US4069110A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Treatment of beryllium copper surface prior to electroplating
Assignee: Texas Instruments Inc
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Filing: 1976-02-17
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Granted: 1978-01-17
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Expires: 1996-02-17
Abstract
Abstract A process for the surface treatment of beryllium copper prior to electroplating comprising degreasing the material, removing beryllium from the surface thereby leaving a copper-rich surface and activating the copper-rich surface for electroplating. The removal of the beryllium is accomplished by causing the beryllium to form compounds and then dissolving the compounds without dissolving the copper.
Inventors
- 👤 Robert Baboian
- 👤 Gardner S. Haynes
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 13:59
CPC Classifications
C; C25; C25D; C25D5/00; C25D5/34
Claims Analysis
Total Claims: 14
Claim 1
Independent Claim
79 words
A process for surface treatment of beryllium copper material prior to electroplating comprising the steps of: degreasing the material to remove any organic substances; passing the material through an anodic alkaline solution to form beryllium compounds of the beryllium in the beryllium copper both on the surface and just below the surface of the beryllium copper; and passing the material through a concentrated sulfuric acid bath to dissolve the formed beryllium compounds thereby providing for a copper-rich surface skin.
Claim 2
Dependent Claim
79 words
A process for surface treatment of beryllium copper material prior to electroplating comprising the steps of: degreasing the material to remove any organic substances; passing the material through an anodic alkaline solution to form beryllium compounds of the beryllium in the beryllium copper both on the surface and just below the surface of the beryllium copper; and passing the material through a concentrated sulfuric acid bath to dissolve the formed beryllium compounds thereby providing for a copper-rich surface skin.
Claim 3
Dependent Claim
23 words
A process as set forth in claim 1 further comprising a final step of passing the material through a copper surface activating bath.
Claim 4
Dependent Claim
25 words
A process as set forth in claim 1 wherein the alkaline solution is a potassium hydroxide solution with a concentration between 10 and 50 percent.
Claim 5
Dependent Claim
19 words
A process set forth in claim 3 wherein the concentration of the sulfuric acid bath is above 20 percent.
Claim 6
Dependent Claim
23 words
A process as set forth in claim 4 further comprising a final step of passing the material through a copper surface activating bath.
Claim 7
Dependent Claim
89 words
A continuous strip process for treatment of beryllium copper material prior to electroplating comprising the steps of: degreasing the material to remove any organic substances; passing the material through an anodic alkaline solution to form beryllium compounds of the beryllium in the beryllium copper both on the surface and just below the surface of the beryllium copper; passing the material through a concentrated sulfuric acid bath to dissolve the formed beryllium compounds thereby providing for a copper-rich surface skin; and passing the material through a copper surface activating bath.
Claim 8
Dependent Claim
89 words
A continuous strip process for treatment of beryllium copper material prior to electroplating comprising the steps of: degreasing the material to remove any organic substances; passing the material through an anodic alkaline solution to form beryllium compounds of the beryllium in the beryllium copper both on the surface and just below the surface of the beryllium copper; passing the material through a concentrated sulfuric acid bath to dissolve the formed beryllium compounds thereby providing for a copper-rich surface skin; and passing the material through a copper surface activating bath.
Claim 9
Dependent Claim
27 words
A continuous strip process as set forth in claim 6 wherein the alkaline solution is a potassium hydroxide solution with a concentration between 30 and 40 percent.
Claim 10
Dependent Claim
19 words
A process set forth in claim 7 wherein the concentration of the sulfuric acid bath is above 50 percent.
Claim 11
Dependent Claim
87 words
A continuous strip process for treatment of beryllium copper material prior to electroplating comprising the steps of: degreasing the material to remove any organic substances; passing the material through an anodic alkaline solution to form beryllium compounds of the beryllium in the beryllium copper both on the surface and just below the surface of the beryllium copper; and passing the material through a cathodic concentrated sulfuric acid bath to dissolve the formed beryllium compounds thereby providing for a copper-rich surface skin and activating the surface for electroplating.
Claim 12
Dependent Claim
87 words
A continuous strip process for treatment of beryllium copper material prior to electroplating comprising the steps of: degreasing the material to remove any organic substances; passing the material through an anodic alkaline solution to form beryllium compounds of the beryllium in the beryllium copper both on the surface and just below the surface of the beryllium copper; and passing the material through a cathodic concentrated sulfuric acid bath to dissolve the formed beryllium compounds thereby providing for a copper-rich surface skin and activating the surface for electroplating.
Claim 13
Dependent Claim
90 words
A process for electroplating beryllium copper material comprising the steps of: degreasing the material to remove any organic substances; passing the material through an anodic alkaline solution to form beryllium compounds of the beryllium in the beryllium copper on the surface and just below the surface of the beryllium copper; passing the material through a concentrated sulfuric acid bath to dissolve the formed beryllium compounds thereby providing for a copper-rich surface skin; passing the material through a copper surface activating bath; and electroplating the material with a suitable plating material.
Claim 14
Dependent Claim
90 words
A process for electroplating beryllium copper material comprising the steps of: degreasing the material to remove any organic substances; passing the material through an anodic alkaline solution to form beryllium compounds of the beryllium in the beryllium copper on the surface and just below the surface of the beryllium copper; passing the material through a concentrated sulfuric acid bath to dissolve the formed beryllium compounds thereby providing for a copper-rich surface skin; passing the material through a copper surface activating bath; and electroplating the material with a suitable plating material.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1981-01-16 | 1981-07-18 | 1982-01-17 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1985-01-16 | 1985-07-18 | 1986-01-17 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1989-01-16 | 1989-07-18 | 1990-01-17 | $7700.00 | Window Closed / Lapsed |