US4077045A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Metallization system for semiconductive devices, devices utilizing such metallization system and method for making devices and metallization system
Assignee: Motorola Solutions Inc
•
Filing: 1974-01-03
•
Granted: 1978-02-28
•
Expires: 1994-01-03
Abstract
Abstract A metallization system for metallurgically bonding a semiconductor die to metallic conducting slugs as terminals at the same time, and at the same temperature, that a surrounding glass sleeve is hermetically sealed to the conducting slugs for forming a zener diode, for example, is disclosed. The metallization system comprises a combination of aluminum, tin and palladium, for bonding to molybdenum, the aluminum being vapor deposited followed by a vapor co-deposition of aluminum and tin and further followed by a vapor deposited layer of palladium.
Inventors
- 👤 Richard L. Greeson
- 👤 Elliott M. Philofsky
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 17:12
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/30; B; B23; B23K; B23K35/00; B23K35/001; C; C23; C23C; C23C14/00; C23C14/06; C23C14/14; C23C14/16; H10W20/00; H10W20/40; H10W70/00; H10W70/20; H10W70/24; H10W72/90; H10W76/00; H10W76/10; H10W76/12; H10W76/13; H10W76/138; B23K2035/008; H10W72/071; H10W72/073; H10W72/07331; H10W72/07336; H10W72/07351; H10W72/07355; H10W72/351; H10W72/352; Y; Y10; Y10S; Y10S148/00; Y10S148/033
Claims Analysis
Total Claims: 7
Claim 1
Independent Claim
96 words
A semiconductor device having a metallurgical bond between the semiconductor die and the terminals attached thereto comprising a semiconductor die, a metallization system on each side of said die comprising an aluminum layer on the die and a layer of aluminum and tin mixture on the aluminum layer, terminals each comprising a metal slug of a material selected from the group consisting of molybdenum, copper, nickel, silver, platinum, palladium, rhodium tungsten, and copper clad steel on each side of said die and metallurgically bonded thereto, and a glass preform sealed to each of said metal slugs.
Claim 2
Dependent Claim
96 words
A semiconductor device having a metallurgical bond between the semiconductor die and the terminals attached thereto comprising a semiconductor die, a metallization system on each side of said die comprising an aluminum layer on the die and a layer of aluminum and tin mixture on the aluminum layer, terminals each comprising a metal slug of a material selected from the group consisting of molybdenum, copper, nickel, silver, platinum, palladium, rhodium tungsten, and copper clad steel on each side of said die and metallurgically bonded thereto, and a glass preform sealed to each of said metal slugs.
Claim 3
Dependent Claim
33 words
The device according to claim 1 wherein the metallization system includes a layer of one of the group of metals comprising palladium, rhodium and platinum on said layer of aluminum and tin mixture.
Claim 4
Dependent Claim
19 words
The device according to claim 2 wherein said layer of metal on said aluminum and tin mixture comprises palladium.
Claim 5
Dependent Claim
13 words
The device according to claim 3 wherein said terminals comprise the metal molybdenum.
Claim 6
Dependent Claim
13 words
The device according to claim 3 wherein said terminals comprise copper clad steel.
Claim 7
Dependent Claim
27 words
The device according to claim 4 wherein said molybdenum terminals are coated with a layer of nickel and said nickel is coated with a layer of palladium.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1981-02-27 | 1981-08-29 | 1982-02-28 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1985-02-27 | 1985-08-29 | 1986-02-28 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1989-02-27 | 1989-08-29 | 1990-02-28 | $7700.00 | Window Closed / Lapsed |