Interconnection for electrically connecting two vertically stacked electronic packages

Claim 2

An interconnecting device useful for connecting a first and second electronic package stacked vertically therein to a printed circuit board, which comprises: a. a housing of insulating material including a base and walls, said base having one or more support posts and a plurality of holes along each side thereof and the walls containing a plurality of vertical slots which are connected to the holes in the base by horizontal grooves, said housing further having pillars at each corner, said pillars having means thereon for supporting and retaining the first and second electronic packages which may be stacked in the housing in a spaced, overlying relation; b. a plurality of conductive spring members positioned in the housing, each spring member having an upper finger positioned in a slot, a base positioned in the horizontal groove and a pin extending through the hole and depending from the housing for connection to a printed circuit board, the top of the upper finger having an inwardly projecting nose comprising an upper contact point, said spring member further having a lower finger integral with the upper finger and having an inwardly projecting nose comprising a lower contact point, said upper and lower fingers being preloaded to bias the upper and lower contact points against conductive pads on the first and second electronic packages which may be positioned in the housing in overlying relation; and c. a cover removably positioned on the top of the housing.

Claim 3

The interconnecting device of claim 1 wherein the means for supporting and retaining two electronic packages in the housing include an inwardly projecting ledge on two diagonally opposing pillars, said ledge providing downwardly facing shoulders which overlie and restrain the first electronic package resting on the one or more support posts, and upwardly facing shoulders adapted to support the second electronic package.

Claim 4

The means of claim 2 further including inwardly projecting arms on the other two diagonally opposing pillars adapted to overlie and restrain the second electronic package.

Claim 5

The interconnecting device of claim 1 wherein the pillars on the housing are resiliently movable.

Claim 6

The interconnecting device of claim 1 wherein the lower finger includes a reverse loop thereby increasing the effective length of said finger.

Claim 7

The interconnecting device of claim 1 wherein alternate holes are displaced inwardly with respect to the adjacent holes with alternate pins on the spring members adapted to extend through the inwardly displaced holes.

Claim 8

An interconnector for electrically connecting two electronic packages having conductive pads on the sides thereof to a printed circuit board or the like, which comprises: a. a housing having a base with a plurality of holes located along each of the edges, and further having walls positioned about the perimeter of the base thereby defining a central upwardly opening cavity, said walls each having a plurality of vertical slots, and further said housing having support means for supporting and for retaining two electronic packages in a spaced-apart relation which may be vertically stacked in the cavity in the housing, said means including support posts extending upwardly from the base on which a first electronic package may rest and a first pair of vertical pillars extending upwardly from diagonal corners of the base, each having an inwardly projecting ledge with a downwardly facing shoulder adapted to overlie and retain the electronic package which may be resting on the posts and an upwardly facing shoulder on which another electronic package may rest; and b. a plurality of conductive spring members positioned in the plurality of slots in the walls with pins extending downwardly through the holes in the base, said pins being adapted to electrically engage conductive traces on a printed circuit board or the like, and further each of said spring members having two vertically extending, elongated fingers, one extending above the other, said fingers having on the surfaces facing the cavity, contact means for electrically engaging the conductive pads on the sides of the electronic packages which may be vertically stacked in the cavity in the housing, said fingers being preloaded to bias the contact means against the conductive pads.

Claim 9

An interconnector for electrically connecting two electronic packages having conductive pads on the sides thereof to a printed circuit board or the like, which comprises: a. a housing having a base with a plurality of holes located along each of the edges, and further having walls positioned about the perimeter of the base thereby defining a central upwardly opening cavity, said walls each having a plurality of vertical slots, and further said housing having support means for supporting and for retaining two electronic packages in a spaced-apart relation which may be vertically stacked in the cavity in the housing, said means including support posts extending upwardly from the base on which a first electronic package may rest and a first pair of vertical pillars extending upwardly from diagonal corners of the base, each having an inwardly projecting ledge with a downwardly facing shoulder adapted to overlie and retain the electronic package which may be resting on the posts and an upwardly facing shoulder on which another electronic package may rest; and b. a plurality of conductive spring members positioned in the plurality of slots in the walls with pins extending downwardly through the holes in the base, said pins being adapted to electrically engage conductive traces on a printed circuit board or the like, and further each of said spring members having two vertically extending, elongated fingers, one extending above the other, said fingers having on the surfaces facing the cavity, contact means for electrically engaging the conductive pads on the sides of the electronic packages which may be vertically stacked in the cavity in the housing, said fingers being preloaded to bias the contact means against the conductive pads.

Claim 10

The support means of claim 1 further including a second pair of vertical pillars extending upwardly from other diagonal corners of the base and each having an inwardly projecting arm thereon adapted to overlie and retain the electronic package which may be resting on the upwardly facing shoulders of the first pair of vertical pillars.

Claim 11

The means of claim 8 wherein the pillars may be resiliently deflected outwardly to permit the insertion of the electronic packages into the housing.