Process for treating copper alloys to improve thermal stability

Claim 2

A process for improving the thermal stability of copper base alloys having low stacking fault energy without significantly degrading tensile properties comprising: (a) providing a copper base alloy having a stacking fault energy of less than 30 ergs per square centimeter consisting essentially of a first element selected from the group consisting of about 2 to 12% by weight aluminum, about 2 to 6% by weight germanium, about 2 to 10% by weight gallium, about 3 to 12% by weight indium, about 1 to 5% by weight silicon, about 4 to 12% by weight tin, about 8 to 37% by weight zinc, balance copper; (b) cold working said alloy from about 10 to 97%, (c) heating said alloy without significantly degrading the tensile properties thereof to a first temperature of from about 100° to 300° C. for 15 minutes to 8 hours; (d) further heating said alloy without significantly degrading the tensile properties thereof to a second temperature of from about 200° to 360° C. for at least 1 minute, provided that said second temperature is higher than said first temperature; and (e) cooling said alloy to room temperature.

Claim 3

A process according to claim 1 including the following step subsequent to said cold working step (b) but prior to said heating step (c): (f) forming said alloy into a desired final article.

Claim 4

A process according to claim 2 including the following steps subsequent to said cold working step (b) but prior to said forming step (f): (g) heating said alloy without significantly degrading the tensile properties thereof; (h) further heating said alloy without significantly degrading the tensile properties thereof to a temperature of from about 200° to 360° C. for at least 1 minute, provided that said further heating is at a higher temperature than the heating of step (g).

Claim 5

A process according to claim 1 wherein said alloy includes at least one second element, different from said first element, said second element selected from the group consisting of about 0.001 to 10% by weight aluminum, about 0.001 to 4% by weight germanium, about 0.001 to 8% by weight gallium, about 0.001 to 10% by weight indium, about 0.001 to 4% by weight silicon, about 0.001 to 10% by weight tin, about 0.001 to 37% by weight zinc, about 0.001 to 25% by weight nickel, about 0.001 to 0.4% by weight phosphorus, about 0.001 to 5% by weight iron, about 0.001 to 5% by weight cobalt, about 0.001 to 5% by weight zirconium, about 0.001 to 10% by weight manganese and mixtures thereof.

Claim 6

A process according to claim 1 wherein said first element is selected from the group consisting of about 2 to 10% by weight aluminum, about 3 to 5% by weight germanium, about 3 to 8% by weight gallium, about 4 to 10% by weight indium, about 1.5 to 4% by weight silicon, about 4 to 10% by weight tin and about 15 to 37% by weight zinc.

Claim 7

A process according to claim 4 wherein said second element is selected from the group consisting of about 0.01 to 4% by weight aluminum, about 0.01 to 3% by weight germanium, about 0.01 to 7% by weight gallium, about 0.01 to 9% by weight indium, about 0.01 to 3.5% by weight silicon, about 0.01 to 8% by weight tin, about 0.01 to 35% by weight zinc, about 0.01 to 20% by weight nickel, about 0.01 to 0.35% by weight phosphorus, about 0.01 to 3.5% by weight iron, about 0.01 to 2% by weight cobalt, about 0.01 to 3.5% by weight zirconium and about 0.01 to 8.5% by weight manganese.

Claim 8

A process according to claim 1 wherein said alloy is cold worked from about 15 to 95%.

Claim 9

A process according to claim 1 wherein said heating step (d) is for at least 15 minutes.

Claim 10

A process for improving the thermal stability of copper base alloys having a low stacking fault energy without significantly degrading tensile properties comprising: (a) providing a copper base alloy having a stacking fault energy of less than 30 ergs per square centimeter consisting essentially of a first element selected from the group consisting of about 2 to 12% by weight aluminum, about 2 to 6% by weight germanium, about 2 to 10% by weight gallium, about 3 to 12% by weight indium, about 1 to 5% by weight silicon, about 4 to 12% by weight tin, about 8 to 37% by weight zinc, balance copper; (b) cold working said alloy from about 10 to 97%; (c) annealing said alloy for at least one minute at a temperature of from about 300° to 750° C. so as to recrystallize said alloy; (d) cold working said alloy from about 10 to 97%; (e) heating said alloy without significantly degrading the tensile properties thereof to a first temperature of from about 100° to 300° C. for 15 minutes to 8 hours; (f) further heating said alloy without significantly degrading the tensile properties thereof to a second temperature of from about 200° to 360° C. for at least one minute, provided that said second temperature is higher than said first temperature; and (g) cooling said alloy to room temperature.

