US4026412A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Electronic circuit carrier and test fixture
Assignee: Individual
•
Filing: 1974-09-26
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Granted: 1977-05-31
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Expires: 1994-09-26
Abstract
Abstract Hybrid microelectronic packages contain microelectronic components for the protection and connection thereof. For protection of the microelectronic packages during storage and shipment, they are positioned within a carrier which encloses the body of the package and restrains the package leads for complete protection. Preferably the carrier has electrical access to the leads so that testing of the package can take place when the completed package is protected within the carrier.
Inventors
- 👤 Richard D. Henson
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-24 06:09
CPC Classifications
H; H05; H05K; H05K7/00; H05K7/02; H05K7/10; H05K7/1015; H05K7/1023
Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
279 words
An electronic circuit carrier for carrying and protecting a microelectronic circuit in a package, where the microelectronic circuit package has a case for carrying a microelectronic circuit thereon, and has connector leads mounted on the case and insulated from the case and extending from the case, said microelectronic circuit package carrier comprising: a body made of electrically nonconductive material and having a top surface, a plurality of connector lead openings comprising a plurality of parallel slots formed in the top surface of said body and spaced for reception of the connector leads on a package so that the connector leads are retained in position and protected against bending resulting from physical striking of the connector leads; a recessed support surface formed in said top surface of said body, said support surface being of sufficient size to support and engage a microelectronic circuit package thereon and being positioned so that the microelectronic circuit package lies against said support surface when the microelectronic circuit package leads lie in said connector lead openings; a heat sink positioned in said body and serving as at least part of said support surface so that the microelectronic circuit package rests against said heat sink when its connector leads are positioned in said connector lead openings; transverse slots formed below the top surface of said body and transversely to said connector lead retaining slots; hold down bars positionable within said transverse slots for holding down connector leads in the bottom of said retaining slots; and a cover for engagement over the portion of said top surface occupied by a microelectronic circuit package so that both the package and its connector leads are protected against physical damage.
Claim 2
Dependent Claim
279 words
An electronic circuit carrier for carrying and protecting a microelectronic circuit in a package, where the microelectronic circuit package has a case for carrying a microelectronic circuit thereon, and has connector leads mounted on the case and insulated from the case and extending from the case, said microelectronic circuit package carrier comprising: a body made of electrically nonconductive material and having a top surface, a plurality of connector lead openings comprising a plurality of parallel slots formed in the top surface of said body and spaced for reception of the connector leads on a package so that the connector leads are retained in position and protected against bending resulting from physical striking of the connector leads; a recessed support surface formed in said top surface of said body, said support surface being of sufficient size to support and engage a microelectronic circuit package thereon and being positioned so that the microelectronic circuit package lies against said support surface when the microelectronic circuit package leads lie in said connector lead openings; a heat sink positioned in said body and serving as at least part of said support surface so that the microelectronic circuit package rests against said heat sink when its connector leads are positioned in said connector lead openings; transverse slots formed below the top surface of said body and transversely to said connector lead retaining slots; hold down bars positionable within said transverse slots for holding down connector leads in the bottom of said retaining slots; and a cover for engagement over the portion of said top surface occupied by a microelectronic circuit package so that both the package and its connector leads are protected against physical damage.
Claim 3
Dependent Claim
39 words
The electronic circuit carrier of claim 1 wherein: a conductor is positioned in the bottom of each said connector lead retaining slots, each of said conductors being connectable for testing of the microelectronic circuit package retained in said carrier.
Claim 4
Dependent Claim
52 words
The electronic circuit carrier of claim 2 wherein: said conductors are strips positioned in the bottom of said connector lead retaining slots and further including electrically conductive ways extending from said front to the back of said body so that test connection can be made to the back of said carrier body.
Claim 5
Dependent Claim
192 words
An electronic circuit carrier for carrying and protecting a microelectronic circuit in a package, where the microelectronic circuit package has a case for carrying a microelectronic circuit thereon, and has connector leads mounted on the case and insulated from the case and extending from the case, said microelectronic circuit package carrier comprising: a body having a top surface, a recess formed in said top surface of said body, said recess being of sufficient size to accept a microelectronic circuit package carrier; a plurality of connector lead openings in the form of parallel slots formed below the top surface of said body, said slots being spaced to receive the connector leads on a package so that the connector leads are protected against bending; transverse slots formed below the top surface of said body and transversely to said connector lead retaining slot, and hold-down bars positionable within said transverse slots for holding down connector leads in the bottom of said retaining slot; and a cover for engagement over the portion of said top surface occupied by a microelectronic circuit package so that both the package and its connector leads are protected against physical damage.
Claim 6
Dependent Claim
192 words
An electronic circuit carrier for carrying and protecting a microelectronic circuit in a package, where the microelectronic circuit package has a case for carrying a microelectronic circuit thereon, and has connector leads mounted on the case and insulated from the case and extending from the case, said microelectronic circuit package carrier comprising: a body having a top surface, a recess formed in said top surface of said body, said recess being of sufficient size to accept a microelectronic circuit package carrier; a plurality of connector lead openings in the form of parallel slots formed below the top surface of said body, said slots being spaced to receive the connector leads on a package so that the connector leads are protected against bending; transverse slots formed below the top surface of said body and transversely to said connector lead retaining slot, and hold-down bars positionable within said transverse slots for holding down connector leads in the bottom of said retaining slot; and a cover for engagement over the portion of said top surface occupied by a microelectronic circuit package so that both the package and its connector leads are protected against physical damage.
Claim 7
Dependent Claim
39 words
The electronic circuit carrier of claim 4 wherein: a conductor is positioned in the bottom of each said connector lead retaining slots, each of said conductors being connectable for testing of the microelectronic circuit package retained in said carrier.
Claim 8
Dependent Claim
52 words
The electronic circuit carrier of claim 5 wherein: said conductors are strips positioned in the bottom of said connector lead retaining slots and further including electrically conductive ways extending from said front to the back of said body so that test connection can be made to the back of said carrier body.
Claim 9
Dependent Claim
46 words
The electronic circuit carrier of claim 6 wherein: said body is made of electrically nonconductive material and a thermal heat sink is positioned in said body at the bottom of said recess so that a microelectronic circuit package in said carrier rests against said heat sink.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1980-05-30 | 1980-11-29 | 1981-05-31 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1984-05-30 | 1984-11-29 | 1985-05-31 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1988-05-30 | 1988-11-29 | 1989-05-31 | $7700.00 | Window Closed / Lapsed |