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US4060191A Expired / Lapsed US ⏱️ 0.0 years remaining

Method of soldering with phosphoric acid soldering flux

Assignee: Allegheny Ludlum Corp
•
Filing: 1976-06-25
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Granted: 1977-11-29
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Expires: 1996-06-25
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Abstract

Abstract A phosphoric acid flux with good fluxing efficiency and high viscosity, and one which is especially suitable for use in the soldering of copper and copper-plated stainless steel. The flux is in the form of a viscous fluid, or a thermally unstable emulsion when the fluid is combined with a pasty vehicle. The viscous fluid contains phosphoric acid and an organic material (molecular weight between 4,000 and 20,000) from the group consisting of polyethers and polyimines or mixtures thereof having an atomic ratio of carbon to ether oxygen plus imine nitrogen between 1.5 and 3.1.

Inventors

  • 👤 Edward G. Choby, Jr.

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-28 20:04
CPC Classifications
B; B23; B23K; B23K35/00; B23K35/22; B23K35/36; B23K35/3612; B23K35/3613; B23K35/3601; B23K35/3611

Claims Analysis

Total Claims: 9
Claim 1
Independent Claim 134 words
In the soldering of copper and copper-plated stainless steel wherein metal selected from the group consisting of copper and copper-plated stainless steel is placed in close proximity with other metal, solder and soldering flux, and wherein said solder is melted and applied to said metals in such a way that it solidifies and effects a bond therebetween; the improvement which comprises utilizing a soldering flux comprised of a viscous fluid; said fluid consisting essentially of, in weight percent, 35 to 85% phosphoric acid, 15 to 65% of organic material selected from the group consisting of polyethers and polyimines and mixtures thereof having an atomic ratio of carbon to ether oxygen plus imine nitrogen between 1.5 and 3.1, and from 0 to 30% water; and organic material having a molecular weight between 4,000 and 20,000.
Claim 2
Dependent Claim 134 words
In the soldering of copper and copper-plated stainless steel wherein metal selected from the group consisting of copper and copper-plated stainless steel is placed in close proximity with other metal, solder and soldering flux, and wherein said solder is melted and applied to said metals in such a way that it solidifies and effects a bond therebetween; the improvement which comprises utilizing a soldering flux comprised of a viscous fluid; said fluid consisting essentially of, in weight percent, 35 to 85% phosphoric acid, 15 to 65% of organic material selected from the group consisting of polyethers and polyimines and mixtures thereof having an atomic ratio of carbon to ether oxygen plus imine nitrogen between 1.5 and 3.1, and from 0 to 30% water; and organic material having a molecular weight between 4,000 and 20,000.
Claim 3
Dependent Claim 26 words
An improvement according to claim 1, wherein said viscous fluid has 40 to 80% phosphoric acid, 20 to 60% organic material, and 0 to 20% water.
Claim 4
Dependent Claim 18 words
An improvement according to claim 1, wherein said organic material has a molecular weight between 6,000 and 10,000.
Claim 5
Dependent Claim 24 words
An improvement according to claim 1, wherein said organic material is from the group consisting of polyethylene glycol, polypropylene glycol, methyl cellulose and polyethyleneimine.
Claim 6
Dependent Claim 13 words
An improvement according to claim 4, wherein said organic material is polyethylene glycol.
Claim 7
Dependent Claim 25 words
An improvement according to claim 1, wherein said flux consists essentially of said viscous fluid and from 30 to 70%, by weight, of pasty vechicle.
Claim 8
Dependent Claim 12 words
An improvement according to claim 6, wherein said pasty vehicle is petrolatum.
Claim 9
Dependent Claim 18 words
An improvement according to claim 6 wherein said flux has from 33 to 40% of said pasty vehicle.

References Cited (Backward Citations)

US2987817A Cited
US3486948A Cited
US3589952A Cited
US3597285A Cited
US3660127A Cited
US3865641A Cited
US3814638A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1980-11-28 1981-05-30 1981-11-29 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1984-11-28 1985-05-30 1985-11-29 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1988-11-28 1989-05-30 1989-11-29 $7700.00 Window Closed / Lapsed

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