Flame retardant thermosetting resin

Claim 2

A flame retardant thermosetting resin composition essentially comprising (a) a liquid butadiene-containing resin having an average molecular weight of about 1000 to about 5000 and being selected from the group consisting of acryloyloxy- and methacryloyloxy-terminated homopolymer of butadiene and copolymer of butadiene with acrylonitrile or styrene that contain at least about 70 weight percent of butadiene, said butadiene-containing resin having from about 1.5 to about 3.0 terminating acryloyloxyl or methacryloyloxyl groups per molecule of said butadiene-containing resin, (b) between about 150 and 500 weight percent based on said butadiene-containing resin of one or more ethylenically unsaturated monomers each of which is copolymerizable with end vinyl groups of said terminating groups of said butadiene-containing resin and with at least one of said monomers containing halogen directly attached to aryl in an amount sufficient to provide from about 25 to about 70 weight percent based on said composition of said halogen directly attached to aryl, (c) between about 5 and about 20 weight percent based on said butadiene-containing resin of ethylenically unsaturated acid anhydride and (d) between about 0.1 and 2.0 weight percent, based on the total weight of the resin composition of peroxide hardening agents or photosensitizers for promoting light-hardening.

Claim 3

A flame retardant thermosetting resin composition according to claim 1 wherein at least about 70 weight percent of said butadiene-containing resin is 1,2-polybutadiene.

Claim 4

A flame retardant thermosetting resin composition according to claim 1 further including for said composition a hardening agent in an amount between about 0.1 and about 2 weight percent based on the total weight of said composition.

Claim 5

A flame retardant thermosetting resin composition according to claim 3 wherein said hardening agent is a peroxide selected from the group of benzoyl peroxide, lauroyl peroxide, dicumyl peroxide, methyl ethyl ketone peroxide, dibutyl peroxide and cumene hydroperoxide.

Claim 6

A flame retardant thermosetting resin composition according to claim 3 wherein said hardening agent is a photosensitizer selected from the group of benzoin, benzophenone, benzoin ethyl ether and 2-methyl-anthraquinone.

Claim 7

A flame retardant thermosetting resin composition according to claim 1 wherein the halogen of said ethylenically unsaturated monomer is chlorine or bromine and is attached directly to a benzene ring of said monomer.

Claim 8

A flame retardant thermosetting resin composition according to claim 1 wherein said ethylenically unsaturated monomer containing halogen is selected from the group of monobromostyrene, dibromosytrene, tribromophenyl acrylate, tribromophenyl methacrylate, 2,2-bis-(4'-allyloxy-3',5'-dibromophenyl) propane, monobromophenyl allyl ether, dibromophenyl allyl ether, tribromophenyl allyl ether, monochlorostyrene and dichlorostyrene.

Claim 9

A flame retardant thermosetting resin composition according to claim 1 wherein said ethylenically unsaturated acid anhydride is selected from the group of maleic acid anhydride, itaconic acid anhydride, dodecenyl succinic acid anhydride, methyl-endo-methylene-tetrahydrophthalic acid anhydride, tetrahydrophthalic acid anhydride and methyltetrahydrophthalic acid anhydride.

Claim 10

A flame retardant thermosetting resin composition according to claim 1 wherein said halogen is about 25 to about 50 weight percent based on said composition.

Claim 11

A flame retardant thermosetting resin composition according to claim 1 wherein said halogen is about 28 to about 40 weight percent based on said composition.

Claim 12

A flame retardant thermosetting resin composition according to claim 7 wherein another ethylenically unsaturated monomer is included and is selected from the group of styrene, divinyl-benzene, methyl methacrylate, methyl acrylate, glycidyl methacrylate, and ethylene dimethacrylate.

Claim 13

A flame retardant printed circuit board which includes an electrically conductive material and an electrically insulating radically reactive thermosetting resin composition essentially comprising (a) a liquid butadiene-containing resin having an average molecular weight of about 1000 to about 5000 and being selected from the group consisting of acryloyloxy- and methacryloyloxy-terminated homopolymer of butadiene and copolymer of butadiene with acrylonitrile or styrene that contain at least about 70 weight percent of butadiene, said butadiene-containing resin having from about 1.5 to about 3.0 terminating acryloyloxyl or methacryloyloxyl groups per molecule of said butadiene-containing resin, (b) between about 150 and about 500 weight percent based on said butadiene-containing resin of one or more ethylenically unsaturated monomers each of which is copolymerizable with end vinyl groups of said terminating groups of said butadiene-containing resin and with at least one of said monomers containing halogen directly attached to aryl in an amount sufficient to provide from about 25 to about 70 weight percent based on said composition of said halogen attached to aryl, (c) between about 5 and about 20 weight percent based on said butadiene-containing resin of ethylenically unsaturated acid anhydride, and (d) between about 0.1 and 2.0 weight percent, based on the total weight of the resin composition of peroxide hardening agents or photosensitizers for promoting light hardening.

