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US4054824A Expired / Lapsed US ⏱️ 0.0 years remaining

Wire bonding unit using infra-red ray detector

Assignee: Fujitsu Ltd
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Filing: 1976-05-03
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Granted: 1977-10-18
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Expires: 1996-05-03
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Abstract

Abstract A wire bonding system is disclosed wherein a patterned substrate to be bonded is composed of at least two materials having different emission rates of infra-red rays, and a point to be bonded on the patterned substrate is positioned so as to coincide with a predetermined reference position. The present invention includes a servo-mechanism, which moves the patterned substrate, and a detecting element which scans the surface of the patterned substrate in a linear direction and detects the infra-red rays radiated therefrom. A pattern figure is obtained by using the differences in the emission rate of the infra-red rays caused by the material of the pattern. A signal which indicates the pattern figure is compared with another signal which indicates the reference position, and a control signal, corresponding to the difference between the point on the pattern to be bonded and the reference position, is obtained. The servo-mechanism is controlled by said control signal so that the point to be bonded is placed at the reference position.

Inventors

  • 👤 Hideya Nishioka

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-29 20:14
CPC Classifications
H; H10; H10W; H10W46/00; H10W99/00; H10W46/601

Claims Analysis

Total Claims: 13
Claim 1
Independent Claim 191 words
Wire bonding unit for positioning a work having a pattern thereon composed of at least two materials having different emission rates of infra-red rays so that a position to be bonded with a wire on said pattern coincides with a predetermined reference position, said wire bonding unit comprising: a servo-mechanism means for relatively moving said work with respect to said reference position; an infra-red ray detecting means for detecting the infra-red rays radiated from said pattern by scanning the surface of said work in a first direction; a pattern signal generating means for generating a signal corresponding to a portion of said scanned pattern obtained in accordance with the difference in the emission rates of infra-red rays from said materials, and; means for generating a reference signal indicating when said detecting scans across said predetermined reference position; a controlling means for comparing said pattern signal with said reference signal and producing a control signal corresponding to the distance between said position to be bonded and said predetermined reference position, and for controlling said servo-mechanism by said control signal so that said position to be bonded coincides with said predetermined reference position.
Claim 2
Dependent Claim 191 words
Wire bonding unit for positioning a work having a pattern thereon composed of at least two materials having different emission rates of infra-red rays so that a position to be bonded with a wire on said pattern coincides with a predetermined reference position, said wire bonding unit comprising: a servo-mechanism means for relatively moving said work with respect to said reference position; an infra-red ray detecting means for detecting the infra-red rays radiated from said pattern by scanning the surface of said work in a first direction; a pattern signal generating means for generating a signal corresponding to a portion of said scanned pattern obtained in accordance with the difference in the emission rates of infra-red rays from said materials, and; means for generating a reference signal indicating when said detecting scans across said predetermined reference position; a controlling means for comparing said pattern signal with said reference signal and producing a control signal corresponding to the distance between said position to be bonded and said predetermined reference position, and for controlling said servo-mechanism by said control signal so that said position to be bonded coincides with said predetermined reference position.
Claim 3
Dependent Claim 149 words
Wire bonding unit according to claim 1, wherein said controlling means comprises: a differentiation circuit for differentiating said pattern signal which corresponds to said pattern figure; a flip-flop circuit which is set by the output of said differentiation circuit and is reset by said reference signal which indicates said predetermined position; an oscillator which generates high frequency pulses; an AND gate which passes said high frequency generated by said oscillator when said flip-flop circuit is set; a preset counter being preset with a predetermined number of pulses corresponding to said predetermined reference position whose content decreases by one pulse as every said output pulse is supplied and which generates the number of pulses corresponding to the difference between said position to be bonded and said predetermined reference position, and; a digital analog converter which converts the output of said preset counter to an analog signal for controlling said servo-mechanism.
Claim 4
Dependent Claim 92 words
A wire bonding system for bonding a wire to a predetermined point on a work piece, comprising: means for holding said work piece; means for bonding said wire to said held work piece; means for scanning said held work piece and producing an output signal; means responsive to said scanning means output signal for positioning said held work piece with respect to said bonding means, wherein said responsive means stops said positioning when said predetermined point on said work piece is positioned to be bonded with said wire by said bonding means.
Claim 5
Dependent Claim 92 words
A wire bonding system for bonding a wire to a predetermined point on a work piece, comprising: means for holding said work piece; means for bonding said wire to said held work piece; means for scanning said held work piece and producing an output signal; means responsive to said scanning means output signal for positioning said held work piece with respect to said bonding means, wherein said responsive means stops said positioning when said predetermined point on said work piece is positioned to be bonded with said wire by said bonding means.
Claim 6
Dependent Claim 37 words
A wire bonding system as in claims 3, wherein said scanning means detects infra-red rays emitted from discrete portions of said held work piece and produces an electrical signal which varies according to said detected infra-red rays.
Claim 7
Dependent Claim 47 words
A wire bonding system as in claim 4, wherein said scanning means includes means for optically focusing an image of said held work piece onto an image plane, and means located intermediate said focusing means in said image plane for shifting said image across said image plane.
Claim 8
Dependent Claim 20 words
A wire bonding system as in claim 5, wherein said scanning means includes an infra-red detector in said image plane.
Claim 9
Dependent Claim 18 words
A wire bonding system as in claim 5, wherein said focusing means includes a plurality of reflector elements.
Claim 10
Dependent Claim 16 words
A wire bonding system as in claim 5, wherein said shifting means comprises a vibrating mirror.
Claim 11
Dependent Claim 39 words
A wire bonding system as in claim 3, wherein said positioning means includes means for measuring the relative distance between said predetermined point and said bonding means, and means for driving said holding means according to said measured distance.
Claim 12
Dependent Claim 42 words
A wire bonding system as in claim 9, wherein said measuring means includes an oscillator for producing a continuous timing signal, means for receiving said scanning means output signal and gating said timing signal as a function of said measured relative distance.
Claim 13
Dependent Claim 22 words
A wire bonding system as in claim 3, wherein said scanning means includes means for scanning said work piece in orthogonal directions.

References Cited (Backward Citations)

US3775011A Cited
US3955072A Cited
US3803474A Cited
US3731098A Cited
US3805073A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1980-10-17 1981-04-18 1981-10-18 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1984-10-17 1985-04-18 1985-10-18 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1988-10-17 1989-04-18 1989-10-18 $7700.00 Window Closed / Lapsed

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