Claim 11

A process for improving the thermal stability of copper base alloys having a low stacking fault energy without significantly degrading tensile properties comprising: (a) providing a copper base alloy having a stacking fault energy of less than 30 ergs per square centimeter consisting essentially of a first element selected from the group consisting of about 2 to 12% by weight aluminum, about 2 to 6% by weight germanium, about 2 to 10% by weight gallium, about 3 to 12% by weight indium, about 1 to 5% by weight silicon, about 4 to 12% by weight tin, about 8 to 37% by weight zinc, balance copper; (b) cold working said alloy from about 10 to 97%; (c) annealing said alloy for at least one minute at a temperature of from about 300° to 750° C. so as to recrystallize said alloy; (d) cold working said alloy from about 10 to 97%; (e) heating said alloy without significantly degrading the tensile properties thereof to a first temperature of from about 100° to 300° C. for 15 minutes to 8 hours; (f) further heating said alloy without significantly degrading the tensile properties thereof to a second temperature of from about 200° to 360° C. for at least one minute, provided that said second temperature is higher than said first temperature; and (g) cooling said alloy to room temperature.

Claim 12

A process according to claim 9 including the following step subsequent to said cold working step (d) but prior to said heating step (c): (h) forming said alloy into a desired final article.

Claim 13

A process according to claim 10 including the following step subsequent to said cold working step (d) but prior to said forming step (h): (i) heating said alloy without significantly degrading the tensile properties thereof to a first temperature of from about 100° to 300° C. for 15 minutes to 8 hours; (j) further heating said alloy without significantly degrading the tensile properties thereof to a second temperature of from about 200° to 360° C. for at least 1 minute, provided that said second temperature is higher than said first temperature.

Claim 14

A process according to claim 9 wherein said alloy includes at least one second element, different from said first element, said second element selected from the group consisting of about 0.001 to 10% by weight aluminum, about 0.001 to 4% by weight germanium, about 0.001 to 8% by weight gallium, about 0.001 to 10% by weight indium, about 0.001 to 4% by weight silicon, about 0.001 to 10% by weight tin, about 0.001 to 37% by weight zinc, about 0.001 to 25% by weight nickel, about 0.001 to 0.4% by weight phosphorus, about 0.001 to 5% by weight iron, about 0.001 to 5 by weight cobalt, about 0.001 to 5% by weight zirconium, about 0.001 to 10% by weight manganese and mixtures thereof.

Claim 15

A process according to claim 9 wherein said first element is selected from the group consisting of about 2 to 10% by weight aluminum, about 3 to 5% by weight germanium, about 3 to 8% by weight gallium, about 4 to 10% by weight indium, about 1.5 to 4% by weight silicon, about 4 to 10% by weight tin, and about 15 to 37% by weight zinc.

Claim 16

A process according to claim 12 wherein said second element is selected from the group consisting of about 0.01 to 4% by weight aluminum, about 0.01 to 3% by weight germanium, about 0.01 to 7% by weight gallium, about 0.01 to 9% by weight indium, about 0.01 to 3.5% by weight silicon, about 0.01 to 8% by weight tin, about 0.01 to 35% by weight zinc, about 0.01 to 20% by weight nickel, about 0.01 to 0.35% by weight phosphorus, about 0.01 to 3.5% by weight iron, about 0.01 to 2% by weight cobalt, about 0.01 to 3.5% by weight zirconium and about 0.01 to 8.5% by weight manganese.

Claim 17

A process according to claim 9 wherein said alloy is cold worked from about 15 to 95%.

Claim 18

A process according to claim 9 wherein said heating step (f) is for at least 15 minutes.

Claim 19

A process according to claim 11 wherein said heating steps (f) and (j) are for at least 15 minutes.

Claim 20

A process according to claim 9 wherein steps (b) and (c) are repeated at least once.

Claim 21

A process according to claim 11 wherein steps (b) and (c) are repeated at least once.