Claim 14

A flame retardant printed circuit board which includes an electrically conductive material and an electrically insulating radically reactive thermosetting resin composition essentially comprising (a) a liquid butadiene-containing resin having an average molecular weight of about 1000 to about 5000 and being selected from the group consisting of acryloyloxy- and methacryloyloxy-terminated homopolymer of butadiene and copolymer of butadiene with acrylonitrile or styrene that contain at least about 70 weight percent of butadiene, said butadiene-containing resin having from about 1.5 to about 3.0 terminating acryloyloxyl or methacryloyloxyl groups per molecule of said butadiene-containing resin, (b) between about 150 and about 500 weight percent based on said butadiene-containing resin of one or more ethylenically unsaturated monomers each of which is copolymerizable with end vinyl groups of said terminating groups of said butadiene-containing resin and with at least one of said monomers containing halogen directly attached to aryl in an amount sufficient to provide from about 25 to about 70 weight percent based on said composition of said halogen attached to aryl, (c) between about 5 and about 20 weight percent based on said butadiene-containing resin of ethylenically unsaturated acid anhydride, and (d) between about 0.1 and 2.0 weight percent, based on the total weight of the resin composition of peroxide hardening agents or photosensitizers for promoting light hardening.

Claim 15

A flame retardant printed circuit board according to claim 12 which includes glass cloth impregnated with the thermosetting resin composition.

Claim 16

A flame retardant thermosetting resin composition essentially comprising: (a) a liquid butadiene-containing resin having an average molecular weight of about 1000 to about 5000 and being selected from the group consisting of acryloyloxy- and methacryloyloxy-terminated homopolymer of butadiene and copolymer of butadiene with acrylonitrile or styrene that contain at least about 70 weight percent of butadiene, said butadiene-containing resin having from about 1.5 to about 3.0 terminating acryloyloxyl or methacryloyloxyl groups per molecule of said butadiene-containing resin; (b) between about 150 and 500 weight percent based on said butadiene-containing resin of one or more ethylenically unsaturated monomers each of which is copolymerizable with the end vinyl groups of said terminating groups of said butadiene-containing resin and with at least one of said monomers containing halogen directly attached to aryl, each said monomer being selected from the group consisting of styrene, divinyl-benzene, methyl methacrylate, methyl acrylate, glycidyl methacrylate, ethylene dimethacrylate, monobromostyrene, dibromostyrene, tribromophenyl acrylate, tribromophenyl methacrylate, 2,2-bis-(4'-allyloyxy-3',5'-dibromophenyl) propane, monobromophenyl allyl ether, dibromophenyl allyl ether, tribromophenyl allyl ether, monochlorostyrene and dichlorostyrene; (c) between about 5 and 20 weight percent based on said butadiene-containing resin of ethylenically unsaturated acid anhydride selected from the group consisting of maleic acid anhydride, itanoic acid anhydride, dodecenyl succinic acid anhydride, methyl-endomethylene-tetrahydrophthalic acid anhydride, tetrahydrophthalic acid anhydride and methyl-tetrahydrophthalic acid anhydride, and (d) between about 0.1 and 2.0 weight percent, based on the total weight of the resin composition of peroxide hardening agents or photosensitizers for promoting light-hardening.

Claim 17

A flame retardant thermosetting resin composition essentially comprising: (a) a liquid butadiene-containing resin having an average molecular weight of about 1000 to about 5000 and being selected from the group consisting of acryloyloxy- and methacryloyloxy-terminated homopolymer of butadiene and copolymer of butadiene with acrylonitrile or styrene that contain at least about 70 weight percent of butadiene, said butadiene-containing resin having from about 1.5 to about 3.0 terminating acryloyloxyl or methacryloyloxyl groups per molecule of said butadiene-containing resin; (b) between about 150 and 500 weight percent based on said butadiene-containing resin of one or more ethylenically unsaturated monomers each of which is copolymerizable with the end vinyl groups of said terminating groups of said butadiene-containing resin and with at least one of said monomers containing halogen directly attached to aryl, each said monomer being selected from the group consisting of styrene, divinyl-benzene, methyl methacrylate, methyl acrylate, glycidyl methacrylate, ethylene dimethacrylate, monobromostyrene, dibromostyrene, tribromophenyl acrylate, tribromophenyl methacrylate, 2,2-bis-(4'-allyloyxy-3',5'-dibromophenyl) propane, monobromophenyl allyl ether, dibromophenyl allyl ether, tribromophenyl allyl ether, monochlorostyrene and dichlorostyrene; (c) between about 5 and 20 weight percent based on said butadiene-containing resin of ethylenically unsaturated acid anhydride selected from the group consisting of maleic acid anhydride, itanoic acid anhydride, dodecenyl succinic acid anhydride, methyl-endomethylene-tetrahydrophthalic acid anhydride, tetrahydrophthalic acid anhydride and methyl-tetrahydrophthalic acid anhydride, and (d) between about 0.1 and 2.0 weight percent, based on the total weight of the resin composition of peroxide hardening agents or photosensitizers for promoting light-hardening.

