US4061703A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of patching voids in a semi-conductive component of insulated electric cable, and compound therefor
Assignee: Vulkor Inc
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Filing: 1974-05-16
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Granted: 1977-12-06
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Expires: 1994-05-16
Abstract
Abstract The mending of defective semiconductive components of insulated electrical cable, comprising filling and sealing voids or breaks within a body of semiconductive material with a curable semiconductive patching compound comprising the combination of chlorosulfonated polyethylene, conductive filler and lauroyl peroxide, and heating the patching compound to cure the same.
Inventors
- 👤 Sidney Rothenberg
- 👤 Joseph Edward Vostovich
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-08 04:25
CPC Classifications
H; H01; H01B; H01B13/00; H01B13/30
Claims Analysis
Total Claims: 21
Claim 1
Independent Claim
82 words
A method of patching voids in a body of a semiconductive component of an insulated electrical cable, comprising the steps of filling a void in a semiconductive body with a curable semiconductive polymeric compound consisting essentially of chlorosulfonated polyethylene, conductive filler material, and lauroyl peroxide in an amount of about 2 to about 8 parts by weight per 100 parts by weight of the chlorosulfonated polyethylene, and heating the curable semiconductive polymeric composition to a temperature of at least about 200° F.
Claim 2
Independent Claim
82 words
A method of patching voids in a body of a semiconductive component of an insulated electrical cable, comprising the steps of filling a void in a semiconductive body with a curable semiconductive polymeric compound consisting essentially of chlorosulfonated polyethylene, conductive filler material, and lauroyl peroxide in an amount of about 2 to about 8 parts by weight per 100 parts by weight of the chlorosulfonated polyethylene, and heating the curable semiconductive polymeric composition to a temperature of at least about 200° F.
Claim 3
Dependent Claim
31 words
The method of claim 1, wherein the curable semiconductive polymeric compound is heated to a temperature of at least about 200° F for a period of at least about 60 minutes.
Claim 4
Dependent Claim
14 words
The method of claim 1, wherein the curable semiconductive polymeric compound comprises a coagent.
Claim 5
Dependent Claim
30 words
The method of claim 1, wherein the curable semiconductive polymeric compound is heated to a temperature of approximately 250° F for a period of about 30 to about 60 minutes.
Claim 6
Independent Claim
104 words
A method of patching voids in a body of a semiconductive component of an insulated electrical cable, comprising the steps of filling a void in a semiconductive body with a curable semiconductive polymeric compound consisting essentially of a blend containing ethylene-propylene rubber and at least about 65% by weight of the polymeric contents of chlorosulfonated polyethylene, conductive filler material, and lauroyl peroxide in an amount of about 2 to about 8 parts by weight per 100 parts by weight of the blend of ethylene-propylene rubber and chlorosulfonated polyethylene, and heating the curable semiconductive polymeric composition to a temperature of at least about 200° F.
Claim 7
Independent Claim
104 words
A method of patching voids in a body of a semiconductive component of an insulated electrical cable, comprising the steps of filling a void in a semiconductive body with a curable semiconductive polymeric compound consisting essentially of a blend containing ethylene-propylene rubber and at least about 65% by weight of the polymeric contents of chlorosulfonated polyethylene, conductive filler material, and lauroyl peroxide in an amount of about 2 to about 8 parts by weight per 100 parts by weight of the blend of ethylene-propylene rubber and chlorosulfonated polyethylene, and heating the curable semiconductive polymeric composition to a temperature of at least about 200° F.
Claim 8
Dependent Claim
31 words
The method of claim 5, wherein the curable semiconductive polymeric compound is heated to a temperature of at least about 200° F for a period of at least about 60 minutes.
Claim 9
Dependent Claim
19 words
The method of claim 5, wherein the curable semiconductive polymeric compound comprises a free radical crosslink cure enhancing coagent.
Claim 10
Dependent Claim
30 words
The method of claim 5, wherein the curable semiconductive polymeric compound is heated to a temperature of approximately 250° F for a period of about 30 to about 60 minutes.
Claim 11
Independent Claim
115 words
A method of patching voids in a body of a semiconductive component of an insulated electrical cable, comprising the steps of filling a void in a semiconductive body with a curable semiconductive polymeric compound comprising at least about 75% to about 100% by weight of the polymeric material of chlorosulfonated polyethylene and 0 to about 25% by weight of the polymeric material of ethylene-propylene rubber, conductive carbon black filler, and about 2 to about 8 parts by weight of lauroyl peroxide per 100 parts by weight of said polymeric material, and heating the curable semiconductive polymeric compound to a temperature of at least about 200° F for a period of at least about 20 minutes.
Claim 12
Independent Claim
115 words
A method of patching voids in a body of a semiconductive component of an insulated electrical cable, comprising the steps of filling a void in a semiconductive body with a curable semiconductive polymeric compound comprising at least about 75% to about 100% by weight of the polymeric material of chlorosulfonated polyethylene and 0 to about 25% by weight of the polymeric material of ethylene-propylene rubber, conductive carbon black filler, and about 2 to about 8 parts by weight of lauroyl peroxide per 100 parts by weight of said polymeric material, and heating the curable semiconductive polymeric compound to a temperature of at least about 200° F for a period of at least about 20 minutes.
