Process for treating selected areas of a surface with solder

Claim 1

A process for treating selected areas of a surface with solder which comprises: A. screen printing on the surface of a substrate a liquid photopolymerizable ink, thereby leaving on the surface of said substrate an image corresponding to the image on said silk screen the screen printing ink comprising i. 35-70% by weight of an aryloxyalkyl acrylate having the general formula: ##STR4## wherein X is methylene, an alkyl-substituted methylene group, a dialkyl-substituted methylene group, a carbonyl group, a sulfide, a sulfoxide, a sulfone, an amine, an alkyl-substituted amine, an ethylene ether, a propylene ether or, a 2-hydroxylpropylene ether, wherein each alkyl group contains from 1 to 8 carbon atoms; Y is lower alkyl or lowerhydroxyalkyl of 2 to 8 carbon atoms; A is an unsaturated acyloxy group having from 3 to 18 carbon atoms; and n is 0 through 20, m is 0 or 1, p is 0 or 1; ii. 15-45% by weight of a photopolymerizable diluent having terminal ethylenic groups selected from ethylene diacrylate; diethylene glycol diacrylate; tetraethylene glycol diacrylate; glycerol diacrylate; glycerol triacrylate; ethylene dimethacrylate; 1,3-propylene dimethacrylate; 1,2,4-butanetriol trimethacrylate; 1,4-benzenediol dimethacrylate; pentaerythritol tetramethacrylate; 1,3-propanediol diacrylate; 1,6-hexanediol diacrylate; the bis-acrylate of a polyethylene glycol having a molecular weight of 200 to 500; bis-methacrylate of a polyethylene glycol having a molecular weight of 200 to 500; trimethylolpropane triacrylate; pentaerythritol triacrylate; methylene bis-acrylamide; methylene bis-methacrylamide; 1,6-hexamethylene bis-acrylamide; diethylene triamine tri-methacrylamide; bis-(methacrylamidopropoxy) ethane; bis-methacrylamidoethyl methacrylate N-(beta-hydroxyethyloxy) ethyl acrylamide; divinyl succinate; divinyl adipate; divinyl phthalate; divinyl terephthalate; divinyl benzene-1,3-disulfonate; divinyl butane-1,4-disulfonate; and sorbaldehyde; iii. 0.1-10% by weight of a free radical generating addition polymerizing initiating system; said photopolymerizable composition having a viscosity of from 5,000 to 200,000 centipoises and a thixotropic index of from 1.00 to 6.00; B. exposing the photopolymerizing ink film on such substrate to actinic radiation to cure said ink; C. applying solder to the substrate, thereby forming a solder covered substrate in an image corresponding to the areas of exposed substrate not coated with the photopolymerizable ink.