Claim 18

A flame retardant printed circuit board which includes an electrically conductive material and an electrically insulating thermosetting resin composition essentially comprising: (a) a liquid butadiene-containing resin having an average molecular weight of about 1000 to about 5000 and being selected from the group consisting of acryloyloxy- and methacryloyloxy-terminated homopolymer of butadiene and copolymer of butadiene with acrylonitrile or styrene that contain at least about 70 weight percent of butadiene, said butadiene-containing resin having from about 1.5 to about 3.0 terminating acryloyloxyl or methacryloyloxyl groups per molecule of said butadiene-containing resin; (b) between about 150 and 500 weight percent based on said butadiene-containing resin of one or more ethylenically unsaturated monomers each of which is copolymerizable with the end vinyl groups of said terminating groups of said butadiene-containing resin and with at least one of said monomers containing halogen directly attached to aryl in an amount sufficient to provide from about 25 to about 70 weight percent based on said composition of said halogen attached to aryl, each said monomer being selected from the group consisting of styrene, divinyl-benzene, methyl methacrylate, methyl acrylate, glycidyl methacrylate, ethylene dimethacrylate, monobromostyrene, dibromostyrene, tribromophenyl acrylate, tribromophenyl methacrylate, 2,2-bis-(4'-allyloxy-3',5'-dibromophenyl) propane, monobromophenyl allyl ether, dibromophenyl allyl ether, tribromophenyl allyl ether, monochlorostyrene and dichlorostyrene; (c) between about 5 and 20 weight percent based on said butadiene-containing resin of ethylenically unsaturated acid anhydride selected from the group consisting of maleic acid anhydride, itaconic acid anhydride, dodecenyl succinic acid anhydride, methyl-endomethylene-tetrahydrophthalic acid anhydride, tetrahydrophthalic acid anhydride and methyl-tetrahydrophthalic acid anhydride, and (d) between about 0.1 and 2.0 weight percent, based on the total weight of the resin composition of peroxide hardening agents or photosensitizers for promoting light-hardening.

Claim 19

A flame retardant printed circuit board which includes an electrically conductive material and an electrically insulating thermosetting resin composition essentially comprising: (a) a liquid butadiene-containing resin having an average molecular weight of about 1000 to about 5000 and being selected from the group consisting of acryloyloxy- and methacryloyloxy-terminated homopolymer of butadiene and copolymer of butadiene with acrylonitrile or styrene that contain at least about 70 weight percent of butadiene, said butadiene-containing resin having from about 1.5 to about 3.0 terminating acryloyloxyl or methacryloyloxyl groups per molecule of said butadiene-containing resin; (b) between about 150 and 500 weight percent based on said butadiene-containing resin of one or more ethylenically unsaturated monomers each of which is copolymerizable with the end vinyl groups of said terminating groups of said butadiene-containing resin and with at least one of said monomers containing halogen directly attached to aryl in an amount sufficient to provide from about 25 to about 70 weight percent based on said composition of said halogen attached to aryl, each said monomer being selected from the group consisting of styrene, divinyl-benzene, methyl methacrylate, methyl acrylate, glycidyl methacrylate, ethylene dimethacrylate, monobromostyrene, dibromostyrene, tribromophenyl acrylate, tribromophenyl methacrylate, 2,2-bis-(4'-allyloxy-3',5'-dibromophenyl) propane, monobromophenyl allyl ether, dibromophenyl allyl ether, tribromophenyl allyl ether, monochlorostyrene and dichlorostyrene; (c) between about 5 and 20 weight percent based on said butadiene-containing resin of ethylenically unsaturated acid anhydride selected from the group consisting of maleic acid anhydride, itaconic acid anhydride, dodecenyl succinic acid anhydride, methyl-endomethylene-tetrahydrophthalic acid anhydride, tetrahydrophthalic acid anhydride and methyl-tetrahydrophthalic acid anhydride, and (d) between about 0.1 and 2.0 weight percent, based on the total weight of the resin composition of peroxide hardening agents or photosensitizers for promoting light-hardening.