Claim 13
Dependent Claim
30 words
The method of claim 9, wherein the curable semiconductive polymeric compound is heated to a temperature of approximately 250° F for a period of about 30 to about 60 minutes.
Claim 14
Independent Claim
110 words
A method of patching voids in a body of semiconductive component of an insulated electrical cable, comprising the steps of filling a void in a semiconductive body with a curable semiconductive polymeric compound comprising about 75 to 100 parts by weight of chlorosulfonated polyethylene, 0 to about 25 parts by weight of ethylene-propylene rubber, about 15 to about 100 parts by weight of conductive carbon black filler, and a curing agent consisting essentially of about 2 to about 8 parts by weight of lauroyl peroxide, and heating the curable semiconductive polymeric compound to a temperature of at least about 200° F for a period of at least about 30 minutes.
Claim 15
Independent Claim
110 words
A method of patching voids in a body of semiconductive component of an insulated electrical cable, comprising the steps of filling a void in a semiconductive body with a curable semiconductive polymeric compound comprising about 75 to 100 parts by weight of chlorosulfonated polyethylene, 0 to about 25 parts by weight of ethylene-propylene rubber, about 15 to about 100 parts by weight of conductive carbon black filler, and a curing agent consisting essentially of about 2 to about 8 parts by weight of lauroyl peroxide, and heating the curable semiconductive polymeric compound to a temperature of at least about 200° F for a period of at least about 30 minutes.
Claim 16
Dependent Claim
30 words
The method of claim 11, wherein the curable semiconductive polymeric compound is heated to a temperature of approximately 250° F for a period of about 30 to about 60 minutes.
Claim 17
Dependent Claim
38 words
The method of claim 11, wherein the curable semiconductive polymeric compound comprises a free radical crosslink cure enhancing coagent in amount of up to about 5 parts by weight per 100 parts by weight of curable polymeric material.
Claim 18
Independent Claim
122 words
A method of patching voids in a body of a semiconductive component of an insulated electrical cable, comprising the steps of filling a void in a semiconductive body with a curable semiconductive polymeric compound consisting essentially of about 75 to 100 parts by weight of chlorosulfonated polyethylene 0 to about 25 parts by weight of ethylene-propylene rubber, about 15 to about 100 parts by weight of conductive filler, about 0.5 to about 5 parts by weight of a curing coagent, and about 2 to about 8 parts by weight of lauroyl peroxide and heating the curable semiconductive polymeric compound to a temperature of at least about 200° F up to about 250° F for a period of at least about 20 minutes.
Claim 19
Independent Claim
122 words
A method of patching voids in a body of a semiconductive component of an insulated electrical cable, comprising the steps of filling a void in a semiconductive body with a curable semiconductive polymeric compound consisting essentially of about 75 to 100 parts by weight of chlorosulfonated polyethylene 0 to about 25 parts by weight of ethylene-propylene rubber, about 15 to about 100 parts by weight of conductive filler, about 0.5 to about 5 parts by weight of a curing coagent, and about 2 to about 8 parts by weight of lauroyl peroxide and heating the curable semiconductive polymeric compound to a temperature of at least about 200° F up to about 250° F for a period of at least about 20 minutes.
Claim 20
Independent Claim
129 words
A method of patching voids in a body of a semiconductive compound of an insulating electrical cable, comprising the steps of filling a void in a semiconductive body with a curable semiconductive polymeric compound consisting essentially of about 75 to 100 parts by weight chlorosulfonated polyethylene, 0 to about 25 parts by weight of ethylene-propylene rubber, about 50 to about 100 parts by weight of conductive carbon black, about 2 to about 8 parts by weight of lauroyl peroxide, about 0.5 to about 5 parts by weight of a curing coagent, hydrocarbon oil, litharge, hydrocarbon wax, and antioxidant, and heating the curable semiconductive polymeric compound to a temperature of at least about 200° F up to about 250° F for a period of about 30 to about 60 minutes.
Claim 21
Independent Claim
129 words
A method of patching voids in a body of a semiconductive compound of an insulating electrical cable, comprising the steps of filling a void in a semiconductive body with a curable semiconductive polymeric compound consisting essentially of about 75 to 100 parts by weight chlorosulfonated polyethylene, 0 to about 25 parts by weight of ethylene-propylene rubber, about 50 to about 100 parts by weight of conductive carbon black, about 2 to about 8 parts by weight of lauroyl peroxide, about 0.5 to about 5 parts by weight of a curing coagent, hydrocarbon oil, litharge, hydrocarbon wax, and antioxidant, and heating the curable semiconductive polymeric compound to a temperature of at least about 200° F up to about 250° F for a period of about 30 to about 60 minutes.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1980-12-05 | 1981-06-06 | 1981-12-06 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1984-12-05 | 1985-06-06 | 1985-12-06 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1988-12-05 | 1989-06-06 | 1989-12-06 | $7700.00 | Window Closed / Lapsed |