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US4071378A Expired / Lapsed US ⏱️ 0.0 years remaining

Process of making a deep diode solid state transformer

Assignee: General Electric Co
•
Filing: 1976-11-04
•
Granted: 1978-01-31
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Expires: 1996-11-04
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Abstract

Abstract An array of columnar structures are provided in a body of semiconductor material. The material of each columnar structure is recrystallized material of the body having solid solubility of dopant metal therein. Means are provided for connecting the columnar structures into two series electrical circuit arrangements to function respectively as the primary and secondary windings of a deep diode solid state transformer.

Inventors

  • 👤 Thomas R. Anthony
  • 👤 Harvey E. Cline

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-09 01:25
CPC Classifications
H; H10; H10D; H10D84/00; H10D84/201; H10D84/204; H10D84/221; H10P; H10P95/00; H10P95/50; H10W; H10W20/00; H10W20/40; H01; H01F; H01F27/00; H01F27/28; H01F27/2804

Claims Analysis

Total Claims: 10
Claim 1
Independent Claim 228 words
A process for making a semiconductor device comprising the process steps of: a. forming a plurality of droplets of a selective metal on a selective portion of a major surface area of a body of semiconductor material having two major opposed surfaces; b. establishing a thermal gradient substantially along an axis of the body perpendicular to the two major opposed surfaces; c. thermal migrating the plurality of droplets of selective metal through the body in the direction of the higher temperature of the thermal gradient from the one major surface to the, and terminating in, the other of the two major opposed surfaces to form a plurality of regions of recrystallized material of the body each having two opposed end surfaces, each end surface being coextensive with only one of the two major surfaces, solid solubility of the selective metal therein and a second and opposite type conductivity than the body and also forming a P-N junction at the contiguous surfaces of each of the regions and the body; d. affixing electrical contact means to selective end surfaces of selective regions to form a series circuit thereof to function as a primary winding of a transformer, and e. affixing electrical contact means to selective end surfaces of the remainder of the regions to form a series circuit thereof to function as a primary winding of the same transformer.
Claim 2
Dependent Claim 228 words
A process for making a semiconductor device comprising the process steps of: a. forming a plurality of droplets of a selective metal on a selective portion of a major surface area of a body of semiconductor material having two major opposed surfaces; b. establishing a thermal gradient substantially along an axis of the body perpendicular to the two major opposed surfaces; c. thermal migrating the plurality of droplets of selective metal through the body in the direction of the higher temperature of the thermal gradient from the one major surface to the, and terminating in, the other of the two major opposed surfaces to form a plurality of regions of recrystallized material of the body each having two opposed end surfaces, each end surface being coextensive with only one of the two major surfaces, solid solubility of the selective metal therein and a second and opposite type conductivity than the body and also forming a P-N junction at the contiguous surfaces of each of the regions and the body; d. affixing electrical contact means to selective end surfaces of selective regions to form a series circuit thereof to function as a primary winding of a transformer, and e. affixing electrical contact means to selective end surfaces of the remainder of the regions to form a series circuit thereof to function as a primary winding of the same transformer.
Claim 3
Dependent Claim 46 words
The process of claim 1 including practicing the process step prior to the forming of the mass of selective metal of selectively etching a selective portion of the major surface of the body to form a depression therein into which the mass of metal is deposited.
Claim 4
Dependent Claim 13 words
The process of claim 2 wherein the mass of metal is vapor deposited.
Claim 5
Dependent Claim 33 words
The process of claim 2 wherein the major surfaces have a preferred planar crystal orientation of (111), and the axis of the body is oriented in a crystal axis direction of <111 >.
Claim 6
Dependent Claim 19 words
The process of claim 4 wherein the material of the body is silicon, silicon carbide, germanium, and gallium arsenide.
Claim 7
Dependent Claim 27 words
The process of claim 5 wherein the material of the body is silicon of N-type conductivity and the solid solubility material in the recrystallized silicon is aluminum.
Claim 8
Dependent Claim 33 words
The process of claim 2 wherein the major surfaces have a preferred planar crystal orientation of (100), and the axis of the body is oriented in a crystal axis direction of <100 >.
Claim 9
Dependent Claim 19 words
The process of claim 7 wherein the material of the body is silicon, silicon carbide, germanium and gallium arsenide.
Claim 10
Dependent Claim 27 words
The process of claim 8 wherein the material of the body is silicon of N-type conductivity, and the solid solubility material in the recrystallized silicon is aluminum.

References Cited (Backward Citations)

US3614554A Cited
US3936319A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1981-01-30 1981-08-01 1982-01-31 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1985-01-30 1985-08-01 1986-01-31 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1989-01-30 1989-08-01 1990-01-31 $7700.00 Window Closed / Lapsed

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