US4031272A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Hybrid integrated circuit including thick film resistors and thin film conductors and technique for fabrication thereof
Assignee: AT&T Inc
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Filing: 1975-05-09
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Granted: 1977-06-21
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Expires: 1995-05-09
Abstract
Abstract A technique for the fabrication of hybrid integrated circuitry combining the expedients of thick and thin film technology is described. A novel processing sequence for attaining ohmic contact between thick film resistors and thin film conductive metallization involves the use of an interphase gold tab as a conductive link.
Inventors
- 👤 Satya Pal Khanna
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-26 08:37
CPC Classifications
H; H01; H01C; H01C17/00; H01C17/28; H01C17/281; H01C1/00; H01C1/14; H01C1/142; H01C7/00; H05; H05K; H05K1/00; H05K1/16; H05K1/167; H05K1/02; H05K1/09; H05K1/092; H05K2203/00; H05K2203/14; H05K2203/1453; H05K3/00; H05K3/10; H05K3/14; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49082; Y10T29/49099
Claims Analysis
Total Claims: 4
Claim 1
Independent Claim
61 words
Technique for fabricating a hybrid integrated circuit including the steps of successively depositing a thick film resistor and thin film conductive metallization upon a substrate characterized in that gold tabs are deposited upon the substrate by screen printing of a gold paste and subsequent firing prior to deposition of the thick film resistor, the gold tabs serving as resistor termination pads.
Claim 2
Dependent Claim
61 words
Technique for fabricating a hybrid integrated circuit including the steps of successively depositing a thick film resistor and thin film conductive metallization upon a substrate characterized in that gold tabs are deposited upon the substrate by screen printing of a gold paste and subsequent firing prior to deposition of the thick film resistor, the gold tabs serving as resistor termination pads.
Claim 3
Dependent Claim
15 words
Technique in accordance with claim 1 wherein the conductive metallization comprises titanium, palladium and gold.
Claim 4
Dependent Claim
26 words
Technique in accordance with claim 1 wherein the thick film resistor is deposited by screen printing of a resistive composition and subsequent firing at 950° C.
References Cited (Backward Citations)
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US3547604A
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US3560256A
Cited
US3477055A
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1980-06-20 | 1980-12-20 | 1981-06-21 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1984-06-20 | 1984-12-20 | 1985-06-21 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1988-06-20 | 1988-12-20 | 1989-06-21 | $7700.00 | Window Closed / Lapsed |