim
17 words
A contact arrangement according to claim 21 wherein the other of said conductors is comprised of indium.
Claim 31
Dependent Claim
17 words
A contact arrangement according to claim 21 wherein the other of said conductors is a multi-component phase.
Claim 32
Dependent Claim
21 words
A contact arrangement according to claim 26 wherein the multi-component phase is a solid solution of lead (Pb) and indium (In).
Claim 33
Dependent Claim
22 words
A contact arrangement according to claim 26 wherein said multi-component phase is an alloy of lead (Pb), indium (In) and gold (Au).
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1981-04-03 | 1981-10-03 | 1982-04-04 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1985-04-03 | 1985-10-03 | 1986-04-04 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1989-04-03 | 1989-10-03 | 1990-04-04 | $7700.00 | Window Closed / Lapsed |